ZHCSUJ4B January   2022  – January 2024 TPS61376

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 VCC Power Supply
      2. 6.3.2 Enable and Programmable UVLO
      3. 6.3.3 Soft Start and Inrush Current Control During Start-Up
      4. 6.3.4 Switching Frequency
      5. 6.3.5 Adjustable input average Current Limit
      6. 6.3.6 Shut Down and Load Disconnect
      7. 6.3.7 Overvoltage Protection
      8. 6.3.8 Output Short Protection
      9. 6.3.9 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 PWM Mode
      2. 6.4.2 Auto PFM Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Setting Output Voltage
        2. 7.2.2.2 Inductor Selection
        3. 7.2.2.3 Bootstrap Capacitor Selection
        4. 7.2.2.4 Input Capacitor Selection
        5. 7.2.2.5 Output Capacitor Selection
        6. 7.2.2.6 Diode Selection
        7. 7.2.2.7 Loop Stability
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 第三方产品免责声明
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4.2.1 Thermal Considerations

The maximum IC junction temperature should be restricted to 125°C under normal operating conditions. Calculate the maximum allowable dissipation, PD(max), and keep the actual power dissipation less than or equal to PD(max). The maximum-power-dissipation limit is determined using Equation 20.

Equation 20. GUID-C8A64E3A-C2E6-4556-8EDF-4F4AA75ACF7B-low.gif

where

  • TA is the maximum ambient temperature for the application.
  • RθJA is the junction-to-ambient thermal resistance given in the Thermal Information table.

The TPS61376 comes in a thermally-enhanced VQFN package. The real junction-to-ambient thermal resistance of the package greatly depends on the PCB type, layout, and thermal pad connection. Using thick PCB copper and soldering the thermal pad to a large ground plate enhance the thermal performance. Using more vias connects the ground plate on the top layer and bottom layer around the IC without solder mask also improves the thermal capability.