As for all switching power supplies, especially those running at high switching frequency and high current, layout is an important design step. If the layout is not carefully done, the regulator can suffer from instability and noise problems. To maximize efficiency, switch rise and fall times are very fast. To prevent radiation of high-frequency noise (for example, EMI), proper layout of the high-frequency switching path is essential. Minimize the length and area of all traces connected to the SW pin, and always use a ground plane under the switching regulator to minimize interplane coupling.

The input capacitor needs to be close to the VIN pin and PGND pin in order to reduce the I_input supply ripple.

The power paths of SW, D1,output capacitor and PGND should be as small as possible, in order to reduce parasitic inductance.

The layout should also be done with well consideration of the thermal as this is a high power density device. The VP, SW, VOUT and PGND pins that improves the thermal capabilities of the package should be soldered with the large polygon, using thermal vias underneath the SW pin could improve thermal performance.