ZHCSLR2C August   2020  – March 2022 TPS61288

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable and Start-up
      2. 8.3.2 Undervoltage Lockout (UVLO)
      3. 8.3.3 Switching Peak Current Limit
      4. 8.3.4 Overvoltage Protection
      5. 8.3.5 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 PWM
      2. 8.4.2 PFM
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Setting Output Voltage
        2. 9.2.2.2 Inductor Selection
        3. 9.2.2.3 Input Capacitor Selection
        4. 9.2.2.4 Output Capacitor Selection
        5. 9.2.2.5 Loop Stability
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

Layout Guidelines

As for all switching power supplies, especially those running at high switching frequency and high currents, layout is an important design step. If layout is not carefully done, the regulator can suffer from instability and noise problems. To maximize efficiency, switch rise and fall times are very fast. To prevent radiation of high-frequency noise (for example, EMI), proper layout of the high-frequency switching path is essential. Minimize the length and area of all traces connected to the SW pin, and always use a ground plane under the switching regulator to minimize interplane coupling.

The input capacitor needs to be close to the VIN pin and GND pin in order to reduce the Iinput supply ripple.

The layout should also be done with well consideration of the thermal as this is a high power density device. The SW, VOUT, and PGND pins that improves the thermal capabilities of the package should be soldered with the large polygon, using thermal vias underneath the SW pin could improve thermal performance.