ZHCSS95B march   2022  – may 2023 TPS389006-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Device Comparison
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 I2C
      2. 8.3.2 Auto Mask (AMSK)
      3. 8.3.3 PEC
      4. 8.3.4 VDD
      5. 8.3.5 MON
      6. 8.3.6 NIRQ
      7. 8.3.7 ADC
      8. 8.3.8 Time Stamp
    4. 8.4 Device Functional Modes
      1. 8.4.1 Built-In Self Test and Configuration Load
        1. 8.4.1.1 Notes on BIST Execution
      2. 8.4.2 TPS389006-Q1 Power ON
      3. 8.4.3 General Monitoring
        1. 8.4.3.1 IDLE Monitoring
        2. 8.4.3.2 ACTIVE Monitoring
        3. 8.4.3.3 Sequence Monitoring 1
          1. 8.4.3.3.1 ACT Transitions 0→1
          2. 8.4.3.3.2 SLEEP Transition 1→0
          3. 8.4.3.3.3 SLEEP Transition 0→1
        4. 8.4.3.4 Sequence Monitoring 2
          1. 8.4.3.4.1 ACT Transition 1→0
    5. 8.5 Register Maps
      1. 8.5.1 BANK0 Registers
      2. 8.5.2 BANK1 Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Automotive Multichannel Sequencer and Monitor
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
  11. 10Power Supply Recommendations
    1. 10.1 Power Supply Guidelines
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Documentation Support
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Mechanical, Packaging, and Orderable Information

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Layout Guidelines

  • Place the external components as close to the device as possible. This configuration prevents parasitic errors from occurring.
  • Avoid using long traces for the VDD supply node. The VDD capacitor, along with parasitic inductance from the supply to the capacitor, can form an LC circuit and create ringing with peak voltages above the maximum VDD voltage.
  • Avoid using long traces of voltage to the MON pin. Long traces increase parasitic inductance and cause inaccurate monitoring and diagnostics.
  • If differential voltage sensing is required for MON1 and/or MON2, route RS_1/2 pin to the point of measurement
  • Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible, and only make perpendicular crossings when absolutely necessary.