ZHCSF29E May   2016  – January 2021 TPS25940-Q1

PRODMIX  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parametric Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Enable and Adjusting Undervoltage Lockout
      2. 9.3.2 Overvoltage Protection (OVP)
      3. 9.3.3 Hot Plug-In and In-Rush Current Control
      4. 9.3.4 Overload and Short Circuit Protection
        1. 9.3.4.1 Overload Protection
        2. 9.3.4.2 Short Circuit Protection
        3. 9.3.4.3 Start-Up with Short on Output
        4. 9.3.4.4 Constant Current Limit Behavior During Overcurrent Faults
      5. 9.3.5 FAULT Response
      6. 9.3.6 Current Monitoring
      7. 9.3.7 Power Good Comparator
      8. 9.3.8 IN, OUT and GND Pins
      9. 9.3.9 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 DevSleep Mode
      2. 9.4.2 Shutdown Control
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Step by Step Design Procedure
        2. 10.2.2.2 Programming the Current-Limit Threshold: R(ILIM) Selection
        3. 10.2.2.3 Undervoltage Lockout and Overvoltage Set Point
        4. 10.2.2.4 Programming Current Monitoring Resistor—RIMON
        5. 10.2.2.5 Setting Output Voltage Ramp Time (tdVdT)
          1. 10.2.2.5.1 Case1: Start-Up Without Load: Only Output Capacitance C(OUT) Draws Current During Start-Up
          2. 10.2.2.5.2 Case 2: Start-Up With Load: Output Capacitance C(OUT) and Load Draws Current During Start-Up
        6. 10.2.2.6 Programing the Power Good Set Point
        7. 10.2.2.7 Support Component Selections—R6, R7 and CIN
      3. 10.2.3 Application Curves
      4. 10.2.4 System Examples
        1. 10.2.4.1 VBUS Short-to-Battery, Short-to-Ground Protection of USB Port in Automotive Systems
        2. 10.2.4.2 Power Failure Protection for Holdup Power
        3. 10.2.4.3 Overload Detection Using TPS25940xx-Q1
  11. 11Power Supply Recommendations
    1. 11.1 Transient Protection
    2. 11.2 Output Short-Circuit Measurements
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 支持资源
    3. 13.3 Trademarks
    4. 13.4 静电放电警告
    5. 13.5 术语表
  14. 14Mechanical, Packaging, and Orderable Information

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9.3.3 Hot Plug-In and In-Rush Current Control

The device is designed to control the in-rush current upon insertion of a card into a live backplane or other "hot" power source. This limits the voltage sag on the backplane’s supply voltage and prevents unintended resets of the system power. A slew rate controlled startup (dVdT) also helps to eliminate conductive and radiative interferences. An external capacitor connected from the dVdT pin to GND defines the slew rate of the output voltage at power-on (as shown in Figure 9-2). Equation governing slew rate at start-up is shown in Equation 1.

GUID-0F6DA8C6-F1DB-488E-8247-5D615B9CAF6E-low.gifFigure 9-2 Output Ramp Up Time tdVdT is Set by C(dVdT)
Equation 1. GUID-41DE1F86-3834-40EB-ACB4-7BAD4046DB29-low.gif

where

  • I(dVdT) = 1 µA (typical)
  • GUID-A2A3B660-F263-4029-8D71-52AE19B59824-low.gif = Desired output slew rate
  • GAIN(dVdT) = dVdT to OUT gain = 12

The total ramp time (tdVdT) of V(OUT) for 0 to V(IN) can be calculated using Equation 2.

Equation 2. tdVdT = 8.3 x 104 x V(IN) x C(dVdT)

The inrush current, I(INRUSH) can be calculated as shown in Equation 3.

Equation 3. I(INRUSH) = C(OUT) x V(IN) / tdVdT.

The dVdT pin can be left floating to obtain a predetermined slew rate (tdVdT) on the output. When terminal is left floating, the device sets an internal ramp rate of 30 V/ms for output (V(OUT)) ramp.

Figure 10-7 and Figure 10-8 illustrate the inrush current control behavior of the device. For systems where load is present during start-up, the current never exceeds the overcurrent limit set by R(ILIM) resistor for the application. For defining appropriate charging time-rate under different load conditions, see the Setting Output Voltage Ramp Time (TdVdT) section.