ZHCS894U April   2001  – July 2019 TMS320F2810 , TMS320F2811 , TMS320F2812

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Commercial
    3. 5.3  ESD Ratings – Automotive
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Consumption Summary
      1. Table 5-1 TMS320F281x Current Consumption by Power-Supply Pins Over Recommended Operating Conditions During Low-Power Modes at 150-MHz SYSCLKOUT
      2. 5.5.1     Current Consumption Graphs
      3. 5.5.2     Reducing Current Consumption
    6. 5.6  Electrical Characteristics
    7. 5.7  Thermal Resistance Characteristics for 179-Ball ZHH Package
    8. 5.8  Thermal Resistance Characteristics for 179-Ball GHH Package
    9. 5.9  Thermal Resistance Characteristics for 176-Pin PGF Package
    10. 5.10 Thermal Resistance Characteristics for 128-Pin PBK Package
    11. 5.11 Thermal Design Considerations
    12. 5.12 Timing and Switching Characteristics
      1. 5.12.1 Timing Parameter Symbology
        1. 5.12.1.1 General Notes on Timing Parameters
        2. 5.12.1.2 Test Load Circuit
        3. 5.12.1.3 Signal Transition Levels
      2. 5.12.2 Power Supply Sequencing
      3. 5.12.3 Reset Timing
        1. Table 5-3 Reset (XRS) Timing Requirements
      4. 5.12.4 Clock Specifications
        1. 5.12.4.1 Device Clock Table
          1. Table 5-4 Clock Table and Nomenclature
        2. 5.12.4.2 Clock Requirements and Characteristics
          1. 5.12.4.2.1 Input Clock Requirements
            1. Table 5-5 Input Clock Frequency
            2. Table 5-6 XCLKIN Timing Requirements – PLL Bypassed or Enabled
            3. Table 5-7 XCLKIN Timing Requirements – PLL Disabled
          2. 5.12.4.2.2 Output Clock Characteristics
            1. Table 5-9 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
      5. 5.12.5 Peripherals
        1. 5.12.5.1  General-Purpose Input/Output (GPIO) – Output Timing
          1. Table 5-10 General-Purpose Output Switching Characteristics
        2. 5.12.5.2  General-Purpose Input/Output (GPIO) – Input Timing
          1. Table 5-11 General-Purpose Input Timing Requirements
        3. 5.12.5.3  Event Manager Interface
          1. 5.12.5.3.1 PWM Timing
            1. Table 5-12 PWM Switching Characteristics
            2. Table 5-13 Timer and Capture Unit Timing Requirements
            3. Table 5-14 External ADC Start-of-Conversion – EVA – Switching Characteristics
            4. Table 5-15 External ADC Start-of-Conversion – EVB – Switching Characteristics
        4. 5.12.5.4  Low-Power Mode Wakeup Timing
          1. Table 5-16 IDLE Mode Timing Requirements
          2. Table 5-17 IDLE Mode Switching Characteristics
          3. Table 5-18 STANDBY Mode Timing Requirements
          4. Table 5-19 STANDBY Mode Switching Characteristics
          5. Table 5-20 HALT Mode Timing Requirements
          6. Table 5-21 HALT Mode Switching Characteristics
        5. 5.12.5.5  Serial Peripheral Interface (SPI) Master Mode Timing
          1. Table 5-22 SPI Master Mode External Timing (Clock Phase = 0)
          2. Table 5-23 SPI Master Mode External Timing (Clock Phase = 1)
        6. 5.12.5.6  Serial Peripheral Interface (SPI) Slave Mode Timing
          1. Table 5-24 SPI Slave Mode External Timing (Clock Phase = 0)
          2. Table 5-25 SPI Slave Mode External Timing (Clock Phase = 1)
        7. 5.12.5.7  External Interface (XINTF) Timing
          1. 5.12.5.7.1 USEREADY = 0
          2. 5.12.5.7.2 Synchronous Mode (USEREADY = 1, READYMODE = 0)
          3. 5.12.5.7.3 Asynchronous Mode (USEREADY = 1, READYMODE = 1)
        8. 5.12.5.8  XINTF Signal Alignment to XCLKOUT
        9. 5.12.5.9  External Interface Read Timing
          1. Table 5-28 External Memory Interface Read Switching Characteristics
          2. Table 5-29 External Memory Interface Read Timing Requirements
        10. 5.12.5.10 External Interface Write Timing
          1. Table 5-30 External Memory Interface Write Switching Characteristics
        11. 5.12.5.11 External Interface Ready-on-Read Timing With One External Wait State
          1. Table 5-31 External Memory Interface Read Switching Characteristics (Ready-on-Read, 1 Wait State)
          2. Table 5-32 External Memory Interface Read Timing Requirements (Ready-on-Read, 1 Wait State)
          3. Table 5-33 Synchronous XREADY Timing Requirements (Ready-on-Read, 1 Wait State)
          4. Table 5-34 Asynchronous XREADY Timing Requirements (Ready-on-Read, 1 Wait State)
        12. 5.12.5.12 External Interface Ready-on-Write Timing With One External Wait State
          1. Table 5-35 External Memory Interface Write Switching Characteristics (Ready-on-Write, 1 Wait State)
          2. Table 5-36 Synchronous XREADY Timing Requirements (Ready-on-Write, 1 Wait State)
          3. Table 5-37 Asynchronous XREADY Timing Requirements (Ready-on-Write, 1 Wait State)
        13. 5.12.5.13 XHOLD and XHOLDA
        14. 5.12.5.14 XHOLD/XHOLDA Timing
          1. Table 5-38 XHOLD/XHOLDA Timing Requirements (XCLKOUT = XTIMCLK)
          2. Table 5-39 XHOLD/XHOLDA Timing Requirements (XCLKOUT = 1/2 XTIMCLK)
        15. 5.12.5.15 On-Chip Analog-to-Digital Converter
          1. Table 5-40  ADC Absolute Maximum Ratings Over Recommended Operating Conditions (Unless Otherwise Noted)
          2. Table 5-41  ADC Electrical Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted)—AC Specifications
          3. Table 5-42  ADC Electrical Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted)—DC Specifications
          4. 5.12.5.15.1 Current Consumption for Different ADC Configurations
            1. Table 5-43 Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK)
          5. 5.12.5.15.2 ADC Power-Up Control Bit Timing
            1. Table 5-44 ADC Power-Up Delays
          6. 5.12.5.15.3 Detailed Description
            1. 5.12.5.15.3.1 Reference Voltage
            2. 5.12.5.15.3.2 Analog Inputs
            3. 5.12.5.15.3.3 Converter
            4. 5.12.5.15.3.4 Conversion Modes
          7. 5.12.5.15.4 Sequential Sampling Mode (Single-Channel) (SMODE = 0)
            1. Table 5-45 Sequential Sampling Mode Timing
          8. 5.12.5.15.5 Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
            1. Table 5-46 Simultaneous Sampling Mode Timing
          9. 5.12.5.15.6 Definitions of Specifications and Terminology
        16. 5.12.5.16 Multichannel Buffered Serial Port (McBSP) Timing
          1. 5.12.5.16.1 McBSP Transmit and Receive Timing
            1. Table 5-47 McBSP Timing Requirements
            2. Table 5-48 McBSP Switching Characteristics
          2. 5.12.5.16.2 McBSP as SPI Master or Slave Timing
            1. Table 5-49 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)
            2. Table 5-50 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)
            3. Table 5-51 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)
            4. Table 5-52 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)
            5. Table 5-53 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)
            6. Table 5-54 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)
            7. Table 5-55 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)
            8. Table 5-56 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)
      6. 5.12.6 Emulator Connection Without Signal Buffering for the DSP
      7. 5.12.7 Interrupt Timing
        1. Table 5-57 Interrupt Switching Characteristics
        2. Table 5-58 Interrupt Timing Requirements
      8. 5.12.8 Flash Timing
        1. Table 5-59 Flash Endurance for A and S Temperature Material
        2. Table 5-60 Flash Endurance for Q Temperature Material
        3. Table 5-61 Flash Parameters at 150-MHz SYSCLKOUT
        4. Table 5-62 Flash/OTP Access Timing
        5. Table 5-63 Flash Data Retention Duration
  6. 6Detailed Description
    1. 6.1  Brief Descriptions
      1. 6.1.1  C28x CPU
      2. 6.1.2  Memory Bus (Harvard Bus Architecture)
      3. 6.1.3  Peripheral Bus
      4. 6.1.4  Real-Time JTAG and Analysis
      5. 6.1.5  External Interface (XINTF) (F2812 Only)
      6. 6.1.6  Flash
      7. 6.1.7  M0, M1 SARAMs
      8. 6.1.8  L0, L1, H0 SARAMs
      9. 6.1.9  Boot ROM
      10. 6.1.10 Security
      11. 6.1.11 Peripheral Interrupt Expansion (PIE) Block
      12. 6.1.12 External Interrupts (XINT1, XINT2, XINT13, XNMI)
      13. 6.1.13 Oscillator and PLL
      14. 6.1.14 Watchdog
      15. 6.1.15 Peripheral Clocking
      16. 6.1.16 Low-Power Modes
      17. 6.1.17 Peripheral Frames 0, 1, 2 (PFn)
      18. 6.1.18 General-Purpose Input/Output (GPIO) Multiplexer
      19. 6.1.19 32-Bit CPU-Timers (0, 1, 2)
      20. 6.1.20 Control Peripherals
      21. 6.1.21 Serial Port Peripherals
    2. 6.2  Peripherals
      1. 6.2.1 32-Bit CPU-Timers 0/1/2
      2. 6.2.2 Event Manager Modules (EVA, EVB)
        1. 6.2.2.1 General-Purpose (GP) Timers
        2. 6.2.2.2 Full-Compare Units
        3. 6.2.2.3 Programmable Deadband Generator
        4. 6.2.2.4 PWM Waveform Generation
        5. 6.2.2.5 Double Update PWM Mode
        6. 6.2.2.6 PWM Characteristics
        7. 6.2.2.7 Capture Unit
        8. 6.2.2.8 Quadrature-Encoder Pulse (QEP) Circuit
        9. 6.2.2.9 External ADC Start-of-Conversion
      3. 6.2.3 Enhanced Analog-to-Digital Converter (ADC) Module
      4. 6.2.4 Enhanced Controller Area Network (eCAN) Module
      5. 6.2.5 Multichannel Buffered Serial Port (McBSP) Module
      6. 6.2.6 Serial Communications Interface (SCI) Module
      7. 6.2.7 Serial Peripheral Interface (SPI) Module
      8. 6.2.8 GPIO MUX
    3. 6.3  Memory Maps
    4. 6.4  Register Map
    5. 6.5  Device Emulation Registers
    6. 6.6  External Interface, XINTF (F2812 Only)
      1. 6.6.1 Timing Registers
      2. 6.6.2 XREVISION Register
    7. 6.7  Interrupts
      1. 6.7.1 External Interrupts
    8. 6.8  System Control
    9. 6.9  OSC and PLL Block
      1. 6.9.1 Loss of Input Clock
    10. 6.10 PLL-Based Clock Module
    11. 6.11 External Reference Oscillator Clock Option
    12. 6.12 Watchdog Block
    13. 6.13 Low-Power Modes Block
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Reference Design
  8. 8器件和文档支持
    1. 8.1 入门
    2. 8.2 器件和开发支持工具命名规则
    3. 8.3 工具与软件
    4. 8.4 文档支持
    5. 8.5 相关链接
    6. 8.6 Community Resources
    7. 8.7 商标
    8. 8.8 静电放电警告
    9. 8.9 Glossary
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PBK|128
散热焊盘机械数据 (封装 | 引脚)
订购信息

2 修订历史记录

Changes from May 31, 2012 to July 12, 2019 (from T Revision (May 2012) to U Revision)

  • 全局：删除了 ROM 器件（TMS320C2810、TMS320C2811 和 TMS320C2812）删除了 C281x/ROM 数据。Go
  • 全局：文档结构已经过重新编排Go
  • 全局：将“Q100”更改为“AEC-Q100”Go
  • Section 1.1 （特性）：更新了“时钟和系统控制”特性Go
  • Section 1.1将“[通过 Q100 认证]”更改为“（通过针对汽车应用的 AEC-Q100 认证）”Go
  • Section 1.2 （应用：添加了该部分。Go
  • Section 1.3 （说明）：添加了器件信息表Go
  • Section 1.4 （功能方框图）：添加了章节标题Go
  • Figure 1-1 （功能方框图）：删除了 ROM。更新了脚注Go
  • Section 3 (Device Comparison): Changed section title from "Device Summary" to "Device Comparison". Go
  • Table 3-1 (Device Comparison): Changed table title from "Hardware Features" to "Device Comparison".Go
  • Table 3-1: Removed C2810, C2811, and C2812 data.Go
  • Table 3-1: Removed "Product Status" row and its associated footnote. Go
  • Section 3.1 (Related Products): Added section.Go
  • Section 4 (Terminal Configuration and Functions): Changed section title from "Introduction" to "Terminal Configuration and Functions".Go
  • Section 4.1 (Pin Diagrams): Changed section title from "Pin Assignments" to "Pin Diagrams".Go
  • Table 4-1 (Signal Descriptions): Updated DESCRIPTION of XRS.Go
  • Table 4-1: Removed C281x/ROM data from DESCRIPTION of TEST1, TEST2, and VDD3VFL.Go
  • Section 5 (Specifications): Changed section title from "Electrical Specifications" to "Specifications". Go
  • Section 5.1 (Absolute Maximum Ratings): Updated "Long-term high-temperature storage ..." footnote. Go
  • Section 5.2 (ESD Ratings – Commercial): Added section. Go
  • Section 5.3 (ESD Ratings – Automotive): Added section. Go
  • Section 5.5 (Power Consumption Summary): Changed section title from "Current Consumption" to "Power Consumption Summary". Go
  • Table 5-2 (Typical Current Consumption by Various Peripherals (at 150 MHz)): Added footnote about achieving power savings. Go
  • Section 5.6 (Electrical Characteristics): Removed IIL for C281x devices. Go
  • Section 5.7 (Thermal Resistance Characteristics for 179-Ball ZHH Package): Added section. Go
  • Section 5.8 (Thermal Resistance Characteristics for 179-Ball GHH): Added section. Go
  • Section 5.9 (Thermal Resistance Characteristics for 176-Pin PGF Package): Added section. Go
  • Section 5.10 (Thermal Resistance Characteristics for 128-Pin PBK Package): Added section. Go
  • Section 5.11 (Thermal Design Considerations): Added section. Go
  • Section 5.12.2 (Power Supply Sequencing): Changed section title from "Power Sequencing Requirements" to "Power Supply Sequencing". Updated section. Removed "Recommended “Low-Dropout Regulators”" table. Removed C281x data.Go
  • Section 5.12.4 (Clock Specifications): Added section title. Go
  • Section 5.12.5 (Peripherals): Added section title. Go
  • Figure 5-14 (General-Purpose Input Timing): Replaced "XCLKOUT" with "SYSCLK".Go
  • Section 5.12.5.5 (Serial Peripheral Interface (SPI) Master Mode Timing): Updated section. Go
  • Section 5.12.5.6 (Serial Peripheral Interface (SPI) Slave Mode Timing): Updated section. Go
  • Section 5.12.5.7.2 (Synchronous Mode (USEREADY = 1, READYMODE = 0)): Updated "XTIMING register configuration restrictions" table by changing XRDACTIVE value from "≥ 1" to "≥ 2" and XWRACTIVE value from "≥ 1" to "≥ 2".Go
  • Section 5.12.5.7.2 (Synchronous Mode (USEREADY = 1, READYMODE = 0)): Updated "Examples of valid and invalid timing" table by changing Valid XRDACTIVE value from "1" to "2" and Valid XWRACTIVE value from "1" to "2".Go
  • Section 5.12.5.7.3 (Asynchronous Mode (USEREADY = 1, READYMODE = 1)): Updated second "XTIMING register configuration restrictions" table by changing XRDACTIVE value from "≥ 1" to "≥ 2" and XWRACTIVE value from "≥ 1" to "≥ 2".Go
  • Section 5.12.5.7.3 (Asynchronous Mode (USEREADY = 1, READYMODE = 1)): Updated "Examples of valid and invalid timing" table by changing Valid XRDACTIVE value from "1" to "2" and Valid XWRACTIVE value from "1" to "2".Go
  • Table 5-40 (ADC Absolute Maximum Ratings Over Recommended Operating Conditions (Unless Otherwise Noted)): Updated table. Go
  • Table 5-41 (ADC Electrical Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted)—AC Specifications): Changed table title from "AC Specifications" to "ADC Electrical Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted)—AC Specifications". Go
  • Table 5-42 (ADC Electrical Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted)—DC Specifications): Changed table title from "DC Specifications" to "ADC Electrical Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted)—DC Specifications". Go
  • Table 5-42: Removed C281x data. Go
  • Table 5-49 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)): Updated footnotes. Go
  • Table 5-50 (McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)): Updated footnote. Go
  • Table 5-51 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)): Updated footnotes. Go
  • Table 5-52 (McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)): Updated footnote. Go
  • Table 5-53 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)): Updated footnotes. Go
  • Table 5-54 (McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)): Updated footnote. Go
  • Table 5-55 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)): Updated footnotes. Go
  • Table 5-56 (McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)): Updated footnote. Go
  • Table 5-61 (Flash Parameters at 150-MHz SYSCLKOUT): Updated "Typical parameters as seen at room temperature ..." footnote. Go
  • Table 5-63 (Flash Data Retention Duration): Added table. Go
  • Section 6 (Detailed Description): Changed section title from "Functional Overview" to "Detailed Description".Go
  • Section 6.1.21 (Serial Port Peripherals): Updated description of eCAN. Go
  • Section 6.2.3 (Enhanced Analog-to-Digital Converter (ADC) Module): Updated equations by which the digital value of the input analog voltage is derived. Go
  • Section 6.2.4 (Enhanced Controller Area Network (eCAN) Module): Updated feature about CAN 2.0B. Go
  • Section 6.2.7 (Serial Peripheral Interface (SPI) Module): Updated "Rising edge with phase delay" clocking scheme.Go
  • Figure 6-22 (Watchdog Module): Updated figure. Go
  • Section 7 (Applications, Implementation, and Layout): Added section.Go
  • Section 8 （器件和文档支持）：将标题从“开发支持”更改为“器件和文档支持”Go
  • Section 8.1（入门）：更新了该部分Go
  • Figure 8-1 （TMS320F281x 器件命名规则）：更新了 Q 温度范围的 说明Go
  • Section 8.3 （工具和软件）：添加了此部分Go
  • Section 8.4 （文档支持）：更新了该部分Go
  • Section 8.5 （相关链接）：添加了该部分Go
  • Section 9 （机械、封装和可订购信息）：将“机械数据”部分替换为“机械、封装和可订购信息”部分Go