SPRS565D April 2009 – June 2014 TMS320C6743
PRODUCTION DATA.
请参考 PDF 数据表获取器件具体的封装图。
In general, for proper thermal performance, the thermal pad under the package body should be as large as possible. However, the soldermask opening for the PowerPAD™ should be sized to match the pad size on the 176-pin PTP package; as illustrated in Figure 8-2.