ZHCS020J January   2011  – March 2021 OPA2835 , OPA835

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparision Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA835
    5. 7.5 Thermal Information: OPA2835
    6. 7.6 Electrical Characteristics: VS = 2.7 V
    7. 7.7 Electrical Characteristics: VS = 5 V
    8. 7.8 Typical Characteristics: VS = 2.7 V
    9. 7.9 Typical Characteristics: VS = 5 V
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Common-Mode Voltage Range
      2. 8.3.2 Output Voltage Range
      3. 8.3.3 Power-Down Operation
      4. 8.3.4 Low-Power Applications and the Effects of Resistor Values on Bandwidth
      5. 8.3.5 Driving Capacitive Loads
    4. 8.4 Device Functional Modes
      1. 8.4.1 Split-Supply Operation (±1.25 V to ±2.75 V)
      2. 8.4.2 Single-Supply Operation (2.5 V to 5.5 V)
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1  Noninverting Amplifier
      2. 9.1.2  Inverting Amplifier
      3. 9.1.3  Instrumentation Amplifier
      4. 9.1.4  Attenuators
      5. 9.1.5  Single-Ended to Differential Amplifier
      6. 9.1.6  Differential to Single-Ended Amplifier
      7. 9.1.7  Differential-to-Differential Amplifier
      8. 9.1.8  Gain Setting With OPA835 RUN Integrated Resistors
      9. 9.1.9  Pulse Application With Single-Supply
      10. 9.1.10 ADC Driver Performance
    2. 9.2 Typical Application
      1. 9.2.1 Audio Frequency Performance
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Active Filters
        1. 9.2.2.1 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 支持资源
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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Layout Guidelines

The OPA835 EVM (SLOU314) can be used as a reference when designing the circuit board. TI recommends following the EVM layout of the external components near to the amplifier, ground plane construction, and power routing as closely as possible. General guidelines are listed below:

  1. Signal routing must be direct and as short as possible into an out of the op amp.
  2. The feedback path must be short and direct avoiding vias if possible, especially with G = +1.
  3. Ground or power planes must be removed from directly under the negative input and output pins of the amplifier.
  4. TI recommends placing a series output resistor as close to the output pin as possible. See Figure 7-41 for recommended values for the expected capacitive load.
  5. A 2.2-µF power-supply decoupling capacitor must be placed within two inches of the device and can be shared with other op amps. For split supply, a capacitor is required for both supplies.
  6. A 0.1-µF power-supply decoupling capacitor must be placed as close to the supply pins as possible, preferably within 0.1 inch. For split supply, a capacitor is required for both supplies.
  7. The PD pin uses TTL logic levels. If the pin is not used, it must tied to the positive supply to enable the amplifier. If the pin is used, it must be actively driven. A bypass capacitor is not necessary, but is used for robustness in noisy environments.