ZHCSI27C April   2018  – October 2021 LM5036

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High-Voltage Start-Up Regulator
      2. 7.3.2  Undervoltage Lockout (UVLO)
      3. 7.3.3  Reference Regulator
      4. 7.3.4  Oscillator, Synchronized Input
      5. 7.3.5  Voltage-Mode Control
      6. 7.3.6  Primary-Side Gate Driver Outputs (LSG and HSG)
      7. 7.3.7  Half-Bridge PWM Scheme
      8. 7.3.8  Maximum Duty Cycle Operation
      9. 7.3.9  Pre-Biased Start-Up Process
        1. 7.3.9.1 Primary FETs Soft-Start Process
        2. 7.3.9.2 Synchronous Rectifier (SR) Soft-Start Process
      10. 7.3.10 Zero Duty Cycle Operation
      11. 7.3.11 Enhanced Cycle-by-Cycle Current Limiting with Pulse Matching
      12. 7.3.12 Reverse Current Protection
      13. 7.3.13 CBC Threshold Accuracy
      14. 7.3.14 Hiccup Mode Protection
      15. 7.3.15 Hiccup Mode Blanking
      16. 7.3.16 Over-Temperature Protection (OTP)
      17. 7.3.17 Over-Voltage / Latch (ON_OFF Pin)
      18. 7.3.18 Auxiliary Constant On-Time Control
      19. 7.3.19 Auxiliary On-Time Generator
      20. 7.3.20 Auxiliary Supply Current Limiting
      21. 7.3.21 Auxiliary Primary Output Capacitor Ripple
      22. 7.3.22 Auxiliary Ripple Configuration and Control
      23. 7.3.23 Asynchronous Mode Operation of Auxiliary Supply
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Input Transient Protection
        3. 8.2.2.3  Level-Shift Detection Circuit
        4. 8.2.2.4  Applications with VIN > 100-V
        5. 8.2.2.5  Applications without Pre-Biased Start-Up Requirement
        6. 8.2.2.6  UVLO Voltage Divider Selection
        7. 8.2.2.7  Over Voltage, Latch (ON_OFF Pin) Voltage Divider Selection
        8. 8.2.2.8  SS Capacitor
        9. 8.2.2.9  SSSR Capacitor
        10. 8.2.2.10 Half-Bridge Power Stage Design
        11. 8.2.2.11 Current Limit
        12. 8.2.2.12 Auxiliary Transformer
        13. 8.2.2.13 Auxiliary Feedback Resistors
        14. 8.2.2.14 RON Resistor
        15. 8.2.2.15 VIN Pin Capacitor
        16. 8.2.2.16 Auxiliary Primary Output Capacitor
        17. 8.2.2.17 Auxiliary Secondary Output Capacitor
        18. 8.2.2.18 Auxiliary Feedback Ripple Circuit
        19. 8.2.2.19 Auxiliary Secondary Diode
        20. 8.2.2.20 VCC Diode
        21. 8.2.2.21 Opto-Coupler Interface
        22. 8.2.2.22 Full-Bridge Converter Applications
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
        1. 11.2.1.1 Receiving Notification of Documentation Updates
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

10.1 Layout Guidelines

  • The two ground planes (AGND and PGND) of LM5036 device should be tied together with a short and direct connection to avoid jitter due to relative ground bounce. The connection point could be at the negative terminal of the input power supply.
  • The VIN, VCC, REF pin capacitors, and CS_NEG resistor should be tied to PGND plane. UVLO, ON_OFF, RT, RON, RD1 and RD2 resistors, RAMP, RES, SS and SSSR capacitors, and the thermal pad should all be tied to AGND plane.
  • SW and SW_AUX are switching nodes which switch rapidly between VIN and GND every cycle which are sources of high dv/dt noise. Therefore, large SW/SW_AUX node area should be avoided.
  • The differential current sense signals at CS_POS and CS_NEG pins should be routed in parallel and close to each other to minimize the common-mode noise.
  • The area of the loop formed by the main feedback control signal traces (COMP and REF) should be minimized in order to reduce the noise pick up. This can be accomplished by placing the COMP and REF signal traces on top of each other in adjacent PCB layers. In addition, the main feedback control signal traces should be routed away from the SW_AUX switching node to avoid high dv/dt noise coupling.
  • The gate drive outputs (LSG and HSG) should have short and direct paths to the power MOSFETs to minimize parasitic inductance in the gate driving loop.
  • The VCC and REF decoupling capacitors should be placed close to their respective pins with short trace inductance. Low ESR and ESL ceramic capacitors are recommended for the boot-strap, VCC and the REF capacitors.
  • A decoupling capacitor should be placed close to the IC, directly across VIN and PGND pins. The connections to these two pins should be direct to minimize the loop area which carries switching currents.
  • The boot-strap capacitors required for the high-side gate drivers of the half-bridge converter and auxiliary supply should be located close to the IC and connected directly to the BST/BST_AUX and SW/SW_AUX pins.
  • The area of the switching loop of the power stage consisting of input capacitor, capacitive divider, transformer, and the primary MOSFETs should be minimized.