ZHCSDG6C March   2015  – January 2023 DRV2700

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Boost Converter and Control Loop
      2. 7.3.2 High-Voltage Amplifier
      3. 7.3.3 Fast Start-Up (Enable Pin)
      4. 7.3.4 Gain Control
      5. 7.3.5 Adjustable Boost Voltage
      6. 7.3.6 Adjustable Boost Current-Limit
      7. 7.3.7 Internal Charge Pump
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Boost + Amplifier Mode
      2. 7.4.2 Flyback Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 AC-Coupled DAC Input Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Piezo Load Selection
          2. 8.2.1.2.2  Programming The Boost Voltage
          3. 8.2.1.2.3  Inductor and Transformer Selection
          4. 8.2.1.2.4  Programing the Boost and Flyback Current-Limit
          5. 8.2.1.2.5  Boost Capacitor Selection
          6. 8.2.1.2.6  Pulldown FET and Resistors
          7. 8.2.1.2.7  Low-Voltage Operation
          8. 8.2.1.2.8  Current Consumption Calculation
          9. 8.2.1.2.9  Input Filter Considerations
          10. 8.2.1.2.10 Output Limiting Factors
          11. 8.2.1.2.11 Startup and Shutdown Sequencing
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Filtered AC Coupled Single-Ended PWM Input Application
      3. 8.2.3 DC-Coupled DAC Input Application
      4. 8.2.4 DC-Coupled Reference Input Application
      5. 8.2.5 Flyback Circuit
    3. 8.3 System Example
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Boost + Amplifier Configuration Layout Considerations
      2. 10.1.2 Flyback Configuration Layout Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

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机械数据 (封装 | 引脚)
  • RGP|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.