ZHCSO15A December   2021  – February 2023 DLPC4420

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  System Oscillators Timing Requirements
    7. 6.7  Test and Reset Timing Requirements
    8. 6.8  JTAG Interface: I/O Boundary Scan Application Timing Requirements
    9. 6.9  Port 1 Input Pixel Timing Requirements
    10. 6.10 Port 3 Input Pixel Interface (via GPIO) Timing Requirements
    11. 6.11 DMD LVDS Interface Timing Requirements
    12. 6.12 Synchronous Serial Port (SSP) Interface Timing Requirements
    13. 6.13 Programmable Output Clocks Switching Characteristics
    14. 6.14 Synchronous Serial Port Interface (SSP) Switching Characteristics
    15. 6.15 JTAG Interface: I/O Boundary Scan Application Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 System Reset Operation
        1. 7.3.1.1 Power-Up Reset Operation
        2. 7.3.1.2 System Reset Operation
      2. 7.3.2 Spread Spectrum Clock Generator Support
      3. 7.3.3 GPIO Interface
      4. 7.3.4 Source Input Blanking
      5. 7.3.5 Video Graphics Processing Delay
      6. 7.3.6 Program Memory Flash/SRAM Interface
      7. 7.3.7 Calibration and Debug Support
      8. 7.3.8 Board Level Test Support
    4. 7.4 Device Functional Modes
      1. 7.4.1 Standby Mode
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Normal Configuration
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Recommended MOSC Crystal Oscillator Configuration
      2. 8.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
    1. 9.1 System Power Regulations
    2. 9.2 System Power-Up Sequence
    3. 9.3 Power-On Sense (POSENSE) Support
    4. 9.4 System Environment and Defaults
      1. 9.4.1 DLPC4420 System Power-Up and Reset Default Conditions
      2. 9.4.2 1.1V System Power
      3. 9.4.3 1.8V System Power
      4. 9.4.4 3.3V System Power
      5. 9.4.5 Power Good (PWRGOOD) Support
      6. 9.4.6 5V Tolerant Support
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Layout Guidelines for Internal DLPC4420 Power
      2. 10.1.2 PCB Layout Guidelines for Auto-Lock Performance
      3. 10.1.3 DMD Interface Considerations
      4. 10.1.4 Layout Example
      5. 10.1.5 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 第三方产品免责声明
    2. 11.2 Device Support
      1. 11.2.1 Video Timing Parameter Definitions
      2. 11.2.2 Device Nomenclature
      3. 11.2.3 Device Markings
        1. 11.2.3.1 Device Marking
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 接收文档更新通知
    5. 11.5 支持资源
    6. 11.6 Trademarks
    7. 11.7 静电放电警告
    8. 11.8 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
I/O(1)MINNOMMAXUNIT
ELECTRICAL
VDD333.3-V supply voltage, I/O3.1353.33.465V
VDD181.8-V supply voltage, LVDS and DRAM1.711.81.89V
VDD11 1.1-V supply voltage, core logic 1.045 1.1 1.155 V
VDD_PLLD 1.8-V supply voltage, PLL analog 1.71 1.8 1.89 V
VDD_PLLM11.8-V supply voltage, PLL analog1.711.81.89V
VDD_PLLM21.8-V supply voltage, PLL analog1.711.81.89V
VDD_PLLS 1.8-V supply voltage, PLL Analog 1.050 1.10 1.150 V
VDD_PLLD 1.8-V supply voltage, PLL analog 1.045 1.1 1.155 V
VDD_PLLM1 1.8-V supply voltage, PLL analog 1.045 1.1 1.155 V
VDD_PLLM2 1.8-V supply voltage, PLL analog 1.045 1.1 1.155 V
VIInput voltageUSB (9)0VDD33V
OSC (10)0VDD33
3.3-V LVTTL (1,2,3,4)0VDD33
3.3-V I2C (8)0VDD33
voOutput voltageUSB (8)0VDD33V
3.3-V LVTTL (1,2,3,4)0VDD33
3.3-V I2C (8)0VDD33
1.8-V LVDS (7)0VDD33
TAOperating ambient temperature rangeSee(2)(3)055°C
TCOperating top center case temperatureSee(3)(4)0109.16°C
TJOperating junction temperature0111°C
(1) The number inside each parenthesis for the I/O refers to the type defined in the I/O type subscript definition section.
(2) Assumes minimum 1 m/s airflow along with the JEDEC thermal resistance and associated conditions listed at www.ti.com/packaging. Thus, this is an approximate value that varies with environment and PCB design.
(3) Maximum thermal values assume max power of 4.6 watts.
(4) Assume PsiJT equals 0.4 C/W