ZHCSKO3B January   2020  – September 2020 BQ25611D

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. 说明(续)
  6. Device Comparison Table
  7. Pin Configuration and Functions
    1.     Pin Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Power-On-Reset (POR)
      2. 9.3.2  Device Power Up from Battery without Input Source
      3. 9.3.3  Power Up from Input Source
        1. 9.3.3.1 Power Up REGN LDO
        2. 9.3.3.2 Poor Source Qualification
        3. 9.3.3.3 Input Source Type Detection (IINDPM Threshold)
          1. 9.3.3.3.1 D+/D– Detection Sets Input Current Limit
        4. 9.3.3.4 Input Voltage Limit Threshold Setting (VINDPM Threshold)
        5. 9.3.3.5 Power Up Converter in Buck Mode
        6. 9.3.3.6 HIZ Mode with Adapter Present
      4. 9.3.4  Boost Mode Operation From Battery
      5. 9.3.5  Power Path Management
        1. 9.3.5.1 Narrow VDC Architecture
        2. 9.3.5.2 Dynamic Power Management
        3. 9.3.5.3 Supplement Mode
      6. 9.3.6  Battery Charging Management
        1. 9.3.6.1 Autonomous Charging Cycle
        2. 9.3.6.2 Battery Charging Profile
        3. 9.3.6.3 Charging Termination
        4. 9.3.6.4 Thermistor Qualification
          1. 9.3.6.4.1 JEITA Guideline Compliance During Charging Mode
          2. 9.3.6.4.2 Boost Mode Thermistor Monitor During Battery Discharge Mode
        5. 9.3.6.5 Charging Safety Timer
      7. 9.3.7  Ship Mode and QON Pin
        1. 9.3.7.1 BATFET Disable (Enter Ship Mode)
        2. 9.3.7.2 BATFET Enable (Exit Ship Mode)
        3. 9.3.7.3 BATFET Full System Reset
      8. 9.3.8  Status Outputs ( STAT, INT )
        1. 9.3.8.1 Charging Status Indicator (STAT)
        2. 9.3.8.2 Interrupt to Host ( INT)
      9. 9.3.9  Protections
        1. 9.3.9.1 Voltage and Current Monitoring in Buck Mode
          1. 9.3.9.1.1 Input Over-Voltage Protection (ACOV)
          2. 9.3.9.1.2 System Over-Voltage Protection (SYSOVP)
        2. 9.3.9.2 Voltage and Current Monitoring in Boost Mode
          1. 9.3.9.2.1 Boost Mode Over-Voltage Protection
        3. 9.3.9.3 Thermal Regulation and Thermal Shutdown
          1. 9.3.9.3.1 Thermal Protection in Buck Mode
          2. 9.3.9.3.2 Thermal Protection in Boost Mode
        4. 9.3.9.4 Battery Protection
          1. 9.3.9.4.1 Battery Over-Voltage Protection (BATOVP)
          2. 9.3.9.4.2 Battery Over-Discharge Protection
          3. 9.3.9.4.3 System Over-Current Protection
      10. 9.3.10 Serial Interface
        1. 9.3.10.1 Data Validity
        2. 9.3.10.2 START and STOP Conditions
        3. 9.3.10.3 Byte Format
        4. 9.3.10.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 9.3.10.5 Slave Address and Data Direction Bit
        6. 9.3.10.6 Single Read and Write
        7. 9.3.10.7 Multi-Read and Multi-Write
    4. 9.4 Device Functional Modes
      1. 9.4.1 Host Mode and Default Mode
    5. 9.5 Register Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Inductor Selection
        2. 10.2.2.2 Input Capacitor and Resistor
        3. 10.2.2.3 Output Capacitor
    3. 10.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Trademarks

TI E2E is a trademark of Texas Instruments Incorporated.

All trademarks are the property of their respective owners.