ZHCSD31G November   2014  – July 2022 ISO7821

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Dissipation Characteristics
    6. 6.6  Electrical Characteristics, 5 V
    7. 6.7  Electrical Characteristics, 3.3 V
    8. 6.8  Electrical Characteristics, 2.5 V
    9. 6.9  Switching Characteristics, 5 V
    10. 6.10 Switching Characteristics, 3.3 V
    11. 6.11 Switching Characteristics, 2.5 V
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 High Voltage Feature Description
        1. 8.3.1.1 Regulatory Information
        2. 8.3.1.2 Safety Limiting Values
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 9.2.3 Application Performance Curve
        1.       Power Supply Recommendations
  10. 10Layout
    1. 10.1 PCB Material
    2. 10.2 Layout Guidelines
    3. 10.3 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DWW|16
  • DW|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)ISO7821UNIT
DW (SOIC)DWW (SOIC)
16 PINS16-PINS
RθJAJunction-to-ambient thermal resistance84.784.7°C/W
RθJC(top)Junction-to-case(top) thermal resistance47.346.0°C/W
RθJBJunction-to-board thermal resistance49.454.5°C/W
ψJTJunction-to-top characterization parameter19.118.5°C/W
ψJBJunction-to-board characterization parameter48.853.8°C/W
RθJC(bottom)Junction-to-case(bottom) thermal resistancen/an/a°C/W
(1) For more information about trdational and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.