ZHCSD31G November   2014  – July 2022 ISO7821

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Dissipation Characteristics
    6. 6.6  Electrical Characteristics, 5 V
    7. 6.7  Electrical Characteristics, 3.3 V
    8. 6.8  Electrical Characteristics, 2.5 V
    9. 6.9  Switching Characteristics, 5 V
    10. 6.10 Switching Characteristics, 3.3 V
    11. 6.11 Switching Characteristics, 2.5 V
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 High Voltage Feature Description
        1. 8.3.1.1 Regulatory Information
        2. 8.3.1.2 Safety Limiting Values
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 9.2.3 Application Performance Curve
        1.       Power Supply Recommendations
  10. 10Layout
    1. 10.1 PCB Material
    2. 10.2 Layout Guidelines
    3. 10.3 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DWW|16
  • DW|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.3.1.2 Safety Limiting Values

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures.

Table 8-5 Safety Limiting
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ISSafety input, output, or supply current for DW-16 package and DWW-16 PackagesRθJA = 84.7°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C268mA
RθJA = 84.7°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C410
RθJA = 84.7°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C537
PSSafety input, output, or total powerRθJA = 84.7°C/W, TJ = 150°C, TA = 25°C1476mW
TSMaximum safety temperature150°C

The maximum safety temperature is the maximum junction temperature specified for the device. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Section 6.4 is that of a device installed on a High-K test board for Leaded Surface Mount Packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.

GUID-162F2636-78A6-429E-BCE5-70D7DB08A281-low.gifFigure 8-3 Thermal Derating Curve for Safety Limiting Current per VDE
GUID-35166BAC-64F8-46E0-9D46-84E68F3C7EC9-low.gifFigure 8-4 Thermal Derating Curve for Safety Limiting Power per VDE