ZHCSQT2 March   2024 ADS127L18

ADVANCE INFORMATION  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
  7. Parameter Measurement Information
    1. 6.1  Offset Error Measurement
    2. 6.2  Offset Drift Measurement
    3. 6.3  Gain Error Measurement
    4. 6.4  Gain Drift Measurement
    5. 6.5  NMRR Measurement
    6. 6.6  CMRR Measurement
    7. 6.7  PSRR Measurement
    8. 6.8  SNR Measurement
    9. 6.9  INL Error Measurement
    10. 6.10 THD Measurement
    11. 6.11 IMD Measurement
    12. 6.12 SFDR Measurement
    13. 6.13 Noise Performance
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs (AINP, AINN)
        1. 7.3.1.1 Input Range
      2. 7.3.2 Reference Voltage (REFP, REFN)
        1. 7.3.2.1 Reference Voltage Range
      3. 7.3.3 Clock Operation
        1. 7.3.3.1 Internal Oscillator
        2. 7.3.3.2 External Clock
      4. 7.3.4 Power Supplies
        1. 7.3.4.1 AVDD1 and AVSS
        2. 7.3.4.2 AVDD2
        3. 7.3.4.3 IOVDD
        4. 7.3.4.4 Power-On Reset (POR)
        5. 7.3.4.5 CAPA and CAPD
      5. 7.3.5 VCM Output Voltage
      6. 7.3.6 GPIO
      7. 7.3.7 Modulator
      8. 7.3.8 Digital Filter
        1. 7.3.8.1 Wideband Filter
      9. 7.3.9 Low-Latency Filter (Sinc)
        1. 7.3.9.1 Sinc4 Filter
        2. 7.3.9.2 Sinc4 + Sinc1 Cascade Filter
        3. 7.3.9.3 Sinc3 Filter
        4. 7.3.9.4 Sinc3 + Sinc1 Filter
    4. 7.4 Device Functional Modes
      1. 7.4.1  Speed Modes
      2. 7.4.2  Synchronization
        1. 7.4.2.1 Synchronized Control Mode
        2. 7.4.2.2 Start/Stop Control Mode
      3. 7.4.3  Digital Filter Settling
      4. 7.4.4  Conversion-Start Delay Time
      5. 7.4.5  Data Averaging
      6. 7.4.6  Calibration
        1. 7.4.6.1 Offset Calibration Registers
        2. 7.4.6.2 Gain Calibration Registers
        3. 7.4.6.3 Calibration Procedure
      7. 7.4.7  Reset
        1. 7.4.7.1 RESET Pin
        2. 7.4.7.2 Reset by SPI Register
        3. 7.4.7.3 Reset by SPI Input Pattern
      8. 7.4.8  Power-Down
      9. 7.4.9  Idle and Standby Modes
      10. 7.4.10 Diagnostics
        1. 7.4.10.1 ERROR Pin and ERR_FLAG Bit
        2. 7.4.10.2 Clock Counter
        3. 7.4.10.3 SCLK Counter
        4. 7.4.10.4 Frame-Sync CRC
        5. 7.4.10.5 SPI CRC
        6. 7.4.10.6 Register Map CRC
        7. 7.4.10.7 Self Test
      11. 7.4.11 Frame-Sync Data Port
        1. 7.4.11.1 FSYNC Pin
        2. 7.4.11.2 DCLK Pin
        3. 7.4.11.3 DOUTn Pins
        4. 7.4.11.4 DINn Pins
        5. 7.4.11.5 Time Division Multiplexing (TDM)
        6. 7.4.11.6 Data Size
        7. 7.4.11.7 STATUS_DP Header
        8. 7.4.11.8 Daisy Chain
        9. 7.4.11.9 Data Port Offset Timing
    5. 7.5 Programming
      1. 7.5.1 Hardware Programming
      2. 7.5.2 SPI Programming
        1. 7.5.2.1 Chip Select (CS)
        2. 7.5.2.2 Serial Clock (SCLK)
        3. 7.5.2.3 Serial Data Input (SDI)
        4. 7.5.2.4 Serial Data Output (SDO)
      3. 7.5.3 SPI Frame
      4. 7.5.4 SPI Commands
        1. 7.5.4.1 Read Register Command
        2. 7.5.4.2 Write Register Command
      5. 7.5.5 SPI Daisy-Chain
  9. Register Map
  10. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Driver
      2. 9.1.2 Antialias Filter
      3. 9.1.3 Reference Voltage
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Data Size

The data size consists of an optional STATUS_DP header byte, the conversion data, and an optional CRC byte. As shown in Figure 7-35, the data packet ranges from two bytes (16-bit data) to five bytes (header byte + 24-bit data + CRC byte). The status and CRC bytes are enabled by bits 7 and 6 of the DP_CFG1 register.

GUID-20230216-SS0I-KXW8-JGSN-2RZHDJGSLRRK-low.svg Figure 7-35 Frame-Sync Data Packet

Conversion data are coded in two's-complement format, MSB sign bit first, in 16- or 24-bit format. Conversion data are programmed by the DATA bit of the GEN_CFG3 register. Table 7-14 lists the scaling of the code values. Conversion data clip at positive and negative full-scale values when the input signal exceeds the positive and negative full-scale range.

Table 7-14 Data Format
INPUT VOLTAGE, VIN (V)(1) 24-BIT OUTPUT DATA(2)
STANDARD RANGE EXTENDED RANGE
1.25 · k · VREF · (223 – 1) / 223 7FFFFFh 7FFFFFh
k · VREF · (223 – 1) / 223 666666h
k · VREF / 223 000001h 000001h
0 000000h 000000h
–k · VREF / 223 FFFFFFh FFFFFFh
–k · VREF 800000h 99999Ah
–1.25 · k · VREF 800000h
k = 1x or 2x input range option.
Ideal output data, excluding offset, gain, linearity, and noise errors. Reduced data resolution with 12, 16, and 24 OSR values. The 16-bit data format rounds the data to the nearest 16-bit code.