BOOST-CC2564MODA

TMP107 BoosterPack 模块

BOOST-CC2564MODA

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概述

The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA).  The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design effort and enables fast time to market. The CC2564MODA modules provides best-in-class RF performance with a transmit power and receive sensitivity that provides range of about 2X compared to other BLE-only solutions.

For a complete evaluation solution, the BOOST-CC2564MODA board plugs directly into TI LaunchPad™ development kits and BoosterPack plug-in modules such as: MSP-EXP432P401R, CC3200AUDBOOST and CC31XXEMUBOOST. Moreover, a certified and royalty-free TI Bluetooth stack (TIBLUETOOTHSTACK-SDK) is available for the MSP430™ and MSP432™ MCUs.

特性
  • Dual-mode (Bluetooth & Bluetooth low energy) Bluetooth Specification v4.1

  • Integrated antenna on CC2564MODA  for ready to use application

  • FCC, IC, CE certified with a certified and royalty-free TI Bluetooth stack, getting started guide, demos, and UART and PCM/I2S Interface

  • Class 1.5 Transmit Power (+10dBm) and High sensitivity (-93 dBm typ.)

  • BoosterPack connectors compatible with TI LaunchPads and BoosterPacks such as:

    • MSP-EXP432P401R

    • CC3200AUDBOOST

    • CC31XXEMUBOOST

  • 1 BOOST-CC2564MODA board with TI CC2564MODA device
  • MSP-EXP432P401R, CC3200AUDBOOST and CC31XXEMUBOOST boards sold separately

蓝牙产品
CC2560 Bluetooth® 4.0 with enhanced data rate (EDR) CC2564 具有增强数据速率 (EDR)、低功耗 (LE) 模块和 ANT 的 Bluetooth® 4.0 CC2564MODA 具有基本速率、增强数据速率和带集成天线的低功耗 (LE) 模块的 Bluetooth® 4.1 CC2564MODN 具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Bluetooth® 4.1

 

线性和低压降 (LDO) 稳压器
TLV717P 具有主动输出放电和使能功能的 150mA、低 IQ、低压降稳压器 TPS735 具有使能功能的 500mA、低 IQ、低压降稳压器

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评估板

BOOST-CC2564MODA — 具有集成天线 BoosterPack 插件模块的双模蓝牙 CC2564 模块

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CC256X-REPORTS — 报告:CC256x 法规认证报告

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CC256X-REPORTS 报告:CC256x 法规认证报告

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最新版本
版本: 5.20.00.00
发布日期: 14 四月 2021
产品
蓝牙产品
CC2564 具有增强数据速率 (EDR)、低功耗 (LE) 模块和 ANT 的 Bluetooth® 4.0 CC2564C 具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Bluetooth® 4.2 CC2564MODA 具有基本速率、增强数据速率和带集成天线的低功耗 (LE) 模块的 Bluetooth® 4.1 CC2564MODN 具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Bluetooth® 4.1
硬件开发
BOOST-CC2564MODA TMP107 BoosterPack 模块 CC2564MODAEM CC2564 具有集成天线的双模蓝牙模块评估板 CC2564MODNEM CC2564 Bluetooth® 双路模式模块评估版 CC256XCQFN-EM CC2564C 双模 Bluetooth® 控制器评估模块 CC256XQFNEM CC256x Bluetooth®/双模评估模块

文档

Link to FCC, ISED, & Certification Reports

Link to FCC, ISED, & Certification Reports

Link to CC2564MODNEM Reference Only Certification Reports

Link to CC2564MODAEM Reference Only Certification Reports

Link to CC256xQFNEM Reference Only Certification Reports

Link to CC256xCQFN-EM Reference Only Certification Reports

Link to BOOST-CC2564MODA Reference Only Certification Reports

最新信息

  • Updated CE certification reports for CC2564 Modules

发布信息

This page provides access to the Dual Mode BT certification reports. Here you will find certification reports for both modules and EVMs. Note that module certification reports can be reused by the customer for regulatory compliance. However the customer should consult with their regulatory house to ensure they meet the requirements for certification at their product level. EVM certification reports are provided for reference only. When using a chip down version, the customer is responsible for their own certification.
应遵守 TI 的评估模块标准条款与条件.

技术文档

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类型 标题 下载最新的英文版本 日期
证书 BOOST-CC2564MODA EU Declaration of Conformity (DoC) (Rev. C) 2021年 3月 3日
更多文献资料 CC2564 Dual-Mode Bluetooth Module With Integrated Antenna BoosterPack Plug-in (Rev. B) 2018年 8月 30日
用户指南 Dual-Mode Bluetooth® CC2564 Module With Integrated Antenna BoosterPack™ Plug-in (Rev. A) 2017年 11月 2日
用户指南 TI Dual-mode Bluetooth® stack on MSP432 MCUs User Guide (Rev. B) 2017年 10月 30日

相关设计资源

硬件开发

评估板
CC31XXEMUBOOST 用于 SimpleLink Wi-Fi CC3100 BoosterPack 的高级仿真 BoosterPack CC3200AUDBOOST SimpleLink Wi-Fi CC3200 音频·BoosterPack
开发套件
MSP-EXP430F5529LP MSP430F5529 USB LaunchPad™ development kit

软件开发

驱动程序或库
CC256XB-BT-SP 用于 CC256xB 的蓝牙服务包 CC256XMS432BTBLESW 基于 MSP432 MCU 的 TI 双模蓝牙协议栈

设计工具和仿真

计算工具
SWRC256 CC256x 蓝牙硬件评估工具

参考设计

参考设计
BT-MSPAUDSINK-RD 蓝牙 和 MSP430 音频信宿参考设计 BT-MSPAUDSOURCE-RD 蓝牙和 MSP430 音频源参考设计 CC31XXEMUBOOST-RD 用于 SimpleLink Wi-Fi CC3100 BoosterPack 参考设计的高级仿真 BoosterPack TIDA-00554 面向便携式化学分析应用的蓝牙连接型 DLP 超级移动 NIR 光谱仪 TIDC-CC3200AUDBOOST 用于 SimpleLink Wi-Fi CC3200 Launchpad 的 Wi-Fi 音频流应用

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