TMP107 BoosterPack 模块
The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA). The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design effort and enables fast time to market. The CC2564MODA modules provides best-in-class RF performance with a transmit power and receive sensitivity that provides range of about 2X compared to other BLE-only solutions.
For a complete evaluation solution, the BOOST-CC2564MODA board plugs directly into TI LaunchPad™ development kits and BoosterPack plug-in modules such as: MSP-EXP432P401R, CC3200AUDBOOST and CC31XXEMUBOOST. Moreover, a certified and royalty-free TI Bluetooth stack (TIBLUETOOTHSTACK-SDK) is available for the MSP430™ and MSP432™ MCUs.
Dual-mode (Bluetooth & Bluetooth low energy) Bluetooth Specification v4.1
Integrated antenna on CC2564MODA for ready to use application
FCC, IC, CE certified with a certified and royalty-free TI Bluetooth stack, getting started guide, demos, and UART and PCM/I2S Interface
Class 1.5 Transmit Power (+10dBm) and High sensitivity (-93 dBm typ.)
BoosterPack connectors compatible with TI LaunchPads and BoosterPacks such as:
- 1 BOOST-CC2564MODA board with TI CC2564MODA device
- MSP-EXP432P401R, CC3200AUDBOOST and CC31XXEMUBOOST boards sold separately