CC2564MODA
- Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
- CC2564MODA With Integrated Antenna
- CC2564MODN With External Antenna
- Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
- FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
- CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
- Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
- Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
- CC2564MODA
- Integrated Chip Antenna
- Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
- CC2564MODN
- Single-Ended 50-Ω RF Interface
- Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
- CC2564MODA
- BR and EDR Features Include:
- Up to Seven Active Devices
- Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
- Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
- Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
- Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
- Support of Multiple Bluetooth Profiles With Enhanced QoS
- Low Energy Features Include:
- Support of up to 10 Simultaneous Connections
- Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
- Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
- Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
- Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
- Class 1.5 TX Power up to +10 dBm
- –93 dbm Typical RX Sensitivity
- Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
- Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
- Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
- Advanced Power Management for Extended Battery Life and Ease of Design
- On-Chip Power Management, Including Direct Connection to Battery
- Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
- Shutdown and Sleep Modes to Minimize Power Consumption
- Physical Interfaces:
- UART Interface With Support for Maximum Bluetooth Data Rates
- UART Transport Layer (H4) With Maximum Rate of 4 Mbps
- Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
- Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
- UART Interface With Support for Maximum Bluetooth Data Rates
- CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack
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The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.
Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.
The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:
- Serial port profile (SPP)
- Advanced audio distribution profile (A2DP)
- Audio/video remote control profile (AVRCP)
- Hands-free profile (HFP)
- Human interface device (HID)
- Generic attribute profile (GATT)
- Several Bluetooth low energy profiles and services
For more information, see TI Dual-Mode Bluetooth Stack.
In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.
技术文档
| 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 辐射与可靠性报告 | CC2564MODA Reliability Data – Reliability Estimate | 2019年 6月 25日 | |||
| * | 数据表 | CC2564MODx Bluetooth® Host Controller Interface (HCI) Module 数据表 (Rev. E) | 2016年 1月 16日 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点