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CC2564MODA

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具有基本速率、增强数据速率和带集成天线的低功耗 (LE) 模块的 Bluetooth® 4.1

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CC2564MODA

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产品详情

Protocols Dual-mode Bluetooth Type Module, Transceiver Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Rating Catalog Security Networking security Sensitivity (best) (dBm) -93 Operating temperature range (C) -30 to 85
Protocols Dual-mode Bluetooth Type Module, Transceiver Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Rating Catalog Security Networking security Sensitivity (best) (dBm) -93 Operating temperature range (C) -30 to 85
  • Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
    • CC2564MODA With Integrated Antenna
    • CC2564MODN With External Antenna
  • Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
    • FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
    • CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
    • Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
  • Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
    • CC2564MODA
      • Integrated Chip Antenna
      • Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
    • CC2564MODN
      • Single-Ended 50-Ω RF Interface
      • Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
    • Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Support of up to 10 Simultaneous Connections
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1.5 TX Power up to +10 dBm
    • –93 dbm Typical RX Sensitivity
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.
  • Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
    • CC2564MODA With Integrated Antenna
    • CC2564MODN With External Antenna
  • Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
    • FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
    • CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
    • Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
  • Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
    • CC2564MODA
      • Integrated Chip Antenna
      • Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
    • CC2564MODN
      • Single-Ended 50-Ω RF Interface
      • Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
    • Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Support of up to 10 Simultaneous Connections
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1.5 TX Power up to +10 dBm
    • –93 dbm Typical RX Sensitivity
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Hands-free profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Hands-free profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.
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类型 项目标题 下载最新的英语版本 日期
* 数据表 CC2564MODx Bluetooth® Host Controller Interface (HCI) Module 数据表 (Rev. E) 2016年 1月 16日
* 辐射与可靠性报告 CC2564MODA Reliability Data – Reliability Estimate 2019年 6月 25日
选择指南 CC256x Getting Started Guide (Rev. C) PDF | HTML 2022年 5月 13日
选择指南 Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. B) 2022年 3月 7日
选择指南 无线连接技术选择指南 (Rev. B) 下载英文版本 (Rev.B) 2022年 3月 7日
选择指南 無線連線技術選擇指南 (Rev. B) 2022年 3月 7日
选择指南 무선 연결 기술 선택 가이드 (Rev. B) 2022年 3月 7日
应用手册 低功耗蓝牙、基本速率/增强型数据速率–方法混淆配对漏洞 下载英文版本 PDF | HTML 2021年 7月 19日
证书 CC2564MODA EC Declaration of Conformity (DoC) (Rev. A) 2021年 3月 3日
用户指南 Bluetopia Stack Build Guide for Linux PDF | HTML 2021年 1月 15日
用户指南 CC2564x Demo Applications User Guide PDF | HTML 2020年 12月 17日
应用手册 Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 2020年 5月 18日
应用手册 Capturing Bluetooth Host Controller Interface (HCI) Logs 2019年 1月 7日
技术文章 An out-of-the-box Internet of Things: building a seamless and secure smart home network 2018年 6月 12日
技术文章 Thread vs. Zigbee – what’s the difference? 2018年 5月 16日
技术文章 Your microcontroller deserves a nap – designing “sleepy” wireless applications 2018年 3月 28日
白皮书 Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) 2017年 10月 16日
白皮书 Which TI Bluetooth Solution Should I choose? 2017年 5月 5日
白皮书 Why Bluetooth Classic? 2017年 5月 4日
技术文章 SimpleLink™ MCU SDKs: Breaking down TI Drivers 2017年 4月 12日
更多文献资料 Streamline the challenges of RF design with certified wireless modules 2017年 1月 25日
更多文献资料 SimpleLink Bluetooth CC256x Solutions (Rev. C) 2016年 2月 3日
用户指南 TI Dual-mode Bluetooth Stack on STM32F4 MCUs User Guide PDF | HTML 2015年 7月 8日
用户指南 Dual-Mode Bluetooth CC2564 Module With Integrated Antenna Evaluation Board 2015年 7月 7日
用户指南 CC2564MODA Evaluation Board Quick Start Guide 2015年 7月 1日
白皮书 Three flavors of Bluetooth®: Which one to choose? 2014年 3月 25日

设计和开发

如需其他信息或资源，请查看下方列表，点击标题即可进入详情页面。

评估板

BOOST-CC2564MODA — TMP107 BoosterPack 模块

The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA).  The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design (...)

用户指南: PDF
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评估板

CC2564MODAEM — CC2564 具有集成天线的双模蓝牙模块评估板

CC2564MODAEM 评估板包含蓝牙 BR/EDR/LE HCI 解决方案。bCC2564MODA 基于 TI 的 CC2564B 双模蓝牙单芯片器件，旨在用于评估和设计，能够减少设计工作量，实现产品快速上市。


为了实现完整的评估，CC2564MODAEM 板直接插入 TI 硬件开发套件，包括 MSP-EXP430F5529、MSP-EXP430F5438、DK-TM4C123G 和 DK-TM4C129X。此外，MSP430 和 TM4C12x MCU 还可以使用通过认证且免专利费的 TI 蓝牙协议栈 (TIBLUETOOTHSTACK-SDK)。


CC2564MODA (...)

用户指南: PDF | HTML
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评估板

CC2564MODNEM — CC2564 Bluetooth® 双路模式模块评估版

CC2564MODNEM 评估板包含 CC2564MODN 器件，且专用于评估和设计。

为提供完整的评估解决方案，CC2564MODNEM 板可直接插入我们的硬件开发套件：MSP-EXP430F5529、MSP-EXP430F5438、DK-TM4C129X 和适用于其他 MCU 的套件。TI 的 Bluetooth® 协议栈已经过认证且免专利费，适用于 MSP430™ MCU (CC256XMSPBTBLESW)、TM4C12x MCU (CC256XM4BTBLESW) 和其他 MCU (CC256XSTBTBLESW)。

提供的 CC2564MODNEM 硬件设计文件（原理图、布局和 (...)

用户指南: PDF
TI.com 上无现货
评估板

CC256XQFNEM — 双模 Bluetooth® CC2564 评估板

CC256XQFNEM 评估板包含 CC2564B 器件，用于 CC256x 器件的评估和设计。

为实现完整的评估解决方案，CC256XQFNEM 评估板可直接插入 TI 硬件开发套件中：MSP-EXP430F5529、MSP-EXP430F5438、DK-TM4C129X 和其他 MCU。此外，MSP430 (CC256XMSPBTBLESW)、TM4C12x MCU (CC256XM4BTBLESW) 和其他 MCU (CC256XSTBTBLESW) 还可以使用经过认证且免专利费的 TI 蓝牙协议栈。

CC256XQFNEM 硬件设计文件（原理图、布局和 BOM）作为参考提供，以帮助实施 (...)

用户指南: PDF
TI.com 上无现货
评估板

MSP-EXP430F5529 — MSP430F5529 USB 实验板

下载设计文件

MSP430F5529 实验板 (MSP-EXP430F5529) 是一个用于 MSP430F5529 器件（来自最新一代具有集成 USB 的 MSP430 器件）的开发平台。该实验板与 CC2520EMK 等众多 TI 低功耗射频无线评估模块兼容。该实验板能帮助设计者快速使用新的 F55xx MCU 进行学习和开发，其中 F55xx MCU 为能量收集、无线传感以及自动抄表基础设施 (AMI) 等应用提供了业界最低工作功耗的集成 USB、更大的内存和领先的集成技术。

该实验板上的 MSP430F5529 器件可以通过集成 ezFET 或通过 TI 闪存仿真工具（如 (...)

用户指南: PDF | HTML
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接口适配器

CC256XSTBTBLESW — 基于 STM32F4 MCU 的 TI 双模 Bluetooth® 协议栈

TI 出品的适用于蓝牙 + 蓝牙低功耗的 STM32F4 MCU 软件上的双模蓝牙堆栈可实现 STM32 ARM Cortex M4，且由用于实施蓝牙 4.0 规范的单模和双模产品所构成。该蓝牙堆栈已完全通过认证（QDID 37180 或 QDID 69887 以及 QDID 42849 或 QDID 69886），可提供简易命令行采样应用以加速开发，并可按需提供 MFI 功能。

为实现完整的评估解决方案，CC256XSTBTBLESW 可直接与硬件开发套件 STM3240G-EVAL 搭配使用。此外，适用于 STM32 MCU 的堆栈已通过认证且免专利费 (CC256XSTBTBLESW)。

(...)

用户指南: PDF | HTML
了解详情
驱动程序或库

CC256XB-BT-SP — 用于 CC256xB 的蓝牙服务包

该软件包中包含初始化脚本（适用于 BT4.0 和 BT4.1）和插件（适用于音频/语音处理和 BLE 支持）。

CC256x -BT-SP

CC256x 蓝牙服务包 (SP) 是包含错误修复程序以及特定于平台的配置的强制性初始化脚本。每次重启之后，均须将其加载到相应的 CC256x 器件。CC256x SP 以蓝牙脚本 (BTS) 文件的形式提供。BTS 文件是一种校本化的二进制文件，它定义了应对此文件自身内的嵌入式 HCI 命令和 HCI 事件所应用的操作。

为使用芯片，该堆栈首先会下载初始化脚本，然后根据用户要求来使用相关插件（一次只能使用一个插件）。

特定于芯片和平台的支持

(...)

lock = 需要出口许可（1 分钟）
用户指南: PDF
下载
驱动程序或库

CC256XM4BTBLESW — 基于 TM4C MCU 的 TI 双模 Bluetooth® 协议栈

TI 出品的适用于蓝牙 + 蓝牙低功耗的 TM4C MCU 软件上的双模蓝牙堆栈可实现 TM4C12x MCU，且由用于实现蓝牙 4.0 规范的单模和双模产品所构成。该蓝牙堆栈已完全通过认证（QDID 37180 和 QDID 42849），同时还可提供简易命令行采样应用以加速开发，并可按需提供 MFI 功能。

CC256XM4BTBLESW 直接与 TI 硬件开发套件 DK-TM4C123G 和 DK-TM4C129X 配合工作。此外，适用于 TM4C12x MCU 的堆栈已通过认证且免专利费。

该软件可与所有 CC256x EM 板（CC256XQFNEM 和 (...)

lock = 需要出口许可（1 分钟）
用户指南: PDF
下载
驱动程序或库

CC256XMS432BTBLESW — 基于 MSP432 MCU 的 TI 双模蓝牙协议栈

TI’s Dual-mode Bluetooth stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886), provides (...)
lock = 需要出口许可（1 分钟）
用户指南: PDF
下载
驱动程序或库

CC256XMSPBTBLESW — 用于 MSP430 上的 CC256x 的 Stonestreet One BT+BLE 堆栈和配置文件

基于 MSP430™ MCU 软件的 TI 双模蓝牙堆栈（适用于蓝牙 + 蓝牙低功耗）可支持 MSP430 MCU，且同时包含实施蓝牙 4.0 规范的单模和双模产品。该蓝牙堆栈已完全通过认证（QDID 37180 和 QDID 42849），同时还可提供简易命令行示例应用以加速开发，并可按需提供 MFI 功能。

为实现完整的评估解决方案，CC256XMSPBTBLESW 可直接与 TI 硬件开发套件 MSP-EXP430F5529 和 MSP-EXP430F5438 搭配使用。此外，适用于 MSP430 MCU 的堆栈已通过认证且免专利费。

该软件可与所有 CC256x EM (...)

lock = 需要出口许可（1 分钟）
用户指南: PDF
下载
认证

CC256X-REPORTS — 报告：CC256x 法规认证报告

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
支持的产品和硬件

支持的产品和硬件

产品
蓝牙产品
CC2564 — 具有增强数据速率 (EDR)、低功耗 (LE) 模块和 ANT 的 Bluetooth® 4.0 CC2564C — 具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Bluetooth® 4.2 CC2564MODA — 具有基本速率、增强数据速率和带集成天线的低功耗 (LE) 模块的 Bluetooth® 4.1 CC2564MODN — 具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Bluetooth® 4.1
硬件开发
BOOST-CC2564MODA — TMP107 BoosterPack 模块 CC2564MODAEM — CC2564 具有集成天线的双模蓝牙模块评估板 CC2564MODNEM — CC2564 Bluetooth® 双路模式模块评估版 CC256XCQFN-EM — CC2564C 双模 Bluetooth® 控制器评估模块 CC256XQFNEM — 双模 Bluetooth® CC2564 评估板
下载选项
光绘文件

CC2564MODAEM Design Files

SWRC317.ZIP (1326 KB)
下载
参考设计

TIDA-00554 — 面向便携式化学分析应用的蓝牙连接型 DLP 超级移动 NIR 光谱仪

该超便携近红外线 (NIR) 光谱仪参考设计利用德州仪器 (TI) 的 DLP 技术及单元件 InGaAs 检测器进行高性能的测量，该设计具有便携式外形，与采用昂贵 InGaAs 阵列检测器的架构或易损的旋转光栅架构相比更实惠。该参考设计支持蓝牙低耗能，从而可为包括食品、农业、药品、石油化工产品等在内的各类应用提供针对手持式光谱仪的移动实验室测量。通过使用 TI Tiva 处理器，云中的数据库可通过移动网络进行利用，实现实时等效分析，其支持食品或皮肤分析以及可穿戴健康监测器解决方案。开发人员还可以通过创新型 iOS 与 Android 平台创建自己的数据集合和分析。
设计指南: PDF
原理图: PDF
参考设计

BT-MSPAUDSINK-RD — 蓝牙 和 MSP430 音频信宿参考设计

TI 的蓝牙 + MSP430 音频散热器参考设计可供客户用于创建各种低端、低功耗音频解决方案的应用。一些可能的应用 - 玩具、低端蓝牙扬声器、音频播放配件。此参考设计是一种经济实惠的音频实施方案，通过参考其提供的完整设计文件，您可以将重心转移到应用和最终产品开发工作上。此参考设计支持的软件包括 Stonestreet One Bluetopia 蓝牙堆栈（经过认证且免专利费）。
用户指南: PDF
原理图: PDF
参考设计

CC256XEM-RD — CC256x Bluetooth® 参考设计

该 CC256x Bluetooth® 评估模块参考设计是一款射频参考设计，带有可轻松连接至多种微控制器单元 (MCU) 的天线（例如，TI 的 MSP430 或 Tiva C 系列 MCU）。该参考设计可复制到电路板中，从而使设计具有成本效益并加快推向市场。该蓝牙设计受到可订购评估模块、免版税软件和文档、测试和认证提示以及社区支持资源的支持。有关更多信息，请访问我们的 Wiki。
用户指南: PDF
原理图: PDF
参考设计

BT-MSPAUDSOURCE-RD — 蓝牙和 MSP430 音频源参考设计

您可将蓝牙和 MSP430 音频源参考设计用于创建适用于低端、低功耗音频解决方案（包括玩具、投影仪、智能遥控器和各种音频播放配件）的各种应用。此参考设计是一种经济实惠的音频实施方案，具有完整的设计文件，让您可以专注于应用和最终产品的开发。此参考设计同样提供 TI Bluetooth Stack。
用户指南: PDF
原理图: PDF
封装 引脚数 下载
(MOG) 35 了解详情

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

推荐产品可能包含与 TI 此产品相关的参数、评估模块或参考设计。

支持与培训

视频