CC2564MODA
- Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
- CC2564MODA With Integrated Antenna
- CC2564MODN With External Antenna
- Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
- FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
- CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
- Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
- Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
- CC2564MODA
- Integrated Chip Antenna
- Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
- CC2564MODN
- Single-Ended 50-Ω RF Interface
- Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
- CC2564MODA
- BR and EDR Features Include:
- Up to Seven Active Devices
- Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
- Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
- Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
- Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
- Support of Multiple Bluetooth Profiles With Enhanced QoS
- Low Energy Features Include:
- Support of up to 10 Simultaneous Connections
- Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
- Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
- Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
- Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
- Class 1.5 TX Power up to +10 dBm
- –93 dbm Typical RX Sensitivity
- Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
- Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
- Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
- Advanced Power Management for Extended Battery Life and Ease of Design
- On-Chip Power Management, Including Direct Connection to Battery
- Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
- Shutdown and Sleep Modes to Minimize Power Consumption
- Physical Interfaces:
- UART Interface With Support for Maximum Bluetooth Data Rates
- UART Transport Layer (H4) With Maximum Rate of 4 Mbps
- Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
- Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
- UART Interface With Support for Maximum Bluetooth Data Rates
- CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack
All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.
The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.
Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.
The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:
- Serial port profile (SPP)
- Advanced audio distribution profile (A2DP)
- Audio/video remote control profile (AVRCP)
- Hands-free profile (HFP)
- Human interface device (HID)
- Generic attribute profile (GATT)
- Several Bluetooth low energy profiles and services
For more information, see TI Dual-Mode Bluetooth Stack.
In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.
技术文档
设计和开发
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BOOST-CC2564MODA — TMP107 BoosterPack 模块
The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA). The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design (...)
CC2564MODAEM — CC2564 具有集成天线的双模蓝牙模块评估板
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CC2564MODA (...)
CC2564MODNEM — CC2564 Bluetooth® 双路模式模块评估版
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提供的 CC2564MODNEM 硬件设计文件(原理图、布局和 (...)
CC256XQFNEM — 双模 Bluetooth® CC2564 评估板
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为实现完整的评估解决方案,CC256XQFNEM 评估板可直接插入 TI 硬件开发套件中:MSP-EXP430F5529、MSP-EXP430F5438、DK-TM4C129X 和其他 MCU。此外,MSP430 (CC256XMSPBTBLESW)、TM4C12x MCU (CC256XM4BTBLESW) 和其他 MCU (CC256XSTBTBLESW) 还可以使用经过认证且免专利费的 TI 蓝牙协议栈。
CC256XQFNEM 硬件设计文件(原理图、布局和 BOM)作为参考提供,以帮助实施 (...)
MSP-EXP430F5529 — MSP430F5529 USB 实验板
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该实验板上的 MSP430F5529 器件可以通过集成 ezFET 或通过 TI 闪存仿真工具(如 (...)
CC256XSTBTBLESW — 基于 STM32F4 MCU 的 TI 双模 Bluetooth® 协议栈
TI 出品的适用于蓝牙 + 蓝牙低功耗的 STM32F4 MCU 软件上的双模蓝牙堆栈可实现 STM32 ARM Cortex M4,且由用于实施蓝牙 4.0 规范的单模和双模产品所构成。该蓝牙堆栈已完全通过认证(QDID 37180 或 QDID 69887 以及 QDID 42849 或 QDID 69886),可提供简易命令行采样应用以加速开发,并可按需提供 MFI 功能。
为实现完整的评估解决方案,CC256XSTBTBLESW 可直接与硬件开发套件 STM3240G-EVAL 搭配使用。此外,适用于 STM32 MCU 的堆栈已通过认证且免专利费 (CC256XSTBTBLESW)。
(...)
CC256XB-BT-SP — 用于 CC256xB 的蓝牙服务包
CC256x -BT-SP
CC256x 蓝牙服务包 (SP) 是包含错误修复程序以及特定于平台的配置的强制性初始化脚本。每次重启之后,均须将其加载到相应的 CC256x 器件。CC256x SP 以蓝牙脚本 (BTS) 文件的形式提供。BTS 文件是一种校本化的二进制文件,它定义了应对此文件自身内的嵌入式 HCI 命令和 HCI 事件所应用的操作。
为使用芯片,该堆栈首先会下载初始化脚本,然后根据用户要求来使用相关插件(一次只能使用一个插件)。
特定于芯片和平台的支持
(...)
CC256XM4BTBLESW — 基于 TM4C MCU 的 TI 双模 Bluetooth® 协议栈
CC256XM4BTBLESW 直接与 TI 硬件开发套件 DK-TM4C123G 和 DK-TM4C129X 配合工作。此外,适用于 TM4C12x MCU 的堆栈已通过认证且免专利费。
该软件可与所有 CC256x EM 板(CC256XQFNEM 和 (...)
CC256XMS432BTBLESW — 基于 MSP432 MCU 的 TI 双模蓝牙协议栈
CC256XMSPBTBLESW — 用于 MSP430 上的 CC256x 的 Stonestreet One BT+BLE 堆栈和配置文件
为实现完整的评估解决方案,CC256XMSPBTBLESW 可直接与 TI 硬件开发套件 MSP-EXP430F5529 和 MSP-EXP430F5438 搭配使用。此外,适用于 MSP430 MCU 的堆栈已通过认证且免专利费。
该软件可与所有 CC256x EM (...)
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BT-MSPAUDSINK-RD — 蓝牙 和 MSP430 音频信宿参考设计
CC256XEM-RD — CC256x Bluetooth® 参考设计
BT-MSPAUDSOURCE-RD — 蓝牙和 MSP430 音频源参考设计
封装 | 引脚数 | 下载 |
---|---|---|
(MOG) | 35 | 了解详情 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 认证摘要
- 持续可靠性监测
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