Module Solution Based on TI's CC2564B Dual-Mode Bluetooth^®, Available in Two Variants:
- CC2564MODA With Integrated Antenna
- CC2564MODN With External Antenna
Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
- FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
- CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
- Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
- CC2564MODA
  - Integrated Chip Antenna
  - Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
- CC2564MODN
  - Single-Ended 50-Ω RF Interface
  - Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
BR and EDR Features Include:
- Up to Seven Active Devices
- Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
- Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
- Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
- Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
- Support of Multiple Bluetooth Profiles With Enhanced QoS
Low Energy Features Include:
- Support of up to 10 Simultaneous Connections
- Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
- Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
- Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
- Class 1.5 TX Power up to +10 dBm
- –93 dbm Typical RX Sensitivity
- Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
- Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
- Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
Advanced Power Management for Extended Battery Life and Ease of Design
- On-Chip Power Management, Including Direct Connection to Battery
- Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
- Shutdown and Sleep Modes to Minimize Power Consumption
Physical Interfaces:
- UART Interface With Support for Maximum Bluetooth Data Rates
  - UART Transport Layer (H4) With Maximum Rate of 4 Mbps
  - Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
- Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.

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The CC2564MODx module from Texas Instruments™ is a complete Bluetooth^® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM^® Cortex^®-M3 and ARM^® Cortex^®-M4 MCUs, and Linux^® based MPUs. Other processors can be supported through TI's third party. The iPod^® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)
Advanced audio distribution profile (A2DP)
Audio/video remote control profile (AVRCP)
Hands-free profile (HFP)
Human interface device (HID)
Generic attribute profile (GATT)
Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.

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	类型	标题	日期
*	数据表	CC2564MODx Bluetooth® Host Controller Interface (HCI) Module 数据表 (Rev. E)	2016年 1月 16日
*	辐射与可靠性报告	CC2564MODA Reliability Data – Reliability Estimate	2019年 6月 25日
	技术文章	Wireless M-Bus 101: Demystifying modes and regional application profiles	2021年 7月 2日
	选择指南	Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. A)	2021年 6月 14日
	选择指南	无线连接技术选择指南 (Rev. A)	2021年 6月 14日
	选择指南	無線連線技術選擇指南 (Rev. A)	2021年 6月 14日
	选择指南	무선 연결 기술 선택 가이드 (Rev. A)	2021年 6月 14日
	选择指南	Wireless Connectivity Technology Selection Guide (Rev. A)	2021年 5月 27日
	证书	CC2564MODA EC Declaration of Conformity (DoC) (Rev. A)	2021年 3月 3日
	用户指南	Bluetopia Stack Build Guide for Linux	2021年 1月 15日
	用户指南	CC2564x Demo Applications User Guide	2020年 12月 17日
	选择指南	CC256x Getting Started Selection Guide (Rev. B)	2020年 6月 26日
	应用手册	Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS)	2020年 5月 18日
	应用手册	Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V	2020年 5月 18日
	技术文章	Bluetooth® Low Energy shifts gears for car access	2019年 7月 15日
	应用手册	Capturing Bluetooth Host Controller Interface (HCI) Logs	2019年 1月 7日
	技术文章	An out-of-the-box Internet of Things: building a seamless and secure smart home network	2018年 6月 12日
	技术文章	Thread vs. Zigbee – what’s the difference?	2018年 5月 16日
	白皮书	Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A)	2017年 10月 16日
	白皮书	Which TI Bluetooth Solution Should I choose?	2017年 5月 5日
	白皮书	Why Bluetooth Classic?	2017年 5月 4日
	更多文献资料	Streamline the challenges of RF design with certified wireless modules	2017年 1月 25日
	更多文献资料	SimpleLink Bluetooth CC256x Solutions (Rev. C)	2016年 2月 3日
	用户指南	TI Dual-mode Bluetooth Stack on STM32F4 MCUs User Guide	2015年 7月 8日
	用户指南	Dual-Mode Bluetooth CC2564 Module With Integrated Antenna Evaluation Board	2015年 7月 7日
	用户指南	CC2564MODA Evaluation Board Quick Start Guide	2015年 7月 1日
	白皮书	Three flavors of Bluetooth®: Which one to choose?	2014年 3月 25日

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TMP107 BoosterPack 模块

BOOST-CC2564MODA

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说明

The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA). The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design (...)

特性

Dual-mode (Bluetooth & Bluetooth low energy) Bluetooth Specification v4.1
Integrated antenna on CC2564MODA for ready to use application
FCC, IC, CE certified with a certified and royalty-free TI Bluetooth stack, getting started guide, demos, and UART and PCM/I2S Interface
Class 1.5 Transmit Power (...)

CC2564MODA

具有基本速率、增强数据速率和带集成天线的低功耗 (LE) 模块的 Bluetooth® 4.1

CC2564MODA

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