CC2564

不推荐用于新设计

具有增强数据速率 (EDR)、低功耗 (LE) 模块和 ANT 的 Bluetooth® 4.0

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数据表

document-pdfAcrobat CC256x Dual-Mode Bluetooth Controller 数据表 (Rev. E) (英语) PDF | HTML

CC2564 不推荐用于新设计

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功能与比较器件相同，且具有相同引脚

CC2564C

正在供货

具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Bluetooth® 5.1 Allows for certification to Bluetooth 5.1, high throughput, complex BLE topologies and LE secure connection

产品详情

Type

Transceiver

Protocols

Dual-mode Bluetooth

Features

Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power

Security

Networking security

Rating

Catalog

Operating temperature range (°C)

-40 to 85

Type

Transceiver

Protocols

Dual-mode Bluetooth

Features

Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power

Security

Networking security

Rating

Catalog

Operating temperature range (°C)

-40 to 85

VQFNP-MR (RVM)

76

64 mm² 8 x 8

TI’s Single-Chip Bluetooth Solution With Bluetooth
Basic Rate (BR), Enhanced Data Rate (EDR), and
Low Energy (LE) Support; Available in Two
Variants:
- Dual-Mode Bluetooth CC2564 Controller
- Bluetooth CC2560 Controller
CC2564 Bluetooth 4.1 Controller Subsystem
Qualified (QDID 58852); Compliant up to the HCI
Layer
Highly Optimized for Low-Cost Designs:
- Single-Ended 50-Ω RF Interface
- Package Footprint: 76 Terminals, 0.6-mm Pitch,
  8-mm x 8-mm mrQFN
BR/EDR Features Include:
- Up to 7 Active Devices
- Scatternet: Up to 3 Piconets Simultaneously, 1
  as Master and 2 as Slaves
- Up to 2 SCO Links on the Same Piconet
- Support for All Voice Air-Coding – Continuously
  Variable Slope Delta (CVSD), A-Law, µ-Law,
  and Transparent (Uncoded)
- CC2560B/CC2564B Devices Provide an
  Assisted Mode for HFP 1.6 Wideband Speech
  (WBS) Profile or A2DP Profile to Reduce Host
  Processing and Power
- Support of Multiple Bluetooth Profiles With
  Enhanced QoS
LE Features Include:
- Support of Up to 10 (CC2564B) Connections
- Multiple Sniff Instances Tightly Coupled to
  Achieve Minimum Power Consumption
- Independent Buffering for LE Allows Large
  Numbers of Multiple Connections Without
  Affecting BR/EDR Performance.
- Built-In Coexistence and Prioritization Handling
  for BR/EDR and LE
Best-in-Class Bluetooth (RF) Performance
(TX Power, RX Sensitivity, Blocking)
- Class 1 TX Power Up to +10 dBm
- –95 dbm Typical RX Sensitivity
- Internal Temperature Detection and
  Compensation to Ensure Minimal Variation in
  RF Performance Over Temperature, No
  External Calibration Required
- Improved Adaptive Frequency Hopping (AFH)
  Algorithm With Minimum Adaptation Time
- Provides Longer Range, Including 2x Range
  Over Other LE-Only Solutions
Advanced Power Management for Extended
Battery Life and Ease of Design
- On-Chip Power Management, Including Direct
  Connection to Battery
- Low Power Consumption for Active, Standby,
  and Scan Bluetooth Modes
- Shutdown and Sleep Modes to Minimize Power
  Consumption
Physical Interfaces:
- UART Interface With Support for Maximum
  Bluetooth Data Rates
  - UART Transport Layer (H4) With Maximum
    Rate of 4 Mbps
  - Three-Wire UART Transport Layer (H5) With
    Maximum Rate of 4 Mbps (CC2560B and
    CC2564B Only)
- Fully Programmable Digital PCM-I2S Codec
  Interface
Flexibility for Easy Stack Integration and Validation
Into Various Microcontrollers, Such as MSP430™
and ARM® Cortex®-M3 and Cortex®-M4 MCUs
CC256x Bluetooth Hardware Evaluation Tool: PC-
Based Application to Evaluate RF Performance of
the Device and Configure Service Pack
Device Pin-to-Pin Compatible With Previous
Devices or Modules

TI’s Single-Chip Bluetooth Solution With Bluetooth
Basic Rate (BR), Enhanced Data Rate (EDR), and
Low Energy (LE) Support; Available in Two
Variants:
- Dual-Mode Bluetooth CC2564 Controller
- Bluetooth CC2560 Controller
CC2564 Bluetooth 4.1 Controller Subsystem
Qualified (QDID 58852); Compliant up to the HCI
Layer
Highly Optimized for Low-Cost Designs:
- Single-Ended 50-Ω RF Interface
- Package Footprint: 76 Terminals, 0.6-mm Pitch,
  8-mm x 8-mm mrQFN
BR/EDR Features Include:
- Up to 7 Active Devices
- Scatternet: Up to 3 Piconets Simultaneously, 1
  as Master and 2 as Slaves
- Up to 2 SCO Links on the Same Piconet
- Support for All Voice Air-Coding – Continuously
  Variable Slope Delta (CVSD), A-Law, µ-Law,
  and Transparent (Uncoded)
- CC2560B/CC2564B Devices Provide an
  Assisted Mode for HFP 1.6 Wideband Speech
  (WBS) Profile or A2DP Profile to Reduce Host
  Processing and Power
- Support of Multiple Bluetooth Profiles With
  Enhanced QoS
LE Features Include:
- Support of Up to 10 (CC2564B) Connections
- Multiple Sniff Instances Tightly Coupled to
  Achieve Minimum Power Consumption
- Independent Buffering for LE Allows Large
  Numbers of Multiple Connections Without
  Affecting BR/EDR Performance.
- Built-In Coexistence and Prioritization Handling
  for BR/EDR and LE
Best-in-Class Bluetooth (RF) Performance
(TX Power, RX Sensitivity, Blocking)
- Class 1 TX Power Up to +10 dBm
- –95 dbm Typical RX Sensitivity
- Internal Temperature Detection and
  Compensation to Ensure Minimal Variation in
  RF Performance Over Temperature, No
  External Calibration Required
- Improved Adaptive Frequency Hopping (AFH)
  Algorithm With Minimum Adaptation Time
- Provides Longer Range, Including 2x Range
  Over Other LE-Only Solutions
Advanced Power Management for Extended
Battery Life and Ease of Design
- On-Chip Power Management, Including Direct
  Connection to Battery
- Low Power Consumption for Active, Standby,
  and Scan Bluetooth Modes
- Shutdown and Sleep Modes to Minimize Power
  Consumption
Physical Interfaces:
- UART Interface With Support for Maximum
  Bluetooth Data Rates
  - UART Transport Layer (H4) With Maximum
    Rate of 4 Mbps
  - Three-Wire UART Transport Layer (H5) With
    Maximum Rate of 4 Mbps (CC2560B and
    CC2564B Only)
- Fully Programmable Digital PCM-I2S Codec
  Interface
Flexibility for Easy Stack Integration and Validation
Into Various Microcontrollers, Such as MSP430™
and ARM® Cortex®-M3 and Cortex®-M4 MCUs
CC256x Bluetooth Hardware Evaluation Tool: PC-
Based Application to Evaluate RF Performance of
the Device and Configure Service Pack
Device Pin-to-Pin Compatible With Previous
Devices or Modules

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

Serial port profile (SPP)
Advanced audio distribution profile (A2DP)
Audio/video remote control profile (AVRCP)
Handsfree profile (HFP)
Human interface device (HID)
Generic attribute profile (GATT)
Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

Serial port profile (SPP)
Advanced audio distribution profile (A2DP)
Audio/video remote control profile (AVRCP)
Handsfree profile (HFP)
Human interface device (HID)
Generic attribute profile (GATT)
Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

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CC2564

具有增强数据速率 (EDR)、低功耗 (LE) 模块和 ANT 的 Bluetooth® 4.0

功能与比较器件相同，且具有相同引脚

CC2564

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技术文档

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