CC2564
- TI’s Single-Chip Bluetooth Solution With Bluetooth
Basic Rate (BR), Enhanced Data Rate (EDR), and
Low Energy (LE) Support; Available in Two
Variants:- Dual-Mode Bluetooth CC2564 Controller
- Bluetooth CC2560 Controller
- CC2564 Bluetooth 4.1 Controller Subsystem
Qualified (QDID 58852); Compliant up to the HCI
Layer - Highly Optimized for Low-Cost Designs:
- Single-Ended 50-Ω RF Interface
- Package Footprint: 76 Terminals, 0.6-mm Pitch,
8-mm x 8-mm mrQFN
- BR/EDR Features Include:
- Up to 7 Active Devices
- Scatternet: Up to 3 Piconets Simultaneously, 1
as Master and 2 as Slaves - Up to 2 SCO Links on the Same Piconet
- Support for All Voice Air-Coding – Continuously
Variable Slope Delta (CVSD), A-Law, µ-Law,
and Transparent (Uncoded) - CC2560B/CC2564B Devices Provide an
Assisted Mode for HFP 1.6 Wideband Speech
(WBS) Profile or A2DP Profile to Reduce Host
Processing and Power - Support of Multiple Bluetooth Profiles With
Enhanced QoS
- LE Features Include:
- Support of Up to 10 (CC2564B) Connections
- Multiple Sniff Instances Tightly Coupled to
Achieve Minimum Power Consumption - Independent Buffering for LE Allows Large
Numbers of Multiple Connections Without
Affecting BR/EDR Performance. - Built-In Coexistence and Prioritization Handling
for BR/EDR and LE
- Best-in-Class Bluetooth (RF) Performance
(TX Power, RX Sensitivity, Blocking)- Class 1 TX Power Up to +10 dBm
- –95 dbm Typical RX Sensitivity
- Internal Temperature Detection and
Compensation to Ensure Minimal Variation in
RF Performance Over Temperature, No
External Calibration Required - Improved Adaptive Frequency Hopping (AFH)
Algorithm With Minimum Adaptation Time - Provides Longer Range, Including 2x Range
Over Other LE-Only Solutions
- Advanced Power Management for Extended
Battery Life and Ease of Design- On-Chip Power Management, Including Direct
Connection to Battery - Low Power Consumption for Active, Standby,
and Scan Bluetooth Modes - Shutdown and Sleep Modes to Minimize Power
Consumption
- On-Chip Power Management, Including Direct
- Physical Interfaces:
- UART Interface With Support for Maximum
Bluetooth Data Rates- UART Transport Layer (H4) With Maximum
Rate of 4 Mbps - Three-Wire UART Transport Layer (H5) With
Maximum Rate of 4 Mbps (CC2560B and
CC2564B Only)
- UART Transport Layer (H4) With Maximum
- Fully Programmable Digital PCM-I2S Codec
Interface
- UART Interface With Support for Maximum
- Flexibility for Easy Stack Integration and Validation
Into Various Microcontrollers, Such as MSP430™
and ARM® Cortex®-M3 and Cortex®-M4 MCUs - CC256x Bluetooth Hardware Evaluation Tool: PC-
Based Application to Evaluate RF Performance of
the Device and Configure Service Pack - Device Pin-to-Pin Compatible With Previous
Devices or Modules
The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TIs seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TIs power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.
The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TIs MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TIs third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:
- Serial port profile (SPP)
- Advanced audio distribution profile (A2DP)
- Audio/video remote control profile (AVRCP)
- Handsfree profile (HFP)
- Human interface device (HID)
- Generic attribute profile (GATT)
- Several Bluetooth LE profiles and services
In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.
技术文档
设计和开发
如需其他信息或资源,请查看下方列表,点击标题即可进入详情页面。
BOOST-CC2564MODA — TMP107 BoosterPack 模块
The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA). The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design (...)
CC2564MODAEM — CC2564 具有集成天线的双模蓝牙模块评估板
CC2564MODAEM 评估板包含蓝牙 BR/EDR/LE HCI 解决方案。bCC2564MODA 基于 TI 的 CC2564B 双模蓝牙单芯片器件,旨在用于评估和设计,能够减少设计工作量,实现产品快速上市。
为了实现完整的评估,CC2564MODAEM 板直接插入 TI 硬件开发套件,包括 MSP-EXP430F5529、MSP-EXP430F5438、DK-TM4C123G 和 DK-TM4C129X。此外,MSP430 和 TM4C12x MCU 还可以使用通过认证且免专利费的 TI 蓝牙协议栈 (TIBLUETOOTHSTACK-SDK)。
CC2564MODA (...)
CC2564MODNEM — CC2564 Bluetooth® 双路模式模块评估版
CC2564MODNEM 评估板包含 CC2564MODN 器件,且专用于评估和设计。
为提供完整的评估解决方案,CC2564MODNEM 板可直接插入我们的硬件开发套件:MSP-EXP430F5529、MSP-EXP430F5438、DK-TM4C129X 和适用于其他 MCU 的套件。TI 的 Bluetooth® 协议栈已经过认证且免专利费,适用于 MSP430™ MCU (CC256XMSPBTBLESW)、TM4C12x MCU (CC256XM4BTBLESW) 和其他 MCU (CC256XSTBTBLESW)。
提供的 CC2564MODNEM 硬件设计文件(原理图、布局和 (...)
CC256XQFNEM — 双模 Bluetooth® CC2564 评估板
CC256XQFNEM 评估板包含 CC2564B 器件,用于 CC256x 器件的评估和设计。
为实现完整的评估解决方案,CC256XQFNEM 评估板可直接插入 TI 硬件开发套件中:MSP-EXP430F5529、MSP-EXP430F5438、DK-TM4C129X 和其他 MCU。此外,MSP430 (CC256XMSPBTBLESW)、TM4C12x MCU (CC256XM4BTBLESW) 和其他 MCU (CC256XSTBTBLESW) 还可以使用经过认证且免专利费的 TI 蓝牙协议栈。
CC256XQFNEM 硬件设计文件(原理图、布局和 BOM)作为参考提供,以帮助实施 (...)
DK-TM4C123G — Tiva™ C 系列 TM4C123G USB+CAN 开发套件
The Tiva C Series TM4C123G Development Kit is a compact and versatile evaluation platform for the Tiva C Series TM4C123G ARM® Cortex™-M4-based microcontroller (MCU). The development kit design highlights the TM4C123G MCU integrated USB 2.0 On-the-Go/Host/Device interface, CAN, precision (...)
EK-TM4C129EXL — TM4C129E Cypto Connected LaunchPad
注意:EK-TM4C129EXL 当前促销价截至 10 月 5 日。立即下单吧!
Crypto Connected LaunchPad 搭载了经过硬件加密且具备加速器功能的 MCU,使您能够开发高性能、数据受保护的互联式物联网应用,涵盖从安全云连接、楼宇/工厂自动化和智能电网到工业控制等多种应用。
TM4C129E Crypto Connected LaunchPad 评估套件是基于 ARM® Cortex-M4 的微控制器的低成本评估平台。此套件的重点在于 TM4C129ENCPDT MCU 及片上加密加速硬件、10/100 以太网 MAC 和 PHY、USB (...)
MSP-EXP430F5529 — MSP430F5529 USB 实验板
MSP430F5529 实验板 (MSP-EXP430F5529) 是一个用于 MSP430F5529 器件(来自最新一代具有集成 USB 的 MSP430 器件)的开发平台。该实验板与 CC2520EMK 等众多 TI 低功耗射频无线评估模块兼容。该实验板能帮助设计者快速使用新的 F55xx MCU 进行学习和开发,其中 F55xx MCU 为能量收集、无线传感以及自动抄表基础设施 (AMI) 等应用提供了业界最低工作功耗的集成 USB、更大的内存和领先的集成技术。
该实验板上的 MSP430F5529 器件可以通过集成 ezFET 或通过 TI 闪存仿真工具(如 (...)
CC256XSTBTBLESW — 基于 STM32F4 MCU 的 TI 双模 Bluetooth® 协议栈
TI 出品的适用于蓝牙 + 蓝牙低功耗的 STM32F4 MCU 软件上的双模蓝牙堆栈可实现 STM32 ARM Cortex M4,且由用于实施蓝牙 4.0 规范的单模和双模产品所构成。该蓝牙堆栈已完全通过认证(QDID 37180 或 QDID 69887 以及 QDID 42849 或 QDID 69886),可提供简易命令行采样应用以加速开发,并可按需提供 MFI 功能。
为实现完整的评估解决方案,CC256XSTBTBLESW 可直接与硬件开发套件 STM3240G-EVAL 搭配使用。此外,适用于 STM32 MCU 的堆栈已通过认证且免专利费 (CC256XSTBTBLESW)。
(...)
TIBLUETOOTHSTACK-SDK — 基于 Stonestreet One Bluetopia 的 TI 蓝牙堆栈
TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth Low Energy and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0/4.1/4.2 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, (...)
CC256XM4BTBLESW — 基于 TM4C MCU 的 TI 双模 Bluetooth® 协议栈
CC256XM4BTBLESW 直接与 TI 硬件开发套件 DK-TM4C123G 和 DK-TM4C129X 配合工作。此外,适用于 TM4C12x MCU 的堆栈已通过认证且免专利费。
该软件可与所有 CC256x EM 板(CC256XQFNEM 和 (...)
CC256XMS432BTBLESW — 基于 MSP432 MCU 的 TI 双模蓝牙协议栈
CC256XMSPBTBLESW — 用于 MSP430 上的 CC256x 的 Stonestreet One BT+BLE 堆栈和配置文件
为实现完整的评估解决方案,CC256XMSPBTBLESW 可直接与 TI 硬件开发套件 MSP-EXP430F5529 和 MSP-EXP430F5438 搭配使用。此外,适用于 MSP430 MCU 的堆栈已通过认证且免专利费。
该软件可与所有 CC256x EM (...)
SWRC256 — CC256x 蓝牙硬件评估工具
CC256X-CERTIFICATION — 适用于双模蓝牙的无线电认证
3P-WIRELESS-MODULES — 第三方无线模块搜索工具
DUALMODE-BT-DESIGN-REVIEWS — CC256x 设备的硬件设计评审
- 第 1 步:申请审查前,需查看相应产品页面上的技术文档及设计与开发资源(请参阅下面 CC256x 产品页面的链接)。
- 第 2 步:填写申请表,开始审查流程。TI 专家将通过您提供的电子邮件地址直接与您联系,为您提供后续步骤。
在双模 BT 硬件设计审查流程中,您可与主题专家一对一沟通,专家会帮您审查设计并提供重要反馈。申请审查前,需查看相应产品页面上的技术文档及设计与开发资源。了解产品页面上的资源后,您可能无需申请设计审查。< /p>
申请审查双模 BT 硬件设计前,应在我们的 E2E 论坛上提交一般设计问题。
审查过程中,我们会联系您提供以下信息:
- (...)
BT-MSPAUDSINK-RD — 蓝牙 和 MSP430 音频信宿参考设计
CC256XEM-RD — CC256x Bluetooth® 参考设计
TIDA-00598 — 用于 CC256X 蓝牙控制器的低噪声、小外形电源管理参考设计
BT-MSPAUDSOURCE-RD — 蓝牙和 MSP430 音频源参考设计
封装 | 引脚数 | 下载 |
---|---|---|
VQFNP-MR (RVM) | 76 | 了解详情 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 认证摘要
- 持续可靠性监测
推荐产品可能包含与 TI 此产品相关的参数、评估模块或参考设计。