产品详情

CPU Arm Cortex-R5F Frequency (MHz) 400 Protocols GPIO, I2C, JTAG, SPI, UART Hardware accelerators C66x Core, HWA 2.0 Accelerator Features 2x CSI-2, C66x DSP, Radar Hardware Accelerator, Radar hardware accelerator Operating system FreeRTOS Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage Rating Catalog Operating temperature range (°C) -40 to 105 Ethernet MAC only
CPU Arm Cortex-R5F Frequency (MHz) 400 Protocols GPIO, I2C, JTAG, SPI, UART Hardware accelerators C66x Core, HWA 2.0 Accelerator Features 2x CSI-2, C66x DSP, Radar Hardware Accelerator, Radar hardware accelerator Operating system FreeRTOS Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage Rating Catalog Operating temperature range (°C) -40 to 105 Ethernet MAC only
NFBGA (ZCE) 285 169 mm² (13 mm × 13 mm)

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB I-Cache and 32KB D-Cache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating up to 550MHz (17.6 GMAC)

Memory subsystem:

  • Up to 5.0MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0MHz crystal with internal oscillator
    • Supports external oscillator at 40/50MHz
    • Supports externally driven clock (Square/Sine) at 40/50MHz

High-speed Serial Interfaces:

  • 10/100Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)
    • 3x Multi-channel Audio Serail Port (McASP)
    • Audio Tracking Logic (ATL)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Recommend LP87745-Q1 Power Management ICs (PMIC)
  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety Quality Managed
    • Documentation will be available to aid ISO 26262 functional safety system design
  • AEC-Q100 Qualified
  • Operating Conditions
    • Extended automotive grade temperature range supported
    • Extended industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • NZN (225-pin) nFBGA package 13mm x 13mm, 0.80 mm pitch

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB I-Cache and 32KB D-Cache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating up to 550MHz (17.6 GMAC)

Memory subsystem:

  • Up to 5.0MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0MHz crystal with internal oscillator
    • Supports external oscillator at 40/50MHz
    • Supports externally driven clock (Square/Sine) at 40/50MHz

High-speed Serial Interfaces:

  • 10/100Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)
    • 3x Multi-channel Audio Serail Port (McASP)
    • Audio Tracking Logic (ATL)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Recommend LP87745-Q1 Power Management ICs (PMIC)
  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety Quality Managed
    • Documentation will be available to aid ISO 26262 functional safety system design
  • AEC-Q100 Qualified
  • Operating Conditions
    • Extended automotive grade temperature range supported
    • Extended industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • NZN (225-pin) nFBGA package 13mm x 13mm, 0.80 mm pitch

The AM273x family of microcontrollers are highly-integrated, high-performance microcontrollers based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance. The device offers the maximum flexibility of a fully integrated, mixed processor design.

With an integrated Hardware Security Module (HSM), functional safety support built in, large, integrated RAM on die, and a wide temperature range, the AM273x offers a safe, secure and cost effective design for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

The AM273x family of microcontrollers are highly-integrated, high-performance microcontrollers based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance. The device offers the maximum flexibility of a fully integrated, mixed processor design.

With an integrated Hardware Security Module (HSM), functional safety support built in, large, integrated RAM on die, and a wide temperature range, the AM273x offers a safe, secure and cost effective design for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

下载 观看带字幕的视频 视频

您可能感兴趣的相似产品

open-in-new 比较替代产品
功能与比较器件相同且具有相同引脚。
AM2732-Q1 正在供货 具有 C66x DSP、以太网、功能安全和信息安全且频率高达 400MHz 的汽车类双核 Arm® Cortex-R5F MCU Automotive qualified version of AM2732

技术文档

未找到结果。请清除搜索并重试。
查看全部 14
顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
* 数据表 AM273x Sitara™ Microcontrollers 数据表 (Rev. D) PDF | HTML 2026-7-14
* 用户指南 AM273x Technical Reference Manual (Rev. E) 2025-4-10
* 勘误表 AM273x Sitara 微控制器器件勘误表 (Rev. C) PDF | HTML 英语版 (Rev.C) PDF | HTML 2025-6-18
应用简报 AM273x QSPI 闪存选择指南 (Rev. A) PDF | HTML 英语版 (Rev.A) PDF | HTML 2025-4-25
应用手册 Jacinto™ 和 Sitara™ 嵌入式处理器上的微控制器抽象层 PDF | HTML 英语版 PDF | HTML 2025-3-6
应用手册 AM273x 硬件设计指南 (Rev. A) PDF | HTML 英语版 (Rev.A) PDF | HTML 2023-12-5
产品概述 AM2x 和 Hercules™ 微控制器的功能安全 PDF | HTML 英语版 PDF | HTML 2023-11-9
应用手册 Sitara MCU 热设计 PDF | HTML 英语版 PDF | HTML 2023-9-19
应用手册 在 SITARA MCU 器件上集成 MbedTLS PDF | HTML 英语版 PDF | HTML 2023-8-3
用户指南 使用 AM263 的 10kW 三相三级(T 型)逆变器 PDF | HTML 英语版 PDF | HTML 2023-7-12
应用手册 Debugging Sitara AM2x Microcontrollers PDF | HTML 2022-10-24
应用手册 Optimized Trigonometric Functions on TI Arm Cores (Rev. A) PDF | HTML 2022-8-8
更多文献资料 New Product Update: AM2732 2022-3-17
应用手册 Power Estimation Tool PDF | HTML 2021-12-1

设计与开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

AWR2243BOOST — AWR2243 第二代 76GHz 至 81GHz 高性能汽车 MMIC 评估模块

AWR2243 BoosterPack™ 插件模块是一款面向单芯片 AWR2243 毫米波传感器件的易用型评估板。

AWR2243BOOST 包含使用 MMWAVE-STUDIO 环境和 DCA1000 实时数据捕获适配器开始开发所需的一切资源。

通过标配 20 引脚 BoosterPack 插件模块接头,该评估板可与多种 MCU LaunchPad 开发套件兼容并简化原型设计工作。

用户指南: PDF
支持的产品和硬件
有库存
限制:
??asset.out-of-stock-ti_zh_CN??
无货
评估板

TMDS273EVM — AM273x 基于 Arm 的 MCU 评估模块

AM273x 评估模块 (EVM) 是一个独立的测试、开发和评估平台,可使开发人员评估 AM273x 的功能并开发适用于各种应用的原型。

‌TMDS273EVM 配备了 Sitara™ AM2732 微控制器以及其他元件,使用户可以利用各种器件接口,包括 CSI-2 RX、以太网、双路 CAN-FD 等,从而轻松创建原型。板载电流测量功能可为功耗敏感型应用监测功耗。随附的 USB 电缆与嵌入式仿真逻辑配套,可以使用标准开发工具(例如 Code Composer Studio (CCSTUDIO))进行仿真和调试。

请注意,TMDS273EVM 是 TMS273GPEVM (...)

用户指南: PDF | HTML
支持的产品和硬件
有库存
限制:
??asset.out-of-stock-ti_zh_CN??
无货
调试探针

TMDSEMU110-U — XDS110 JTAG 调试探针

德州仪器 (TI) 的 XDS110 是一款适用于 TI 嵌入式处理器的新型调试探针(仿真器)。XDS110 取代了 XDS100 系列,同时在单个仓体中支持更广泛的标准(IEEE1149.1、IEEE1149.7、SWD)。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 Arm® 和 DSP 处理器,所有 XDS 调试探针均支持核心和系统跟踪。  对于引脚上的内核跟踪,则需要使用 XDS560v2 PRO TRACE

德州仪器 (TI) 的 XDS110 通过 TI 20 引脚连接器(带有适合 TI 14 引脚、Arm 10 引脚和 Arm 20 引脚的多个适配器)连接到目标板,通过 (...)

支持的产品和硬件
有库存
限制:
??asset.out-of-stock-ti_zh_CN??
无货
调试探针

TMDSEMU560V2STM-UE — Spectrum Digital XDS560v2 系统跟踪 USB 和以太网

XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS (...)

支持的产品和硬件
有库存
限制:
??asset.out-of-stock-ti_zh_CN??
无货
调试探针

LB-3P-TRACE32-ARM — 适用于基于 Arm® 的微控制器和处理器的 Lauterbach TRACE32® 调试和跟踪系统

Lauterbach TRACE32® 工具是一套先进的硬件和软件组件,开发人员可通过它分析、优化和认证各种基于 Arm® 的微控制器和处理器。这套全球知名的嵌入式系统和 SoC 调试和跟踪解决方案是所有开发阶段(从器件前开发一直到产品认证和现场故障排查)的理想解决方案。Lauterbach 工具直观的模块化设计可为工程师提供当今最高的可用性能,并提供可随需求变化而调整和扩展的系统。借助 TRACE32® 调试器,开发人员还可以通过单个调试接口同时调试和控制 SoC 中的任何 C28x/C29x C6x/C7x DSP 内核以及所有其他 Arm 内核,这是业界的一项独特功能。

来源:Lauterbach GmbH
支持的产品和硬件
调试探针

TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

支持的产品和硬件
Third-party accessory

VCTR-3P-VX1000 — VX1000 测量和校准接口硬件

VX1000 硬件使 CANape 等测量与校准工具能够以高性能且对运行时影响极小的方式访问 ECU。该硬件专为汽车应用设计,但同样适用于测试平台和实验室环境。凭借其高度的可扩展性和丰富的产品组合,VX1000 硬件可为各种应用场景提供合适的解决方案。
系统由两大主要组件组成:基础模块和插接器件。VX1000 系列支持多种控制器,包括 Sitara 系列(AM263、AM263P、AM275)、Jacinto 系列 (TDA4)、AWR1843、AWR2944、MSPM0x 以及 TM4C129。JTAG、SWD、Aurora 与 Nexus-Aux 是 VX1000 直接支持的主流控制器接口。

支持的产品和硬件
软件开发套件 (SDK)

EP-DSP-TPR12-SECURITY — Preliminary software & documents for early engagement customers

MCU+ SDK(软件开发套件)是面向 TI 嵌入式处理器的统一软件平台,设置简单,可提供开箱即用的示例、基准测试和例程。  此软件无需从头开始创建基本系统软件功能,可加快应用开发进程。

该 SDK 支持 R5F 和 C66x DSP 内核、示例、驱动程序和引导加载程序。此 SDK 包含的具体内容取决于器件功能,但所有器件共用一套通用的 API(应用程序编程接口),并基于经过验证的现有软件组件进行构建,可确保可靠性和质量。这些软件组件经过全面测试,可确保在 TI 的 Code Composer Studio 集成式开发环境中协同工作。

软件支持:

TIFS 和密钥编写器包:TI 基础安全 (...)

支持的产品和硬件
软件开发套件 (SDK)

MCU-PLUS-SDK-AM273X — MCU+ SDK for AM273x – RTOS, No-RTOS

MCU+ SDK(软件开发套件)是面向 TI 嵌入式处理器的统一软件平台,设置简单,可提供开箱即用的示例、基准测试和例程。  此软件无需从头开始创建基本系统软件功能,可加快应用开发进程。

该 SDK 支持 R5F 和 C66x DSP 内核、示例、驱动程序和引导加载程序。此 SDK 包含的具体内容取决于器件功能,但所有器件共用一套通用的 API(应用程序编程接口),并基于经过验证的现有软件组件进行构建,可确保可靠性和质量。这些软件组件经过全面测试,可确保在 TI 的 Code Composer Studio 集成式开发环境中协同工作。

软件支持:

TIFS 和密钥编写器包:TI 基础安全 (...)

支持的产品和硬件
软件开发套件 (SDK)

MMWAVE-MCUPLUS-SDK — mmWave SDK for AWR2944 and AM2732

毫米波微控制器 (MCU) 加上软件开发套件 (SDK) 构成软件包集合,用于实现 TI 毫米波传感器的应用评估和开发。此工具包括 MMWAVE-MCUPLUS-SDK 和配套包以支持设计需求。

MMWAVE-MCUPLUS-SDK 是统一的毫米波检测产品系列用软件平台,不仅设置简单,还可实现开箱即用的快速评估和开发。MMWAVE-MCUPLUS-SDK 是客户应用开发所需的第二代基础软件包,其中包括构建块、演示和示例。

汽车领域的演示应用是为前置远距离雷达、超短距离雷达、车内乘员检测等量身定制的应用。

支持的产品和硬件
IDE、配置、编译器或调试器

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

支持的产品和硬件
IDE、配置、编译器或调试器

TSK-3P-VX-TOOLSET — 用于 Arm 的 TASKING VX-toolset

VX-toolset 是专为特定 Cortex-M 和 Cortex-R 核心器件设计的经认证编译器工具链,适用于安全关键型嵌入式软件开发。借助 Eclipse IDE 集成、高级多核支持和 TASKING BlueBox 调试程序兼容性,VX-toolset 简化了开发。已通过 TÜV NORD 认证,符合 ISO 26262 至 ASIL D 级以及 ISO 21434 标准。

支持的产品和硬件
线上培训

AM27X-ACADEMY — AM27x academy

AM27x Academy features easy-to-use training modules ranging from the basics of getting started to advanced development topics.
支持的产品和硬件
入门

TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
支持的产品和硬件
操作系统 (OS)

GHS-3P-UVELOSITY — Green Hills Software u-velOSity Safety RTOS

The µ-velOSity™ Safety RTOS is the smallest of Green Hills Software's real-time operating systems and was designed especially for microcontrollers. It supports a wide range of TI processor families using the Arm® Cortex-M or Cortex-R cores as a main CPU or as a co-processors (...)

支持的产品和硬件
软件编程工具

UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash 是 TI 庞大的 CCStudio™ 开发生态系统的成员并且是一款软件工具,用于对 TI 微控制器和无线连接器件上的片上闪存以及 TI 处理器的板载闪存进行编程。UniFlash 提供图形界面和命令行界面,可在桌面上或云中运行。

可以在 CCStudio 开发人员专区从云中运行 UniFlash,也可以将其下载并在 Windows®、Linux® 和 macOS® 计算机上使用。

请注意,毫米波、AMx、K2G 和 J7 器件不支持 macOS。AMx、K2G 和 J7 器件仅在命令行上受支持。

支持的产品和硬件
仿真模型

AM273x ZCE SR 1.0/1.2 BSDL Model

SPRM790.ZIP (3 KB) - BSDL 模型
支持的产品和硬件
仿真模型

AM273x ZCE SR 1.0/1.2 IBIS Model

SPRM789.ZIP (2167 KB) - IBIS 模型
支持的产品和硬件
仿真模型

AM273x ZCE SR 1.0/1.2 Thermal Model

SPRM788.ZIP (31 KB) - 热模型
支持的产品和硬件
计算工具

SPRM803 — AM273x Power Estimation Tool

支持的产品和硬件
封装 引脚 CAD 符号、封装和 3D 模型
NFBGA (ZCE) 285 Ultra Librarian

订购和质量

推荐产品可能包含与 TI 此产品相关的参数、评估模块或参考设计。

支持和培训

可获得 TI 工程师技术支持的 TI E2E™ 论坛

所有内容均由 TI 和社区贡献者按“原样”提供,并不构成 TI 规范。请参阅使用条款

如果您对质量、包装或订购 TI 产品有疑问,请参阅 TI 支持。​​​​​​​​​​​​​​

视频