Home Energiemanagement Leistungsstufen Galliumnitrid (GaN)-Leistungsstufen
NEU

LMG2650

AKTIV

650 V 95 mΩ GaN-Halbbrücke mit integriertem Treiber, Schutz und Strommessung

Produktdetails

VDS (max) (V) 650 RDS(on) (mΩ) 95 ID (max) (A) 9.7 Features Bottom-side cooled, Built-in bootstrap diode, Cycle-by-cycle overcurrent protection, Half-bridge, Integrated current sense, Overtemperature protection Rating Catalog Operating temperature range (°C) -40 to 125
VDS (max) (V) 650 RDS(on) (mΩ) 95 ID (max) (A) 9.7 Features Bottom-side cooled, Built-in bootstrap diode, Cycle-by-cycle overcurrent protection, Half-bridge, Integrated current sense, Overtemperature protection Rating Catalog Operating temperature range (°C) -40 to 125
VQFN (RFB) 19 48 mm² 8 x 6
  • GaN power-FET half bridge: 650V
  • Low-side and high-side GaN FETs: 95mΩ
  • Integrated gate drivers with low propagation delays: < 100ns
  • Programmable turn-on slew rate control
  • Current-sense emulation with high-bandwidth and high accuracy
  • Low-side referenced (INH) and high-side referenced (GDH) high-side gate drive pins
  • Low-side (INL) and high-side (INH) gate-drive interlock
  • High-side (INH) gate-drive signal level shifter
  • Smart-switched bootstrap diode function
  • High-side start up: <8µs
  • Low-side and high-side cycle-by-cycle overcurrent protection
  • Overtemperature protection
  • AUX idle quiescent current: 250µA
  • AUX standby quiescent current: 50µA
  • BST idle quiescent current: 70µA
  • 6mm × 8mm QFN package with dual thermal pads
  • GaN power-FET half bridge: 650V
  • Low-side and high-side GaN FETs: 95mΩ
  • Integrated gate drivers with low propagation delays: < 100ns
  • Programmable turn-on slew rate control
  • Current-sense emulation with high-bandwidth and high accuracy
  • Low-side referenced (INH) and high-side referenced (GDH) high-side gate drive pins
  • Low-side (INL) and high-side (INH) gate-drive interlock
  • High-side (INH) gate-drive signal level shifter
  • Smart-switched bootstrap diode function
  • High-side start up: <8µs
  • Low-side and high-side cycle-by-cycle overcurrent protection
  • Overtemperature protection
  • AUX idle quiescent current: 250µA
  • AUX standby quiescent current: 50µA
  • BST idle quiescent current: 70µA
  • 6mm × 8mm QFN package with dual thermal pads

The LMG2650 is a 650V 95mΩ GaN power-FET half bridge. The LMG2650 simplifies design, reduces component count, and reduces board space by integrating half-bridge power FETs, gate drivers, bootstrap FET, and high-side gate-drive level shifter in a 6mm × 8mm QFN package.

Programmable turn-on slew rates provide EMI and ringing control. The low-side current-sense emulation reduces power dissipation compared to the traditional current-sense resistor and allows the low-side thermal pad to connect to PCB power ground.

Control the high-side GaN power FET with either the low-side referenced gate-drive pin (INH) or the high-side referenced gate-drive pin (GDH). The high-side gate-drive signal level shifter reliably transmits the INH pin signal to the high-side gate driver in challenging power switching environments. The smart-switched GaN bootstrap FET has no diode forward-voltage drop, avoids overcharging the high-side supply, and has zero reverse-recovery charge.

The LMG2650 supports converter light-load efficiency requirements and burst-mode operation with low quiescent currents and fast start-up times. Protection features include FET turn-on interlock, under-voltage lockout (UVLO), cycle-by-cycle current limit, and over-temperature shut down. Ultra low slew rate setting supports motor drive applications.

The LMG2650 is a 650V 95mΩ GaN power-FET half bridge. The LMG2650 simplifies design, reduces component count, and reduces board space by integrating half-bridge power FETs, gate drivers, bootstrap FET, and high-side gate-drive level shifter in a 6mm × 8mm QFN package.

Programmable turn-on slew rates provide EMI and ringing control. The low-side current-sense emulation reduces power dissipation compared to the traditional current-sense resistor and allows the low-side thermal pad to connect to PCB power ground.

Control the high-side GaN power FET with either the low-side referenced gate-drive pin (INH) or the high-side referenced gate-drive pin (GDH). The high-side gate-drive signal level shifter reliably transmits the INH pin signal to the high-side gate driver in challenging power switching environments. The smart-switched GaN bootstrap FET has no diode forward-voltage drop, avoids overcharging the high-side supply, and has zero reverse-recovery charge.

The LMG2650 supports converter light-load efficiency requirements and burst-mode operation with low quiescent currents and fast start-up times. Protection features include FET turn-on interlock, under-voltage lockout (UVLO), cycle-by-cycle current limit, and over-temperature shut down. Ultra low slew rate setting supports motor drive applications.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 1
Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet LMG2650 650V 95 mΩ GaN Half Bridge With Integrated Driver and Current Sense Emulation datasheet (Rev. B) PDF | HTML 26 Feb 2026

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Tochterkarte

LMG2650EVM-100 — LMG2650 Halbbrücken-Tochterkarten-Evaluierungsmodul

Das LMG2650EVM-100 wurde entwickelt, um eine schnelle und einfache Plattform für die Evaluierung der integrierten GaN-Bausteine von TI in beliebigen Halbbrückentopologien zu bieten. Die Platine ist für die Anbindung an ein größeres System unter Verwendung der 6 Stromversorgungspins und 12 (...)
Benutzerhandbuch: PDF | HTML
Simulationsmodell

LMG2650 SIMPLIS Model

SNOM813.ZIP (69 KB) - SIMPLIS Model
Berechnungstool

LMGXX-GAN-LLC-CALC GaN LLC resonant converter device loss calculator

Device Loss Calculator can be used to evaluate different devices for different topologies of the LLC Resonant Converter
Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Referenzdesigns

PMP41140 — 280W digital asymmetrical half bridge (AHB) DC-DC converter reference design

This document provides the test report for a digitally controlled asymmetrical half-bridge (AHB) converter, a flyback-derived resonant topology designed for high- efficiency and wide-output power conversion. The control algorithm implements zero-voltage switching (ZVS) control using a fast (...)
Test report: PDF
Referenzdesigns

TIDA-010282 — Referenzdesign für Totem-Pole-Leistungsfaktorkorrektur mit 1,3 kW und Motorinverter

Bei diesem Referenzdesign handelt es sich um eine Totem-Pole-Leistungsfaktorkorrektur (PFC) mit 1,3 kW und einen Motorinverter für große Haushaltsgeräte und ähnliche Produkte. Das Design veranschaulicht eine Methode zur Implementierung eines digitalen Totem-Pole-PFC und der sensorlosen (...)
Design guide: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VQFN (RFB) 19 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos