The LMG352xR050
GaN FET with integrated driver and protection is targeted at switch-mode power converters
and enables designers to achieve new levels of power density and efficiency.
The LMG352xR050
integrates a silicon driver that enables switching speed up to 150V/ns. TI’s integrated
precision gate bias results in higher switching SOA compared to discrete silicon gate
drivers. This integration, combined with TIs low-inductance package, delivers clean
switching and minimal ringing in hard-switching power supply topologies. Adjustable gate
drive strength allows control of the slew rate from 15V/ns to
150V/ns, which can be used to actively control EMI and optimize switching performance. The LMG3526R050 includes the zero-voltage
detection (ZVD) feature which provides a pulse output from the ZVD pin when zero-voltage
switching is realized.
Advanced power management features include
digital temperature reporting and fault
detection.
The temperature of the GaN FET is reported through a variable duty cycle PWM output, which
simplifies managing device loading. Faults reported include overcurrent, short-circuit,
overtemperature, VDD UVLO, and high-impedance RDRV pin.
The LMG352xR050
GaN FET with integrated driver and protection is targeted at switch-mode power converters
and enables designers to achieve new levels of power density and efficiency.
The LMG352xR050
integrates a silicon driver that enables switching speed up to 150V/ns. TI’s integrated
precision gate bias results in higher switching SOA compared to discrete silicon gate
drivers. This integration, combined with TIs low-inductance package, delivers clean
switching and minimal ringing in hard-switching power supply topologies. Adjustable gate
drive strength allows control of the slew rate from 15V/ns to
150V/ns, which can be used to actively control EMI and optimize switching performance. The LMG3526R050 includes the zero-voltage
detection (ZVD) feature which provides a pulse output from the ZVD pin when zero-voltage
switching is realized.
Advanced power management features include
digital temperature reporting and fault
detection.
The temperature of the GaN FET is reported through a variable duty cycle PWM output, which
simplifies managing device loading. Faults reported include overcurrent, short-circuit,
overtemperature, VDD UVLO, and high-impedance RDRV pin.