产品详细信息

Vin (Min) (V) 2.7 Vin (Max) (V) 5.5 Continuous current (Max) (A) 0.5 Current limit (A) 1 Product type Fixed current limit, Power switch Operating temperature range (C) -40 to 125 Enable Active Low Number of switches 1 Rating Catalog
Vin (Min) (V) 2.7 Vin (Max) (V) 5.5 Continuous current (Max) (A) 0.5 Current limit (A) 1 Product type Fixed current limit, Power switch Operating temperature range (C) -40 to 125 Enable Active Low Number of switches 1 Rating Catalog
HVSSOP (DGN) 8 9 mm² 3 x 3 SOIC (D) 8 19 mm² 3.91 x 4.9 SOT-23 (DBV) 5 5 mm² 2.9 x 1.6
  • 70-mΩ High-Side MOSFET
  • 500-mA Continuous Current
  • Thermal and Short-Circuit Protection
  • Accurate Current Limit
    (0.75 A Minimum, 1.25 A Maximum)
  • Operating Range: 2.7 V to 5.5 V
  • 0.6-ms Typical Rise Time
  • Undervoltage Lockout
  • Deglitched Fault Report (OC)
  • No OC Glitch During Power Up
  • Maximum Standby Supply Current:
    1-µA (Single, Dual) or 2-µA (Triple, Quad)
  • Ambient Temperature Range: –40°C to 85°C
  • UL Recognized, File Number E169910
  • Additional UL Recognition for TPS2042B and TPS2052B for Ganged Configuration
  • 70-mΩ High-Side MOSFET
  • 500-mA Continuous Current
  • Thermal and Short-Circuit Protection
  • Accurate Current Limit
    (0.75 A Minimum, 1.25 A Maximum)
  • Operating Range: 2.7 V to 5.5 V
  • 0.6-ms Typical Rise Time
  • Undervoltage Lockout
  • Deglitched Fault Report (OC)
  • No OC Glitch During Power Up
  • Maximum Standby Supply Current:
    1-µA (Single, Dual) or 2-µA (Triple, Quad)
  • Ambient Temperature Range: –40°C to 85°C
  • UL Recognized, File Number E169910
  • Additional UL Recognition for TPS2042B and TPS2052B for Ganged Configuration

The TPS20xxB power-distribution switches are intended for applications where heavy capacitive loads and short circuits are likely to be encountered. These devices incorporates 70-mΩ N-channel MOSFET power switches for power-distribution systems that require multiple power switches in a single package. Each switch is controlled by a logic enable input. Gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no external components and allows operation from supplies as low as 2.7 V.

When the output load exceeds the current-limit threshold or a short is present, the device limits the output current to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When continuous heavy overloads and short circuits increase the power dissipation in the switch, causing the junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains off until valid input voltage is present. This power-distribution switch is designed to set current limit at 1 A (typical).

The TPS20xxB power-distribution switches are intended for applications where heavy capacitive loads and short circuits are likely to be encountered. These devices incorporates 70-mΩ N-channel MOSFET power switches for power-distribution systems that require multiple power switches in a single package. Each switch is controlled by a logic enable input. Gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no external components and allows operation from supplies as low as 2.7 V.

When the output load exceeds the current-limit threshold or a short is present, the device limits the output current to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When continuous heavy overloads and short circuits increase the power dissipation in the switch, causing the junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains off until valid input voltage is present. This power-distribution switch is designed to set current limit at 1 A (typical).

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技术文档

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类型 项目标题 下载最新的英语版本 日期
* 数据表 TPS20xxB Current-Limited, Power-Distribution Switches 数据表 (Rev. M) PDF | HTML 19 Jun 2016
证书 US-36986-UL Certificate of Compliance IEC 62368-1 12 Mar 2021
EVM 用户指南 Single Channel Power-Distribution Switch EVM (Rev. B) 17 Dec 2007
EVM 用户指南 HPA228A/HPA240A Power-Distribution Switch (Rev. A) 01 Jun 2007
用户指南 HPA228A/HPA240A Power-Distribution Switch 22 Mar 2007

设计和开发

如需其他信息或资源,请查看下方列表,点击标题即可进入详情页面。

评估板

TPS2041BEVM — TPS2041B 评估模块

The TPS2041BEVM provides a means for the user to quickly evaluate the functionality and electrical performance of the TPS2041B. All inputs and outputs are brought out to test points for control and monitoring. All passive components are included on the EVM for device operation.

用户指南: PDF
TI.com 無法提供
评估板

TPS2041BEVM-290 — TPS2041B 评估模块

The TPS2041BEVM-290 is an evaluation module for the Texas Instruments family of single-channel, current limited, power distribution switches. These EVMs operate over a 2.7 V to 5.5 V range and provide a continuous output current of up to 2 A. Test points provide convenient access (...)

用户指南: PDF
TI.com 無法提供
评估板

TPS2041BEVM-292 — TPS2041B 评估模块

用户指南: PDF
TI.com 無法提供
开发套件

MSP-EXP430F5529LP — MSP430F5529 USB LaunchPad™ development kit

用户指南: PDF | HTML
仿真模型

TPS2041B TINA-TI Transient Reference Design

SLVM492.TSC (649 KB) - TINA-TI Reference Design
仿真模型

TPS2041B TINA-TI Transient Spice Model

SLVM493.ZIP (36 KB) - TINA-TI Spice Model
仿真模型

TPS2041B Unencrypted PSpice Transient Model Package (Rev. A)

SLVM381A.ZIP (32 KB) - PSpice Model
参考设计

TIDEP0040 — 软件无线电 (SDR) 基于 OMAPL-138 的硬件/软件参考设计

软件定义无线电 (SDR) 是无线基础设施市场上流行的应用。这一硬件参考设计利用 TI DSP 的实时信号处理功能及其通用并行端口 (uPP),以及 TI ADC 和 DAC,为 SDR 算法开发人员提供快速平台,实现算法和解决方案的快速开发和演示。
设计指南: PDF
原理图: PDF
参考设计

TIDEP0038 — 视觉分析基于 OMAPL-138 的硬件/软件参考平台参考设计

视觉分析对于许多工业自动化应用来说是一项关键的功能,包括机器视觉、检查自动化、监控和图像处理。此硬件/软件设计套件已针对基于视觉的应用进行优化,提供所有硬件设计元素,以及基于 C、C++ 的基础软件,让参考设计迅速投入使用,同时其灵活性让开发人员可以专注于添加差异化的应用算法和功能。
设计指南: PDF
原理图: PDF
封装 引脚数 下载
HVSSOP (DGN) 8 了解详情
SOIC (D) 8 了解详情
SOT-23 (DBV) 5 了解详情

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

支持与培训

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