ZHCA962 October   2019

 

  1.    说明
  2.    资源
  3.    特性
  4.    应用
  5.    设计图像
  6. 1System Description
    1. 1.1 Key System Specifications
    2. 1.2 Description
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Input Power
        1. 2.2.1.1 Vpwr
        2. 2.2.1.2 3.3 V
        3. 2.2.1.3 3.3 V_ISO
      2. 2.2.2 Communication Interface
        1. 2.2.2.1 PSE I2C Communication
        2. 2.2.2.2 MCU - Host Communication
      3. 2.2.3 MSP430F523x Hardware Design
    3. 2.3 Highlighted Products
      1. 2.3.1  TPS23882
      2. 2.3.2  MSP430F523x
      3. 2.3.3  ISO7741
      4. 2.3.4  ISO7731
      5. 2.3.5  CSD19538
      6. 2.3.6  LM5017
      7. 2.3.7  LM5020
      8. 2.3.8  LM5050
      9. 2.3.9  INA240
      10. 2.3.10 REF3425
      11. 2.3.11 TPS3890
  8. 3Hardware, Software, Testing Requirement and Test Result
    1. 3.1 Required Hardware and Software
      1. 3.1.1 Hardware
      2. 3.1.2 Software
    2. 3.2 Testing and Results
      1. 3.2.1 Test Setup
        1. 3.2.1.1 Hardware Setup
        2. 3.2.1.2 LED, Test Point, Jumper and Connector Settings
          1. 3.2.1.2.1 EVM LEDs
          2. 3.2.1.2.2 EVM Test Points
          3. 3.2.1.2.3 EVM Jumpers
          4. 3.2.1.2.4 EVM Input and Output Connectors
        3. 3.2.1.3 System Firmware GUI Setup
          1. 3.2.1.3.1 PSE System Firmware GUI Installation
          2. 3.2.1.3.2 PSE System Firmware GUI Operation
      2. 3.2.2 Test Results
  9. 4Design Files
    1. 4.1 Schematic
    2. 4.2 Bill of Materials
    3. 4.3 PCB Layout Recommendations
      1. 4.3.1 Layout Prints
    4. 4.4 Altium Project
    5. 4.5 Gerber Files
    6. 4.6 Assembly Drawings
  10. 5Software Files
  11. 6Related Documentation
    1. 6.1 商标

2.3.5 CSD19538

This 100-V, 49-mΩ, SON 3.3-mm × 3.3-mm NexFET™ power MOSFET is designed to minimize conduction losses and reduce the board footprint in PoE applications.