SFFSAY3 January   2026 F29H850TU , F29H859TU-Q1 , TMCS1123 , TMCS1123-Q1 , TPS650362-Q1 , TPS650365-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 Background
    2. 1.2 HW/SW FuSa Analysis Process
      1. 1.2.1 Item Definition
      2. 1.2.2 Functional Safety Goal
      3. 1.2.3 Functional Safety Concept
      4. 1.2.4 Technical Safety Concept
      5. 1.2.5 HW/SW Safety Requirement
      6. 1.2.6 Dependent‑failure Analysis
    3. 1.3 TI Collaterals
      1. 1.3.1 TI Components Category
      2. 1.3.2 FuSa Collaterals for Safety MCU
  5. 2FuSa Concepts of OBC System
    1. 2.1 Item Definition
      1. 2.1.1 Item Functions
      2. 2.1.2 System Boundaries
      3. 2.1.3 External Interfaces
      4. 2.1.4 Operation Modes
    2. 2.2 Functional Safety Goal
    3. 2.3 Functional Safety Concept
    4. 2.4 Technical Safety Concept
    5. 2.5 HW/SW Safety Requirement
    6. 2.6 Dependent‑Failure Analysis
  6. 3FuSa Components of OBC System
    1. 3.1 Components Overview
    2. 3.2 Microcontroller
      1. 3.2.1 CPU
      2. 3.2.2 ADC Sample
      3. 3.2.3 PWM Generation
      4. 3.2.4 CMPSS
      5. 3.2.5 Data Transmission
      6. 3.2.6 Fault Signal Monitor and Safe State Control
    3. 3.3 Power Management IC
      1. 3.3.1 MCU Monitor
      2. 3.3.2 Shutdown Sequence
      3. 3.3.3 Power Supply
    4. 3.4 System Basis Chips
      1. 3.4.1 CAN Communication
      2. 3.4.2 Supply Voltage Rail Monitoring
      3. 3.4.3 SPI/Processor Communication
      4. 3.4.4 Device Internal EEPROM
    5. 3.5 Power Supply and Supervisor
    6. 3.6 Gate Driver
    7. 3.7 Voltage Sensor
    8. 3.8 Current Sensor
    9. 3.9 Temperature Sensor
  7. 4Summary
  8. 5References

3.3 Power Management IC

The TPS650365-Q1 device is a highly integrated power management IC. This device combines three step-down converters and one low-dropout (LDO) regulator. All converters can operate in a forced fixed-frequency PWM mode or in Auto-PFM mode and support optional spread-spectrum modulation (SSM) for EMI reduction. The TPS650365-Q1 also supports low power mode. These flexible features suit MCU power applications. It meets ISO 26262: 2018 and IEC61508: 2010 standards, ensuring compliance with safety requirements up to ASIL-B/SIL2. Available in VQFN-24 package. The main safety features in PMIC for the OBC applications include the following aspects.