ZHCS429J March   2012  – November 2021 UCD3138

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison Table
    1. 6.1 Product Family Comparison
    2. 6.2 Product Selection Matrix
  7. 7 Pin Configuration and Functions
    1. 7.1 UCD3138RGC 64 QFN Pin Attributes
    2. 7.2 UCD3138RHA, UCD3138RMH and UCD3138RJA Pin Attributes
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing and Switching Characteristics
    7. 8.7 Power Supply Sequencing
    8. 8.8 Peripherals
      1. 8.8.1 Digital Power Peripherals (DPPs)
        1. 8.8.1.1 Front End
        2. 8.8.1.2 DPWM Module
        3. 8.8.1.3 DPWM Events
        4. 8.8.1.4 High Resolution DPWM
        5. 8.8.1.5 Oversampling
        6. 8.8.1.6 DPWM Interrupt Generation
        7. 8.8.1.7 DPWM Interrupt Scaling/Range
    9. 8.9 Typical Temperature Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 ARM Processor
    3. 9.3 Memory
      1. 9.3.1 CPU Memory Map and Interrupts
      2. 9.3.2 Boot ROM
      3. 9.3.3 Customer Boot Program
      4. 9.3.4 Flash Management
    4. 9.4 System Module
      1. 9.4.1 Address Decoder (DEC)
      2. 9.4.2 Memory Management Controller (MMC)
      3. 9.4.3 System Management (SYS)
      4. 9.4.4 Central Interrupt Module (CIM)
    5. 9.5 Feature Description
      1. 9.5.1  Sync FET Ramp and IDE Calculation
      2. 9.5.2  Automatic Mode Switching
        1. 9.5.2.1 Phase Shifted Full Bridge Example
        2. 9.5.2.2 LLC Example
        3. 9.5.2.3 Mechanism for Automatic Mode Switching
      3. 9.5.3  DPWMC, Edge Generation, IntraMux
      4. 9.5.4  Filter
        1. 9.5.4.1 Loop Multiplexer
        2. 9.5.4.2 Fault Multiplexer
      5. 9.5.5  Communication Ports
        1. 9.5.5.1 SCI (UART) Serial Communication Interface
        2. 9.5.5.2 PMBUS
        3. 9.5.5.3 General Purpose ADC12
        4. 9.5.5.4 Timers
          1. 9.5.5.4.1 24-bit PWM Timer
          2. 9.5.5.4.2 16-Bit PWM Timers
          3. 9.5.5.4.3 Watchdog Timer
      6. 9.5.6  Miscellaneous Analog
      7. 9.5.7  Package ID Information
      8. 9.5.8  Brownout
      9. 9.5.9  Global I/O
      10. 9.5.10 Temperature Sensor Control
      11. 9.5.11 I/O Mux Control
      12. 9.5.12 Current Sharing Control
      13. 9.5.13 Temperature Reference
    6. 9.6 Device Functional Modes
      1. 9.6.1 Normal Mode
      2. 9.6.2 Phase Shifting
      3. 9.6.3 DPWM Multiple Output Mode
      4. 9.6.4 DPWM Resonant Mode
      5. 9.6.5 Triangular Mode
      6. 9.6.6 Leading Edge Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 PCMC (Peak Current Mode Control) PSFB (Phase Shifted Full Bridge) Hardware Configuration Overview
        2. 10.2.2.2 DPWM Initialization for PSFB
        3. 10.2.2.3 DPWM Synchronization
        4. 10.2.2.4 Fixed Signals to Bridge
        5. 10.2.2.5 Dynamic Signals to Bridge
        6. 10.2.2.6 System Initialization for PCM
          1. 10.2.2.6.1 Use of Front Ends and Filters in PSFB
          2. 10.2.2.6.2 Peak Current Detection
          3. 10.2.2.6.3 Peak Current Mode (PCM)
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Introduction To Power Supply and Layout Recommendations
    2. 11.2 3.3-V Supply Pins
    3. 11.3 Recommendation for V33 Ramp up Slew Rate for UCD3138 and UCD3138064
    4. 11.4 Recommendation for RC Time Constant of RESET Pin for UCD3138 and UCD3138064
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 EMI and EMC Mitigation Guidelines
      2. 12.1.2 BP18 Pin
      3. 12.1.3 Additional Bias Guidelines
      4. 12.1.4 UCD3138 Pin Connection Recommendation
        1. 12.1.4.1 Current Amplifier With EADC Connection
        2. 12.1.4.2 DPWM Synchronization
        3. 12.1.4.3 GPIOS
        4. 12.1.4.4 DPWM PINS
        5. 12.1.4.5 EAP and EAN Pins
        6. 12.1.4.6 ADC Pins
      5. 12.1.5 UART Communication Port
      6. 12.1.6 Special Considerations
    2. 12.2 Layout Example
      1. 12.2.1 UCD3138 and UCD3138064 40 Pin
      2. 12.2.2 UCD3138 and UCD3138064 64 Pin
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Code Composer Studio
      2. 13.1.2 Tools and Documentation
    2. 13.2 Documentation Support
      1. 13.2.1 References
    3. 13.3 接收文档更新通知
    4. 13.4 支持资源
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 术语表
  14. 14Mechanical Packaging and Orderable Information
    1. 14.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Revision History

Changes from Revision I (January 2017) to Revision J (November 2021)

  • 更改了同步功能说明，以指明它适用于所有 UCD3138 系列成员，而不仅仅是 UCD3138064。将“器件概述”部分拆分为 4 个部分，以符合 TI 数据表标准。Go
  • 将 ADC 通道数更改为 15，因为有 14 个外部通道和 1 个用于内部温度传感器的通道Go
  • update Product Family Comparison to show full UCD family Go
  • Added mention of debugging capability to the JTAG pin descriptions and added note that the RMH package is not recommended for new designsGo
  • Added DAC Output as an alternative pin out for pins 2, 3, and 4.Go
  • Correct location of PMBus/SMBus/I2C rise and fall time test conditions Table 8-1 Go
  • Added "using the EADCs as a source" to the digital comparator description Go
  • Replaced the Power Suppply and Layout Guidelines Section with the Power Supply Recommendations Section and Layout Section. The new content is copied directly from the UCD3138 Family Practical Design Guideline Application Note. Go
  • Updated FUSION_DIGITAL_POWER_STUDIO URLs. Moved all CCS references to the Code Composer Studio section and updated them. Also updated the list of documents.Go
  • Changed References section Go

Changes from Revision H (October 2016) to Revision I (January 2017)

  • Added updated Layout Guidelines section and added Layout Example imagesGo

Changes from Revision G (September 2016) to Revision H (October 2016)

  • 向“器件信息”表中添加了“封装图”列。Go
  • 将注释 2 从“推荐用于具有高级 BLR 性能的新 40 引脚设计”更改为“推荐用于新的 40 引脚设计，经过优化提高了温度循环测试下的性能，可实现板级可靠性 (BLR)。”Go
  • Deleted Figure 7-3 note, "These features help to improve solder-joint reliability". Go

Changes from Revision F (November 2013) to Revision G (September 2016)

  • 添加了器件和文档支持 部分以及 ESD 等级 表。Go
  • 更改了文档流以便与 UCD3138A 相符。Go
  • 向特性 和器件信息 表中添加了 RJA 封装。Go
  • Added RJA package. Go
  • Added the RJA package to the Thermal Information table.Go

Changes from Revision E (August 2013) to Revision F (November 2013)

  • 将“订购信息”表中的“顶部标识信息”从“3138”更改为“3138RMH”。Go

Changes from Revision D (August 2013) to Revision E (August 2013)

  • 向特性要点中添加了 UCD3138RMHGo
  • Added RMH package pinout drawingGo
  • Added RMH package thermal specificationsGo
  • Changed Global I/O registers ordered list, item 5 text from "Connecting pin/pins to high rail through internal pull up resistors." to "Configuring pin/pins as open drain or push-pull (Normal)"Go

Changes from Revision C (March 2013) to Revision D (August 2013)

  • Changed TOPT spec to TJ in Abs Max table with MAX temp of 150°CGo
  • Added BP18 Voltage vs Temperature graphicGo

Changes from Revision B (July 2012) to Revision C (March 2013)

  • 删除了“JTAG 调试端口”特性要点Go
  • 删除了“说明”部分的文本字符串“JTAG 调试”。Go
  • 在功能方框图下添加了注释Go
  • Deleted "JTAG" option from Product Selection Matrix.Go
  • Added text to Pin 54 descriptionGo
  • Added text to Pin 35 descriptionGo
  • Added BP18 spec to Abs Max Ratings and Recommended Operating Conditions TablesGo
  • Deleted VDD specification from System Performance section of Electrical Characteristics Go
  • Added footnote to Table 8-1 Go
  • Added text string regarding front-end 2 in the Front End section Go
  • Deleted text string reference to "JTAG port" in ARM Processor sectionGo
  • Changed text strings in Section 13.1.2 Go
  • Added document to References listGo

Changes from Revision A (March 2012) to Revision B (July 2012)

  • 添加了特性要点Go
  • 将“特性”部分中的“双边沿调制”更改为“三边沿调制”Go
  • 将“特性”部分中的“265ksps”更改为“267ksps”Go
  • 澄清了“特性”部分中 UART 的数量Go
  • 通篇将“FDPP”更改为“DDP”。Go
  • 通篇将“FDPP”更改为“DDP”。Go
  • Changed Total GPIO pin count for the UCD3138 40-pin device from "17" to "18" in the Product Selection Matrix table.Go
  • Changed "VREG" to "BP18" in conditions statement for Electrical Characteristics Go
  • Changed EAP – EAN Error voltage digital resolution MIN values for AFE = 3, AFE = 2, AFE = 1, AFE = 0 from 0.95, 1.90, 3.72, and 7.3 respectively; to, 0.8, 1.7, 3.55, and 6.90 respectively.Go
  • Changed conditions for VOL and VOH specifications in Electrical Characteristics Go
  • Added TWD specification to Electrical Characteristics Go
  • Changed "PWM" to "DPWM" in Section 8.8.1.2 Go
  • Changed waveforms graphic for "Phase Shifted Full Bridge Example" for clarification Go
  • Added text to section Section 9.5.2.2 Go
  • Changed typical conversion speed from "268 ksps" to "267 ksps" in the General Purpose ADC12 section.Go
  • Added package ID information for the UCD3138RGC and UCD3138RHA devices.Go
  • Added bullet "AD02 has a special ESD protection mechanism that prevents the pin from pulling down the current-share bus if power is missing from the UCD3138" to Section 9.5.12 .Go
  • Changed "PWMA" and "PWMB" to "DPWMA" and "DPWMB" in Section 9.6.1. Go
  • Changed " Mechanical Data" section to "References" sectionGo

Changes from Revision * (March 2012) to Revision A (March 2012)

  • 将“量产数据”声明添加到脚注并删除了“产品预发布”横幅Go