ZHCSIQ7A august   2018  – december 2021 UCC28951

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Dissipation Ratings
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Start-Up Protection Logic
      2. 7.3.2  Voltage Reference (VREF)
      3. 7.3.3  Error Amplifier (EA+, EA–, COMP)
      4. 7.3.4  Soft-Start and Enable (SS/EN)
      5. 7.3.5  Light-Load Power Saving Features
      6. 7.3.6  Adaptive Delay, (Delay Between OUTA and OUTB, OUTC and OUTD (DELAB, DELCD, ADEL))
      7. 7.3.7  Adaptive Delay (Delay Between OUTA and OUTF, OUTB and OUTE (DELEF, ADELEF)
      8. 7.3.8  Minimum Pulse (TMIN)
      9. 7.3.9  Burst Mode
      10. 7.3.10 Switching Frequency Setting
      11. 7.3.11 Slope Compensation (RSUM)
      12. 7.3.12 Dynamic SR ON/OFF Control (DCM Mode)
      13. 7.3.13 Current Sensing (CS)
      14. 7.3.14 Cycle-by-Cycle Current Limit Current Protection and Hiccup Mode
      15. 7.3.15 Synchronization (SYNC)
      16. 7.3.16 Outputs (OUTA, OUTB, OUTC, OUTD, OUTE, OUTF)
      17. 7.3.17 Supply Voltage (VDD)
      18. 7.3.18 Ground (GND)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Power Loss Budget
        2. 8.2.2.2  Preliminary Transformer Calculations (T1)
        3. 8.2.2.3  QA, QB, QC, QD FET Selection
        4. 8.2.2.4  Selecting LS
        5. 8.2.2.5  Selecting Diodes DB and DC
        6. 8.2.2.6  Output Inductor Selection (LOUT)
        7. 8.2.2.7  Output Capacitance (COUT)
        8. 8.2.2.8  Select FETs QE and QF
        9. 8.2.2.9  Input Capacitance (CIN)
        10. 8.2.2.10 Current Sense Network (CT, RCS, R7, DA)
          1. 8.2.2.10.1 Voltage Loop Compensation Recommendation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
      1.      Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)UCC28951UNIT
PW (TSSOP)
24 PINS
RθJAJunction-to-ambient thermal resistance93.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance24.2°C/W
RθJBJunction-to-board thermal resistance47.9°C/W
ψJTJunction-to-top characterization parameter0.7°C/W
ψJBJunction-to-board characterization parameter47.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistancen/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.