For all the applications, TI recommends a 0.1 µF
or higher value ceramic decoupling capacitor
between IN terminal and GND.
The optimum placement of decoupling capacitor is closest to the IN and GND terminals of the device. Care must be taken to minimize the loop area formed by the bypass-capacitor connection, the IN terminal, and the GND terminal of the IC. See Figure 12-1 for a typical PCB layout example.
High current carrying power path connections must be as short as possible and must be sized to carry at least twice the full-load current.
RTN, which is the reference ground for the device must be a copper plane or island.
Locate all the TPS2662x family support components R(ILIM), C(dVdT), UVLO, OVP resistors close to their connection pin. Connect the other end of the component to the RTN with shortest trace length.
The trace routing for the RILIM component to the device must be as short as possible to reduce parasitic effects on the current limit and current monitoring accuracy. These traces must not have any coupling to switching signals on the board.
Protection devices such as TVS, snubbers,
capacitors, or diodes must be placed physically
close to the device they are intended to protect,
and routed with short traces to reduce inductance.
For example, TI recommends a protection Schottky
diode to address negative transients due to
switching of inductive loads, and it must be
physically close to the OUT and GND pins.
Thermal considerations: when properly mounted,
the PowerPAD package provides significantly
greater cooling ability. To operate at rated
power, the PowerPAD must be soldered directly to
the board RTN plane directly under the device.
Other planes, such as the bottom side of the
circuit board can be used to increase heat sinking
in higher current applications. Designs that do
not need reverse input polarity protection can
have RTN, GND and PowerPAD connected together.
PowerPAD in these designs can be connected to the
PCB ground plane.