SLVS719H June   2008  – June 2026 TL1963A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics: TL1963A (for DCQ, KTT package)
    6. 5.6 Electrical Characteristics: TL1963A (for DCY Package)
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 SHDN
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Undervoltage Lockout
      4. 6.3.4 Thermal Shutdown
      5. 6.3.5 Current Limit
      6. 6.3.6 Overload Recovery
      7. 6.3.7 Output Voltage Noise
      8. 6.3.8 Protection Features
        1. 6.3.8.1 For Legacy Chip Only
        2. 6.3.8.2 For Both Legacy and New Chip
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input/Output Capacitance and Transient Response
      2. 7.1.2 Reverse Current
      3. 7.1.3 Feed-Forward Capacitor
      4. 7.1.4 Estimating Junction Temperature
      5. 7.1.5 Power Dissipation (PD)
    2. 7.2 Typical Applications
      1. 7.2.1 Kelvin Sense Connection with SENSE pin
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Curve
      5. 7.2.5 Paralleling Regulators for Higher Output Current (Legacy chip only)
        1. 7.2.5.1 Design Requirements
        2. 7.2.5.2 Detailed Design Procedure (Legacy chip only)
        3. 7.2.5.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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7.1.2 Reverse Current

The TL1963A-xx has integrated reverse current protection. Reverse current protection prevents the flow of current from the OUT pin to the IN pin when output voltage is higher than input voltage. It can happen in scenarios when the output voltage is held up while the input is either pulled to ground, pulled to some intermediate voltage, or is left open circuit. The reverse current protection circuitry places the power path in high impedance when the output voltage is higher than the input voltage. This setting reduces leakage current from the output to the input. The reverse current protection is always active regardless of the SHDN pin logic state or if the OUT pin voltage is greater than 1.8V (for legacy chip only). IRO (reverse output current) for legacy chip and IRC(steady state) for new chip defines the steady state current that flows in the OUT pin and out of the GND pin, captured in Electrical Characteristics: TL1963A (for DCY Package)/Electrical Characteristics: TL1963A (for DCQ, KTT package) table.