ZHCSLM6A december   2021  – june 2023 TDP0604

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  4-Level Inputs
      2. 8.3.2  I/O Voltage Level Selection
      3. 8.3.3  HPD_OUT
      4. 8.3.4  Lane Control
      5. 8.3.5  Swap
      6. 8.3.6  Linear and Limited Redriver
      7. 8.3.7  Main Link Inputs
      8. 8.3.8  Receiver Equalizer
      9. 8.3.9  CTLE Bypass
      10. 8.3.10 Input Signal Detect
      11. 8.3.11 Main Link Outputs
        1. 8.3.11.1 Transmitter Bias
        2. 8.3.11.2 Transmitter Impedance Control
        3. 8.3.11.3 TX Slew Rate Control
        4. 8.3.11.4 TX Pre-Emphasis and De-Emphasis Control
        5. 8.3.11.5 TX Swing Control
      12. 8.3.12 DDC Buffer
      13. 8.3.13 HDMI DDC Capacitance
      14. 8.3.14 DisplayPort
    4. 8.4 Device Functional Modes
      1. 8.4.1 MODE Control
        1. 8.4.1.1 I2C Mode (MODE = "F")
        2. 8.4.1.2 Pin Strap Modes
          1. 8.4.1.2.1 Pin-Strap: HDMI 1.4 and HDMI 2.0 Functional Description
      2. 8.4.2 DDC Snoop Feature
        1. 8.4.2.1 HDMI Type
      3. 8.4.3 Low Power Modes
    5. 8.5 Programming
      1. 8.5.1 Pseudocode Examples
        1. 8.5.1.1 HDMI 2.0 Source Example with DDC Snoop and DDC Buffer Enabled
      2. 8.5.2 TDP0604 I2C Address Options
      3. 8.5.3 I2C Target Behavior
    6. 8.6 Register Maps
      1. 8.6.1 TDP0604 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Source-Side Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Pre-Channel (LAB)
        2. 9.2.2.2 Post-Channel (LCD)
        3. 9.2.2.3 Common Mode Choke
        4. 9.2.2.4 ESD Protection
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.2.2.3 Common Mode Choke

It may be necessary to incorporate a common mode choke (CMC) to reduce EMI. The purpose of a CMC is to have a minimal impact to the differential signal while attenuating common mode noise thereby reducing radiated emissions. The CMC should be placed between the TDP0604 and the ESD device.

Table 9-3 Recommended Common Mode Chokes
Manufacturer Part Number
Murata DLW21SN900HQ2
Murata DLP11SA900HL2