ZHCSQW3A december   2022  – april 2023 SN74LV8T245

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics - 1.8-V VCC
    7. 6.7  Switching Characteristics - 2.5-V VCC
    8. 6.8  Switching Characteristics - 3.3-V VCC
    9. 6.9  Switching Characteristics - 5-V VCC
    10. 6.10 Noise Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS 3-State Outputs
      2. 8.3.2 Clamp Diode Structure
      3. 8.3.3 LVxT Enhanced Input Voltage
        1. 8.3.3.1 Down Translation
        2. 8.3.3.2 Up Translation
      4. 8.3.4 Wettable Flanks
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
    3. 9.3 Design Requirements
      1. 9.3.1 Power Considerations
      2. 9.3.2 Input Considerations
      3. 9.3.3 Output Considerations
      4. 9.3.4 Detailed Design Procedure
    4. 9.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RKS|20
  • DGS|20
  • PW|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) SN74LV8T245 UNIT
RKS (VQFN) DGS (VSSOP) PW (TSSOP)
20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 67.7 118.4 122.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 72.4 57.7 64.8 °C/W
RθJB Junction-to-board thermal resistance 40.4 73.1 73.3 °C/W
ΨJT Junction-to-top characterization parameter 10.3 5.7 19.0 °C/W
YJB Junction-to-board characterization parameter 40.4 72.7 73.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 24.1 N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.