ZHCSLT2C May   2020  – November 2022 LMK04832-SP

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 绝对最大额定值
    2. 6.2 ESD 等级
    3. 6.3 建议运行条件
    4. 6.4 热性能信息
    5. 6.5 电气特性
    6. 6.6 时序要求
    7. 6.7 Timing Diagram
    8. 6.8 典型特性
  7. Parameter Measurement Information
    1. 7.1 Charge Pump Current Specification Definitions
      1. 7.1.1 Charge Pump Output Current Magnitude Variation vs Charge Pump Output Voltage
      2. 7.1.2 Charge Pump Sink Current vs Charge Pump Output Source Current Mismatch
      3. 7.1.3 Charge Pump Output Current Magnitude Variation vs Ambient Temperature
    2. 7.2 Differential Voltage Measurement Terminology
  8. Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Differences Between LMK04832-SP and LMK04832
        1. 8.1.1.1 Jitter Cleaning
        2. 8.1.1.2 JEDEC JESD204B Support
      2. 8.1.2 Clock Inputs
        1. 8.1.2.1 Inputs for PLL1
        2. 8.1.2.2 Inputs for PLL2
        3. 8.1.2.3 Inputs When Using Clock Distribution Mode
      3. 8.1.3 PLL1
        1. 8.1.3.1 Frequency Holdover
        2. 8.1.3.2 External VCXO for PLL1
      4. 8.1.4 PLL2
        1. 8.1.4.1 Internal VCOs for PLL2
        2. 8.1.4.2 External VCO Mode
      5. 8.1.5 Clock Distribution
        1. 8.1.5.1 Clock Divider
        2. 8.1.5.2 High Performance Divider Bypass Mode
        3. 8.1.5.3 SYSREF Clock Divider
        4. 8.1.5.4 Device Clock Delay
        5. 8.1.5.5 Dynamic Digital Delay
        6. 8.1.5.6 SYSREF Delay: Global and Local
        7. 8.1.5.7 Programmable Output Formats
        8. 8.1.5.8 Clock Output Synchronization
      6. 8.1.6 0-Delay
      7. 8.1.7 Status Pins
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Synchronizing PLL R Dividers
        1. 8.3.1.1 PLL1 R Divider Synchronization
        2. 8.3.1.2 PLL2 R Divider Synchronization
      2. 8.3.2 SYNC/SYSREF
      3. 8.3.3 JEDEC JESD204B
        1. 8.3.3.1 How to Enable SYSREF
          1. 8.3.3.1.1 Setup of SYSREF Example
          2. 8.3.3.1.2 SYSREF_CLR
        2. 8.3.3.2 SYSREF Modes
          1. 8.3.3.2.1 SYSREF Pulser
          2. 8.3.3.2.2 Continuous SYSREF
          3. 8.3.3.2.3 SYSREF Request
      4. 8.3.4 Digital Delay
        1. 8.3.4.1 Fixed Digital Delay
          1. 8.3.4.1.1 Fixed Digital Delay Example
        2. 8.3.4.2 Dynamic Digital Delay
        3. 8.3.4.3 Single and Multiple Dynamic Digital Delay Example
      5. 8.3.5 SYSREF to Device Clock Alignment
      6. 8.3.6 Input Clock Switching
        1. 8.3.6.1 Input Clock Switching - Manual Mode
        2. 8.3.6.2 Input Clock Switching - Pin Select Mode
        3. 8.3.6.3 Input Clock Switching - Automatic Mode
      7. 8.3.7 Digital Lock Detect
        1. 8.3.7.1 Calculating Digital Lock Detect Frequency Accuracy
      8. 8.3.8 Holdover
        1. 8.3.8.1 Enable Holdover
          1. 8.3.8.1.1 Fixed (Manual) CPout1 Holdover Mode
          2. 8.3.8.1.2 Tracked CPout1 Holdover Mode
        2. 8.3.8.2 During Holdover
        3. 8.3.8.3 Exiting Holdover
        4. 8.3.8.4 Holdover Frequency Accuracy and DAC Performance
      9. 8.3.9 PLL2 Loop Filter
    4. 8.4 Device Functional Modes
      1. 8.4.1 DUAL PLL
        1. 8.4.1.1 Dual Loop
        2. 8.4.1.2 Dual Loop With Cascaded 0-Delay
        3. 8.4.1.3 Dual Loop With Nested 0-Delay
      2. 8.4.2 Single PLL
        1. 8.4.2.1 PLL2 Single Loop
        2. 8.4.2.2 PLL2 With External VCO
      3. 8.4.3 Distribution Mode
    5. 8.5 Programming
      1. 8.5.1 Recommended Programming Sequence
    6. 8.6 Register Maps
      1. 8.6.1 Register Map for Device Programming
      2. 8.6.2 Device Register Descriptions
        1. 8.6.2.1 System Functions
          1. 8.6.2.1.1 RESET, SPI_3WIRE_DIS
          2. 8.6.2.1.2 POWERDOWN
          3. 8.6.2.1.3 ID_DEVICE_TYPE
          4. 8.6.2.1.4 ID_PROD
          5. 8.6.2.1.5 ID_MASKREV
          6. 8.6.2.1.6 ID_VNDR
        2. 8.6.2.2 (0x100 - 0x138) Device Clock and SYSREF Clock Output Controls
          1. 8.6.2.2.1 DCLKX_Y_DIV
          2. 8.6.2.2.2 DCLKX_Y_DDLY
          3. 8.6.2.2.3 CLKoutX_Y_PD, CLKoutX_Y_ODL, CLKoutX_Y_IDL, DCLKX_Y_DDLY_PD, DCLKX_Y_DDLY[9:8], DCLKX_Y_DIV[9:8]
          4. 8.6.2.2.4 CLKoutX_SRC_MUX, CLKoutX_Y_PD, DCLKX_Y_BYP, DCLKX_Y_DCC, DCLKX_Y_POL, DCLKX_Y_HS
          5. 8.6.2.2.5 CLKoutY_SRC_MUX, SCLKX_Y_PD, SCLKX_Y_DIS_MODE, SCLKX_Y_POL, SCLKX_Y_HS
          6. 8.6.2.2.6 SCLKX_Y_ADLY_EN, SCLKX_Y_ADLY
          7. 8.6.2.2.7 SCLKX_Y_DDLY
          8. 8.6.2.2.8 CLKoutY_FMT, CLKoutX_FMT
        3. 8.6.2.3 SYSREF, SYNC, and Device Config
          1. 8.6.2.3.1  VCO_MUX, OSCout_MUX, OSCout_FMT
          2. 8.6.2.3.2  SYSREF_REQ_EN, SYNC_BYPASS, SYSREF_MUX
          3. 8.6.2.3.3  SYSREF_DIV
          4. 8.6.2.3.4  SYSREF_DDLY
          5. 8.6.2.3.5  SYSREF_PULSE_CNT
          6. 8.6.2.3.6  PLL2_RCLK_MUX, PLL2_NCLK_MUX, PLL1_NCLK_MUX, FB_MUX, FB_MUX_EN
          7. 8.6.2.3.7  PLL1_PD, VCO_LDO_PD, VCO_PD, OSCin_PD, SYSREF_GBL_PD, SYSREF_PD, SYSREF_DDLY_PD, SYSREF_PLSR_PD
          8. 8.6.2.3.8  DDLYdSYSREF_EN, DDLYdX_EN
          9. 8.6.2.3.9  DDLYd_STEP_CNT
          10. 8.6.2.3.10 SYSREF_CLR, SYNC_1SHOT_EN, SYNC_POL, SYNC_EN, SYNC_PLL2_DLD, SYNC_PLL1_DLD, SYNC_MODE
          11. 8.6.2.3.11 SYNC_DISSYSREF, SYNC_DISX
          12. 8.6.2.3.12 PLL1R_SYNC_EN, PLL1R_SYNC_SRC, PLL2R_SYNC_EN, FIN0_DIV2_EN, FIN0_INPUT_TYPE
        4. 8.6.2.4 (0x146 - 0x149) CLKin Control
          1. 8.6.2.4.1 CLKin_SEL_PIN_EN, CLKin_SEL_PIN_POL, CLKin2_EN, CLKin1_EN, CLKin0_EN, CLKin2_TYPE, CLKin1_TYPE, CLKin0_TYPE
          2. 8.6.2.4.2 CLKin_SEL_AUTO_REVERT_EN, CLKin_SEL_AUTO_EN, CLKin_SEL_MANUAL, CLKin1_DEMUX, CLKin0_DEMUX
          3. 8.6.2.4.3 CLKin_SEL0_MUX, CLKin_SEL0_TYPE
          4. 8.6.2.4.4 SDIO_RDBK_TYPE, CLKin_SEL1_MUX, CLKin_SEL1_TYPE
        5. 8.6.2.5 RESET_MUX, RESET_TYPE
        6. 8.6.2.6 (0x14B - 0x152) Holdover
          1. 8.6.2.6.1 LOS_TIMEOUT, LOS_EN, TRACK_EN, HOLDOVER_FORCE, MAN_DAC_EN, MAN_DAC[9:8]
          2. 8.6.2.6.2 MAN_DAC
          3. 8.6.2.6.3 DAC_TRIP_LOW
          4. 8.6.2.6.4 DAC_CLK_MULT, DAC_TRIP_HIGH
          5. 8.6.2.6.5 DAC_CLK_CNTR
          6. 8.6.2.6.6 CLKin_OVERRIDE, HOLDOVER_EXIT_MODE, HOLDOVER_PLL1_DET, LOS_EXTERNAL_INPUT, HOLDOVER_VTUNE_DET, CLKin_SWITCH_CP_TRI, HOLDOVER_EN
          7. 8.6.2.6.7 HOLDOVER_DLD_CNT
        7. 8.6.2.7 (0x153 - 0x15F) PLL1 Configuration
          1. 8.6.2.7.1 CLKin0_R
          2. 8.6.2.7.2 CLKin1_R
          3. 8.6.2.7.3 CLKin2_R
          4. 8.6.2.7.4 PLL1_N
          5. 8.6.2.7.5 PLL1_WND_SIZE, PLL1_CP_TRI, PLL1_CP_POL, PLL1_CP_GAIN
          6. 8.6.2.7.6 PLL1_DLD_CNT
          7. 8.6.2.7.7 HOLDOVER_EXIT_NADJ
          8. 8.6.2.7.8 PLL1_LD_MUX, PLL1_LD_TYPE
        8. 8.6.2.8 (0x160 - 0x16E) PLL2 Configuration
          1. 8.6.2.8.1 PLL2_R
          2. 8.6.2.8.2 PLL2_P, OSCin_FREQ, PLL2_REF_2X_EN
          3. 8.6.2.8.3 PLL2_N_CAL
          4. 8.6.2.8.4 PLL2_N
          5. 8.6.2.8.5 PLL2_WND_SIZE, PLL2_CP_GAIN, PLL2_CP_POL, PLL2_CP_TRI
          6. 8.6.2.8.6 PLL2_DLD_CNT
          7. 8.6.2.8.7 PLL2_LD_MUX, PLL2_LD_TYPE
        9. 8.6.2.9 (0x16F - 0x555) Misc Registers
          1. 8.6.2.9.1 PLL2_PRE_PD, PLL2_PD, FIN0_PD
          2. 8.6.2.9.2 PLL1R_RST
          3. 8.6.2.9.3 CLR_PLL1_LD_LOST, CLR_PLL2_LD_LOST
          4. 8.6.2.9.4 RB_PLL1_LD_LOST, RB_PLL1_LD, RB_PLL2_LD_LOST, RB_PLL2_LD
          5. 8.6.2.9.5 RB_DAC_VALUE (MSB), RB_CLKinX_SEL, RB_CLKinX_LOS
          6. 8.6.2.9.6 RB_DAC_VALUE
          7. 8.6.2.9.7 RB_HOLDOVER
          8. 8.6.2.9.8 SPI_LOCK
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Treatment of Unused Pins
      2. 9.1.2 Digital Lock Detect Frequency Accuracy
        1. 9.1.2.1 Minimum Lock Time Calculation Example
      3. 9.1.3 Driving CLKin AND OSCin Inputs
        1. 9.1.3.1 Driving CLKin and OSCin PINS With a Differential Source
        2. 9.1.3.2 Driving CLKin Pins With a Single-Ended Source
      4. 9.1.4 OSCin Doubler for Best Phase Noise Performance
      5. 9.1.5 Radiation Environments
        1. 9.1.5.1 Total Ionizing Dose
        2. 9.1.5.2 Single Event Effect
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Device Selection
          1. 9.2.2.1.1 Clock Architect
        2. 9.2.2.2 Device Configuration and Simulation
        3. 9.2.2.3 Device Programming
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Cold Sparing Considerations
        1. 9.3.1.1 Damage Prevention Details to Unpowered Device
      2. 9.3.2 Current Consumption
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Thermal Management
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Clock Architect
        2. 10.1.1.2 PLLatinum Sim
        3. 10.1.1.3 TICS Pro
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information

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Pin Configuration and Functions

GUID-B10D11CB-A16F-4B14-A5F1-3D654C63ECEB-low.gif Figure 5-1 HBD CFP Package 64-Pin CFPTop View
Table 5-1 Pin Functions
PIN I/O TYPE DESCRIPTION
NO. NAME
1 CLKout0 O Programmable Clock output 0. For JESD204B systems suggest Device Clock.(2) Programmable formats: CML, LVPECL, LCPECL, or LVDS.
2 CLKout0*
3 CLKout1 O Programmable Clock output 1. For JESD204B systems suggest SYSREF Clock.(2) Programmable formats: CML, LVPECL, LCPECL, LVDS, or 2xLVCMOS.
4 CLKout1*
5 RESET/GPO I CMOS Device reset input or GPO
6 SYNC/SYSREF_REQ I CMOS Synchronization input or SYSREF_REQ for requesting continuous SYSREF.
7 GND GND This pin should be grounded.
8, 9 Fin0/Fin0* I ANLG High-speed input for external VCO or clock distribution. Supports /2 for frequency greater than 3250 MHz.
10 Vcc1_VCO PWR Power supply for VCO and clock distribution.
11 LDObyp1 ANLG LDO Bypass, bypassed to ground with 10-µF capacitor.
12 LDObyp2 ANLG LDO Bypass, bypassed to ground with a 0.1-µF capacitor.
13 CLKout3 O Programmable Clock output 3. For JESD204B systems suggest SYSREF Clock.(2) Programmable formats: CML, LVPECL, LCPECL, LVDS, or 2xLVCMOS.
14 CLKout3*
15 CLKout2 O Programmable Clock output 2. For JESD204B systems suggest Device Clock.(2) Programmable formats: CML, LVPECL, LCPECL, or LVDS.
16 CLKout2*
17 Vcc2_CG1 PWR Power supply for clock outputs 2 and 3.
18 CS* I CMOS Chip Select
19 SCK I CMOS SPI Clock
20 SDIO I/O CMOS SPI Data
21 Vcc3_SYSREF PWR Power supply for SYSREF divider and SYNC.
22 CLKout5 O Programmable Clock output 5. For JESD204B systems suggest SYSREF Clock.(2) Programmable formats: CML, LVPECL, LCPECL, LVDS, or 2xLVCMOS.
23 CLKout5*
24 CLKout4 O Programmable Clock output 4. For JESD204B systems suggest Device Clock.(2) Programmable formats: CML, LVPECL, LCPECL, or LVDS.
25 CLKout4*
26 Vcc4_CG2 PWR Power supply for clock outputs 4, 5, 6 and 7.
27 CLKout6 O Programmable Clock output 6. For JESD204B systems suggest Device Clock.(2) Programmable formats: CML, LVPECL, LCPECL, or LVDS.
28 CLKout6*
29 CLKout7 O Programmable Clock output 7. For JESD204B systems suggest SYSREF Clock.(2) Programmable formats: CML, LVPECL, LCPECL, LVDS, or 2xLVCMOS.
30 CLKout7*
31 Status_LD1 I/O Programmable Programmable status pin.
32 CPout1 O ANLG Charge pump 1 output.
33 Vcc5_DIG PWR Power supply for the digital circuitry.
34 CLKin1 I ANLG Reference Clock Input Port 1 for PLL1.
FBCLKin Feedback input for external clock feedback input (0–delay mode).
Fin1 External VCO Input or clock distribution input.
35 CLKin1* I ANLG Reference Clock Input Port 1 for PLL1.
FBCLKin* Feedback input for external clock feedback input (0–delay mode).
Fin1* External VCO Input or clock distribution input.
36 Vcc6_PLL1 PWR Power supply for PLL1, charge pump 1, holdover DAC
37 CLKin0 I ANLG Reference Clock Input Port 0 for PLL1.
38 CLKin0*
39 Vcc7_OSCout PWR Power supply for OSCout port.
40 OSCout I/O Programmable Buffered output of OSCin port.
CLKin2 Reference Clock Input Port 2 for PLL1.
41 OSCout* I/O Programmable Buffered output of OSCin port.
CLKin2* Reference Clock Input Port 2 for PLL1.
42 Vcc8_OSCin PWR Power supply for OSCin
43 OSCin I ANLG Feedback to PLL1 and reference input to PLL2. AC-coupled.
44 OSCin*
45 Vcc9_CP2 PWR Power supply for PLL2 Charge Pump.
46 CPout2 O ANLG Charge pump 2 output.
47 Vcc10_PLL2 PWR Power supply for PLL2.
48 Status_LD2 I/O Programmable Programmable status pin.
49 CLKout9 O Programmable Clock output 9. For JESD204B systems suggest SYSREF Clock.(2)
Programmable formats: CML, LVPECL, LCPECL, LVDS, or 2xLVCMOS.
50 CLKout9*
51 CLKout8 O Programmable Clock output 8. For JESD204B systems suggest Device Clock.(2) Programmable formats: CML, LVPECL, LCPECL, LVDS, or 2xLVCMOS.
52 CLKout8*
53 Vcc11_CG3 PWR Power supply for clock outputs 8, 9, 10, and 11.
54 CLKout10 O Programmable Clock output 10. For JESD204B systems suggest Device Clock.(2) Programmable formats: CML, LVPECL, LCPECL, LVDS, or 2xLVCMOS.
55 CLKout10*
56 CLKout11 O Programmable Clock output 11. For JESD204B systems suggest SYSREF Clock.(2) Programmable formats: CML, LVPECL, LCPECL, LVDS, or 2xLVCMOS.
57 CLKout11*
58 CLKin_SEL0 I/O Programmable Programmable status pin.
59 CLKin_SEL1 I/O Programmable Programmable status pin.
60 CLKout13 O Programmable Clock output 13. For JESD204B systems suggest SYSREF Clock.(2) Programmable formats: CML, LVPECL, LCPECL, LVDS, or 2xLVCMOS.
61 CLKout13*
62 CLKout12 O Programmable Clock output 12. For JESD204B systems suggest Device Clock.(2) Programmable formats: CML, LVPECL, LCPECL, or LVDS.
63 CLKout12*
64 Vcc12_CG0 PWR Power supply for clock outputs 0, 1, 12, and 13.
DAP DAP GND DIE ATTACH PAD, connect to GND.(1)
The metal lid is internally grounded and attached to the DAP.
Actual best allocation of device clocks and SYSREF depends upon frequency planning to group common frequencies.