ZHCSIR1C June 2018 – May 2021 LM2775-Q1
PRODUCTION DATA
The LM2775-Q1 implements a thermal shutdown mechanism to protect the device from damage due to overheating. When the junction temperature rises to 150°C (typical), the part switches into shutdown mode. The device releases thermal shutdown when the junction temperature of the part is reduced to 130°C (typical).
Thermal shutdown is most often triggered by self-heating, which occurs when there is excessive power dissipation in the device and/or insufficient thermal dissipation. LM2775-Q1 power dissipation increases with increased output current and input voltage. When self-heating brings on thermal shutdown, thermal cycling is the typical result. Thermal cycling is the repeating process where the part self-heats, enters thermal shutdown (where internal power dissipation is practically zero), cools, turns on, and then heats up again to the thermal shutdown threshold. Thermal cycling is recognized by a pulsing output voltage and can be stopped be reducing the internal power dissipation (reduce input voltage and/or output current) or the ambient temperature. If thermal cycling occurs under desired operating conditions, thermal dissipation performance must be improved to accommodate the power dissipation of the LM2775-Q1. The WSON package is designed to have excellent thermal properties that, when soldered to a PCB designed to aid thermal dissipation, allows the device to operate under very demanding power dissipation conditions.