ZHCSQR6C december   2020  – july 2023 CC2662R-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Functional Block Diagram
  6. Revision History
  7. Device Comparison
  8. Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions
    3. 7.3 Connections for Unused Pins and Modules
  9. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  Receive (RX)
    10. 8.10 Transmit (TX)
    11. 8.11 Timing and Switching Characteristics
      1. 8.11.1 Reset Timing
      2. 8.11.2 Wakeup Timing
      3. 8.11.3 Clock Specifications
        1. 8.11.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.11.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.11.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 8.11.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 8.11.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.11.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.11.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       34
      5. 8.11.5 UART
        1. 8.11.5.1 UART Characteristics
    12. 8.12 Peripheral Characteristics
      1. 8.12.1 ADC
        1.       Analog-to-Digital Converter (ADC) Characteristics
      2. 8.12.2 DAC
        1. 8.12.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.12.3 Temperature and Battery Monitor
        1. 8.12.3.1 Temperature Sensor
        2. 8.12.3.2 Battery Monitor
      4. 8.12.4 Comparators
        1. 8.12.4.1 Continuous Time Comparator
        2. 8.12.4.2 Low-Power Clocked Comparator
      5. 8.12.5 Current Source
        1. 8.12.5.1 Programmable Current Source
      6. 8.12.6 GPIO
        1. 8.12.6.1 GPIO DC Characteristics
    13. 8.13 Typical Characteristics
      1. 8.13.1 MCU Current
      2. 8.13.2 RX Current
      3. 8.13.3 TX Current
      4. 8.13.4 RX Performance
      5. 8.13.5 TX Performance
      6. 8.13.6 ADC Performance
  10. Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  13. 12Mechanical, Packaging, and Orderable Information

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Junction Temperature Calculation

This section shows the different techniques for calculating the junction temperature under various operating conditions. For more details, see Semiconductor and IC Package Thermal Metrics.

There are three recommended ways to derive the junction temperature from other measured temperatures:

  1. From package temperature:
    Equation 1. T J = ψ JT × P + T case

     

  2. From board temperature:
    Equation 2. T J = ψ JB × P + T board

     

  3. From ambient temperature:
    Equation 3. T J = R θJA × P + T A

P is the power dissipated from the device and can be calculated by multiplying current consumption with supply voltage. Thermal resistance coefficients are found in Section 8.8.

Example:

Using Equation 3, the temperature difference between ambient temperature and junction temperature is calculated. In this example, we assume a simple use case where the radio is transmitting continuously at 0 dBm output power. Let us assume the ambient temperature is 105 °C and the supply voltage is 3 V. To calculate P, we need to look up the current consumption for Tx at 105 °C in . From the plot, we see that the current consumption is 7.9 mA. This means that P is 7.9 mA × 3 V = 23.7 mW.

The junction temperature is then calculated as:

Equation 4. T J = 23.0°CW × 23.7 mW + TA = 0.5°C + TA

As can be seen from the example, the junction temperature will be 0.5 °C higher than the ambient temperature when running continuous Tx at 105 °C.

For various application use cases current consumption for other modules may have to be added to calculate the appropriate power dissipation. For example, the MCU may be running simultaneously as the radio, peripheral modules may be enabled, etc. Typically, the easiest way to find the peak current consumption, and thus the peak power dissipation in the device, is to measure as described in Measuring CC13xx and CC26xx current consumption.