ZHCSGW5B January   2017  – October 2020 CC2640R2F-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Wettable Flanks
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Consumption Summary
    5. 8.5  General Characteristics
    6. 8.6  1-Mbps GFSK (Bluetooth low energy Technology) – RX
    7. 8.7  1-Mbps GFSK (Bluetooth low energy Technology) – TX
    8. 8.8  24-MHz Crystal Oscillator (XOSC_HF)
    9. 8.9  32.768-kHz Crystal Oscillator (XOSC_LF)
    10. 8.10 48-MHz RC Oscillator (RCOSC_HF)
    11. 8.11 32-kHz RC Oscillator (RCOSC_LF)
    12. 8.12 ADC Characteristics
    13. 8.13 Temperature Sensor
    14. 8.14 Battery Monitor
    15. 8.15 Continuous Time Comparator
    16. 8.16 Low-Power Clocked Comparator
    17. 8.17 Programmable Current Source
    18. 8.18 Synchronous Serial Interface (SSI)
    19. 8.19 DC Characteristics
    20. 8.20 Thermal Resistance Characteristics for RGZ Package
    21. 8.21 Timing Requirements
    22. 8.22 Switching Characteristics
    23. 8.23 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Main CPU
    3. 9.3  RF Core
    4. 9.4  Sensor Controller
    5. 9.5  Memory
    6. 9.6  Debug
    7. 9.7  Power Management
    8. 9.8  Clock Systems
    9. 9.9  General Peripherals and Modules
    10. 9.10 System Architecture
  10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 7 × 7 Internal Differential (7ID) Application Circuit
      1. 10.2.1 Layout
  11. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 Texas Instruments Low-Power RF Website
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Export Control Notice
    9. 11.9 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGZ|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4 Power Consumption Summary

Measured on the TI CC2640Q1EM-7ID reference design with Tc = 25°C, VDDS = 3.0 V with internal DC/DC converter, unless otherwise noted.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
IcoreCore current consumptionReset. RESET_N pin asserted or VDDS below power-on-reset (POR) threshold100nA
Shutdown. No clocks running, no retention150
Standby. With RTC, CPU, RAM and (partial) register retention. RCOSC_LF1.3µA
Standby. With RTC, CPU, RAM and (partial) register retention. XOSC_LF1.5
Standby. With Cache, RTC, CPU, RAM and (partial) register retention. RCOSC_LF3.4
Standby. With Cache, RTC, CPU, RAM and (partial) register retention. XOSC_LF3.6
Idle. Supply Systems and RAM powered.650
Active. Core running CoreMark1.45 mA + 31 µA/MHz
Radio RX6.1mA
Radio TX, 0-dBm output power7.0
Radio TX, 5-dBm output power9.3
Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated)(1)
IperiPeripheral power domainDelta current with domain enabled20µA
Serial power domainDelta current with domain enabled13µA
RF CoreDelta current with power domain enabled, clock enabled, RF core idle237µA
µDMADelta current with clock enabled, module idle130µA
TimersDelta current with clock enabled, module idle113µA
I2CDelta current with clock enabled, module idle12µA
I2SDelta current with clock enabled, module idle36µA
SSIDelta current with clock enabled, module idle93µA
UARTDelta current with clock enabled, module idle164µA
(1) Iperi is not supported in Standby or Shutdown.