ZHCSGW5C January   2017  – March 2025 CC2640R2F-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Wettable Flanks
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Consumption Summary
    5. 7.5  General Characteristics
    6. 7.6  1Mbps GFSK (Bluetooth Low Energy Technology)—RX
    7. 7.7  1Mbps GFSK (Bluetooth Low Energy Technology)—TX
    8. 7.8  24MHz Crystal Oscillator (XOSC_HF)
    9. 7.9  32.768kHz Crystal Oscillator (XOSC_LF)
    10. 7.10 48MHz RC Oscillator (RCOSC_HF)
    11. 7.11 32kHz RC Oscillator (RCOSC_LF)
    12. 7.12 ADC Characteristics
    13. 7.13 Temperature Sensor
    14. 7.14 Battery Monitor
    15. 7.15 Continuous Time Comparator
    16. 7.16 Low-Power Clocked Comparator
    17. 7.17 Programmable Current Source
    18. 7.18 Synchronous Serial Interface (SSI)
    19. 7.19 DC Characteristics
    20. 7.20 Thermal Resistance Characteristics for RGZ Package
    21. 7.21 Timing Requirements
    22. 7.22 Switching Characteristics
    23. 7.23 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  Main CPU
    3. 8.3  RF Core
    4. 8.4  Sensor Controller
    5. 8.5  Memory
    6. 8.6  Debug
    7. 8.7  Power Management
    8. 8.8  Clock Systems
    9. 8.9  General Peripherals and Modules
    10. 8.10 System Architecture
  10. 9 Application, Implementation, and Layout
    1. 9.1 Application Information
    2. 9.2 7 × 7 Internal Differential (7ID) Application Circuit
      1. 9.2.1 Layout
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Texas Instruments Low-Power RF Website
    5. 10.5 支持资源
    6. 10.6 Trademarks
    7. 10.7 静电放电警告
    8. 10.8 Export Control Notice
    9. 10.9 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

封装选项

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机械数据 (封装 | 引脚)
  • RGZ|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.23 Typical Characteristics

CC2640R2F-Q1 Bluetooth Low Energy Sensitivity vs Temperature
Figure 7-4 Bluetooth Low Energy Sensitivity vs Temperature
CC2640R2F-Q1 Bluetooth Low Energy Sensitivity vs Channel Frequency
Figure 7-6 Bluetooth Low Energy Sensitivity vs Channel Frequency
CC2640R2F-Q1 TX Output Power vs Supply Voltage (VDDS)
Figure 7-8 TX Output Power vs Supply Voltage (VDDS)
CC2640R2F-Q1 TX Current Consumption vs Supply Voltage (VDDS)
Figure 7-10 TX Current Consumption vs Supply Voltage (VDDS)
CC2640R2F-Q1 RX Mode Current Consumption vs Temperature
Figure 7-12 RX Mode Current Consumption vs Temperature
CC2640R2F-Q1 Active Mode (MCU Running, No Peripherals) Current Consumption vs Temperature
Figure 7-14 Active Mode (MCU Running, No Peripherals) Current Consumption vs Temperature
CC2640R2F-Q1 Standby Mode Current Consumption vs Temperature
Figure 7-16 Standby Mode Current Consumption vs Temperature
CC2640R2F-Q1 SoC ADC Output vs Supply Voltage (Fixed Input, Internal Reference, No Scaling)
Figure 7-18 SoC ADC Output vs Supply Voltage (Fixed Input, Internal Reference, No Scaling)
CC2640R2F-Q1 SoC ADC ENOB vs Sampling Frequency (Input Frequency = FS / 10)
Figure 7-20 SoC ADC ENOB vs Sampling Frequency (Input Frequency = FS / 10)
CC2640R2F-Q1 Bluetooth Low Energy Sensitivity vs Supply Voltage (VDDS)
Figure 7-5 Bluetooth Low Energy Sensitivity vs Supply Voltage (VDDS)
CC2640R2F-Q1 TX Output Power vs Temperature
Figure 7-7 TX Output Power vs Temperature
CC2640R2F-Q1 TX Output Power vs Channel Frequency
Figure 7-9 TX Output Power vs Channel Frequency
CC2640R2F-Q1 RX Mode Current vs Supply Voltage (VDDS)
Figure 7-11 RX Mode Current vs Supply Voltage (VDDS)
CC2640R2F-Q1 TX Mode Current Consumption vs Temperature
Figure 7-13 TX Mode Current Consumption vs Temperature
CC2640R2F-Q1 Active Mode (MCU Running, No Peripherals) Current Consumption vs Supply Voltage (VDDS)
Figure 7-15 Active Mode (MCU Running, No Peripherals) Current Consumption vs Supply Voltage (VDDS)
CC2640R2F-Q1 SoC ADC Effective Number of Bits vs Input Frequency (Internal Reference, No Scaling)
Figure 7-17 SoC ADC Effective Number of Bits vs Input Frequency (Internal Reference, No Scaling)
CC2640R2F-Q1 SoC ADC Output vs Temperature (Fixed Input, Internal Reference, No Scaling)
Figure 7-19 SoC ADC Output vs Temperature (Fixed Input, Internal Reference, No Scaling)
CC2640R2F-Q1 SoC ADC DNL vs ADC Code (Internal Reference, No Scaling)
Figure 7-21 SoC ADC DNL vs ADC Code (Internal Reference, No Scaling)
CC2640R2F-Q1 SoC ADC INL vs ADC Code (Internal Reference, No Scaling)
Figure 7-22 SoC ADC INL vs ADC Code (Internal Reference, No Scaling)