ZHCSGW5A
January 2017 – August 2017
CC2640R2F-Q1
PRODUCTION DATA.
1
器件概述
1.1
特性
1.2
应用
1.3
说明
1.4
功能框图
2
修订历史记录
3
Device Comparison
3.1
Related Products
4
Terminal Configuration and Functions
4.1
Pin Diagram - RGZ Package
4.2
Signal Descriptions - RGZ Package
4.3
Wettable Flanks
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Power Consumption Summary
5.5
General Characteristics
5.6
1-Mbps GFSK (Bluetooth low energy Technology) - RX
5.7
1-Mbps GFSK (Bluetooth low energy Technology) - TX
5.8
24-MHz Crystal Oscillator (XOSC_HF)
5.9
32.768-kHz Crystal Oscillator (XOSC_LF)
5.10
48-MHz RC Oscillator (RCOSC_HF)
5.11
32-kHz RC Oscillator (RCOSC_LF)
5.12
ADC Characteristics
5.13
Temperature Sensor
5.14
Battery Monitor
5.15
Continuous Time Comparator
5.16
Low-Power Clocked Comparator
5.17
Programmable Current Source
5.18
Synchronous Serial Interface (SSI)
5.19
DC Characteristics
5.20
Thermal Resistance Characteristics for RGZ Package
5.21
Timing Requirements
5.22
Switching Characteristics
5.23
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Main CPU
6.4
RF Core
6.5
Sensor Controller
6.6
Memory
6.7
Debug
6.8
Power Management
6.9
Clock Systems
6.10
General Peripherals and Modules
6.11
System Architecture
7
Application, Implementation, and Layout
7.1
Application Information
7.2
7 × 7 Internal Differential (7ID) Application Circuit
7.2.1
Layout
8
器件和文档支持
8.1
器件命名规则
8.2
工具和软件
8.3
文档支持
8.4
德州仪器 (TI) 低功耗射频网站
8.5
社区资源
8.6
其他信息
8.7
商标
8.8
静电放电警告
8.9
出口管制提示
8.10
术语表
9
机械、封装和可订购信息
9.1
封装信息
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
RGZ|48
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsgw5a_oa
zhcsgw5a_pm