ZHCSGW5A January   2017  – August 2017 CC2640R2F-Q1

PRODUCTION DATA.  

1. 1器件概述
   1. 1.1 特性
   2. 1.2 应用
   3. 1.3 说明
   4. 1.4 功能框图
2. 2修订历史记录
3. 3 Device Comparison
   1. 3.1 Related Products
4. 4Terminal Configuration and Functions
   1. 4.1 Pin Diagram - RGZ Package
   2. 4.2 Signal Descriptions - RGZ Package
   3. 4.3 Wettable Flanks
5. 5Specifications
   1. 5.1  Absolute Maximum Ratings
   2. 5.2  ESD Ratings
   3. 5.3  Recommended Operating Conditions
   4. 5.4  Power Consumption Summary
   5. 5.5  General Characteristics
   6. 5.6  1-Mbps GFSK (Bluetooth low energy Technology) - RX
   7. 5.7  1-Mbps GFSK (Bluetooth low energy Technology) - TX
   8. 5.8  24-MHz Crystal Oscillator (XOSC_HF)
   9. 5.9  32.768-kHz Crystal Oscillator (XOSC_LF)
   10. 5.10 48-MHz RC Oscillator (RCOSC_HF)
   11. 5.11 32-kHz RC Oscillator (RCOSC_LF)
   12. 5.12 ADC Characteristics
   13. 5.13 Temperature Sensor
   14. 5.14 Battery Monitor
   15. 5.15 Continuous Time Comparator
   16. 5.16 Low-Power Clocked Comparator
   17. 5.17 Programmable Current Source
   18. 5.18 Synchronous Serial Interface (SSI)
   19. 5.19 DC Characteristics
   20. 5.20 Thermal Resistance Characteristics for RGZ Package
   21. 5.21 Timing Requirements
   22. 5.22 Switching Characteristics
   23. 5.23 Typical Characteristics
6. 6Detailed Description
   1. 6.1  Overview
   2. 6.2  Functional Block Diagram
   3. 6.3  Main CPU
   4. 6.4  RF Core
   5. 6.5  Sensor Controller
   6. 6.6  Memory
   7. 6.7  Debug
   8. 6.8  Power Management
   9. 6.9  Clock Systems
   10. 6.10 General Peripherals and Modules
   11. 6.11 System Architecture
7. 7Application, Implementation, and Layout
   1. 7.1 Application Information
   2. 7.2 7 × 7 Internal Differential (7ID) Application Circuit
      1. 7.2.1 Layout
8. 8器件和文档支持
   1. 8.1  器件命名规则
   2. 8.2  工具和软件
   3. 8.3  文档支持
   4. 8.4  德州仪器 (TI) 低功耗射频网站
   5. 8.5  社区资源
   6. 8.6  其他信息
   7. 8.7  商标
   8. 8.8  静电放电警告
   9. 8.9  出口管制提示
   10. 8.10 术语表
9. 9机械、封装和可订购信息
   1. 9.1 封装信息