ZHCSNA1A april   2020  – february 2021 BQ25968

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Device Comparison Table
  8. 7 Pin Configuration and Functions
  9. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Charging System
      2. 9.3.2  Battery Charging Profile
      3. 9.3.3  Control State Diagram for System Implementation
      4. 9.3.4  Device Power Up
      5. 9.3.5  Switched Cap Function
        1. 9.3.5.1 Theory of Operation
      6. 9.3.6  Charging Start-Up
      7. 9.3.7  Integrated 16-Bit ADC for Monitoring and Smart Adapter Feedback
      8. 9.3.8  Device Internal Thermal Shutdown, TSBUS, and TSBAT Temperature Monitoring
      9. 9.3.9  INT Pin, STAT, FLAG, and MASK Registers
      10. 9.3.10 CDRVH and CDRVL_ADDRMS Functions
      11. 9.3.11 Parallel Operation Using Master and Slave Modes
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Modes and Protection Status
        1. 9.4.1.1 Input Overvoltage, Overcurrent, Undercurrent and Short-Circuit Protection
        2. 9.4.1.2 Battery Overvoltage and Overcurrent Protection
        3. 9.4.1.3 Cycle-by-Cycle Current Limit
    5. 9.5 Programming
      1. 9.5.1 F/S Mode Protocol
    6. 9.6 Register Maps
      1. 9.6.1 Customer Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Standalone Application Information (for use with switching charger)
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Parallel BQ25968 for Higher Power Applications
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 第三方产品免责声明
      2. 13.1.2 Device Nomenclature
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 接收文档更新通知
    4. 13.4 支持资源
    5. 13.5 Trademarks
    6. 13.6 静电放电警告
    7. 13.7 术语表
  15. 14Mechanical, Packaging, and Orderable Information

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订购信息

13.6 静电放电警告

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif 静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。