ZHCSW14C April   2008  – April 2024 AM26LV31E

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Complementary Out-Enable Inputs
      2. 7.3.2 High Output Impedance for Specific Driver Enable Inputs
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Revision History

Changes from Revision B (September 2016) to Revision C (April 2024)

  • 将“器件信息”表更改为封装信息 表Go
  • Changed the Thermal Information tableGo
  • Changed the note in Figure 6-3 Go

Changes from Revision A (May 2008) to Revision B (September 2016)

  • 添加了应用 部分、热性能信息 表、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • 删除了订购信息 表，请参阅数据表末尾的机械、封装和可订购信息 Go
  • Changed ESD PROTECTION to ESD Ratings tableGo
  • Changed RθJA for PW package from 108°C/W: to 99.5°C/WGo
  • Changed RθJA for NS package from 64°C/W: to 74.5°C/WGo
  • Changed RθJA for RGY package from 39°C/W: to 39.3°C/WGo