ZHCSSI3 February   2024 ADS1288

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: 1.65V ≤ IOVDD ≤ 1.95V and 2.7V ≤ IOVDD ≤ 3.6V
    7. 5.7 Switching Characteristics: 1.65V ≤ IOVDD ≤ 1.95V and 2.7V ≤ IOVDD ≤ 3.6V
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 Noise Performance
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 PGA and Buffer
        1. 7.3.2.1 Programmable Gain Amplifier (PGA)
        2. 7.3.2.2 Buffer Operation (PGA Bypass)
      3. 7.3.3 Voltage Reference Input
      4. 7.3.4 IOVDD Power Supply
      5. 7.3.5 Modulator
        1. 7.3.5.1 Modulator Overdrive
      6. 7.3.6 Digital Filter
        1. 7.3.6.1 Sinc Filter Section
        2. 7.3.6.2 FIR Filter Section
        3. 7.3.6.3 Group Delay and Step Response
          1. 7.3.6.3.1 Linear Phase Response
          2. 7.3.6.3.2 Minimum Phase Response
        4. 7.3.6.4 HPF Stage
      7. 7.3.7 Clock Input
      8. 7.3.8 GPIO
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Mode
      2. 7.4.2 Reset
      3. 7.4.3 Synchronization
        1. 7.4.3.1 Pulse-Sync Mode
        2. 7.4.3.2 Continuous-Sync Mode
      4. 7.4.4 Sample Rate Converter
      5. 7.4.5 Offset and Gain Calibration
        1. 7.4.5.1 OFFSET Register
        2. 7.4.5.2 GAIN Register
        3. 7.4.5.3 Calibration Procedure
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Chip Select (CS)
        2. 7.5.1.2 Serial Clock (SCLK)
        3. 7.5.1.3 Data Input (DIN)
        4. 7.5.1.4 Data Output (DOUT)
        5. 7.5.1.5 Data Ready (DRDY)
      2. 7.5.2 Conversion Data Format
      3. 7.5.3 Commands
        1. 7.5.3.1  Single Byte Command
        2. 7.5.3.2  WAKEUP: Wake Command
        3. 7.5.3.3  STANDBY: Software Power-Down Command
        4. 7.5.3.4  SYNC: Synchronize Command
        5. 7.5.3.5  RESET: Reset Command
        6. 7.5.3.6  Read Data Direct
        7. 7.5.3.7  RDATA: Read Conversion Data Command
        8. 7.5.3.8  RREG: Read Register Command
        9. 7.5.3.9  WREG: Write Register Command
        10. 7.5.3.10 OFSCAL: Offset Calibration Command
        11. 7.5.3.11 GANCAL: Gain Calibration Command
  9. Register Map
    1. 8.1 Register Descriptions
      1. 8.1.1 ID/SYNC: Device ID, SYNC Register (Address = 00h) [Reset = xxxx0010b]
      2. 8.1.2 CONFIG0: Configuration Register 0 (Address = 01h) [Reset = 92h]
      3. 8.1.3 CONFIG1: Configuration Register 1 (Address = 02h) [Reset = 10h]
      4. 8.1.4 HPF0, HPF1: High-Pass Filter Registers (Address = 03h, 04h) [Reset = 32h, 03h]
      5. 8.1.5 OFFSET0, OFFSET1, OFFSET2: Offset Calibration Registers (Address = 05h, 06h, 07h) [Reset = 00h, 00h, 00h]
      6. 8.1.6 GAIN0, GAIN1, GAIN2: Gain Calibration Registers (Address = 08h, 09h, 0Ah) [Reset = 00h, 00h, 40h]
      7. 8.1.7 GPIO: Digital Input/Output Register (Address = 0Bh) [Reset = 000xx000b]
      8. 8.1.8 SRC0, SRC1: Sample Rate Converter Registers (Address = 0Ch, 0Dh) [Reset = 00h, 80h]
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Analog Power Supplies
      2. 9.3.2 Digital Power Supply
      3. 9.3.3 Grounds
      4. 9.3.4 Thermal Pad
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 静电放电警告
    5. 10.5 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Switching Characteristics: 1.65V ≤ IOVDD ≤ 1.95V and 2.7V ≤ IOVDD ≤ 3.6V

over operating ambient temperature range and CLOAD = 20pF (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
SERIAL INTERFACE
tw(DRH) Pulse duration, DRDY high 8 1 / f(CLK)
tp(CSDO) Propagation delay time, CS falling edge to DOUT driven valid 50 ns
tp(SCDO) Propagation delay time, SCLK falling edge to new DOUT valid 50 ns
th(SCDO) Propagation delay time, SCLK falling edge to DOUT invalid 5 ns
SYNC
tp(SYNDR) Propagation delay time, SYNC rising edge to valid data DRDY falling edge 62.98145 / fDATA + 930 / fCLK s
RESET
tp(RSTDR) Propagation delay time, RESET rising edge to DRDY falling edge 516,874 1/ fCLK
PWDN
tp(PDDR) Propagation delay time, PWDN rising edge to DRDY falling edge 62.98145 / fDATA + 946 / f(CLK) s
POWER UP
tp(SUPDR) Propagation delay time, power supply and CLK applied to first DRDY pulse 650,000 1 / fCLK