ZHCSSI3 February   2024 ADS1288

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: 1.65V ≤ IOVDD ≤ 1.95V and 2.7V ≤ IOVDD ≤ 3.6V
    7. 5.7 Switching Characteristics: 1.65V ≤ IOVDD ≤ 1.95V and 2.7V ≤ IOVDD ≤ 3.6V
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Noise Performance
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 PGA and Buffer
        1. 7.3.2.1 Programmable Gain Amplifier (PGA)
        2. 7.3.2.2 Buffer Operation (PGA Bypass)
      3. 7.3.3 Voltage Reference Input
      4. 7.3.4 IOVDD Power Supply
      5. 7.3.5 Modulator
        1. 7.3.5.1 Modulator Overdrive
      6. 7.3.6 Digital Filter
        1. 7.3.6.1 Sinc Filter Section
        2. 7.3.6.2 FIR Filter Section
        3. 7.3.6.3 Group Delay and Step Response
          1. 7.3.6.3.1 Linear Phase Response
          2. 7.3.6.3.2 Minimum Phase Response
        4. 7.3.6.4 HPF Stage
      7. 7.3.7 Clock Input
      8. 7.3.8 GPIO
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Mode
      2. 7.4.2 Reset
      3. 7.4.3 Synchronization
        1. 7.4.3.1 Pulse-Sync Mode
        2. 7.4.3.2 Continuous-Sync Mode
      4. 7.4.4 Sample Rate Converter
      5. 7.4.5 Offset and Gain Calibration
        1. 7.4.5.1 OFFSET Register
        2. 7.4.5.2 GAIN Register
        3. 7.4.5.3 Calibration Procedure
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Chip Select (CS)
        2. 7.5.1.2 Serial Clock (SCLK)
        3. 7.5.1.3 Data Input (DIN)
        4. 7.5.1.4 Data Output (DOUT)
        5. 7.5.1.5 Data Ready (DRDY)
      2. 7.5.2 Conversion Data Format
      3. 7.5.3 Commands
        1. 7.5.3.1  Single Byte Command
        2. 7.5.3.2  WAKEUP: Wake Command
        3. 7.5.3.3  STANDBY: Software Power-Down Command
        4. 7.5.3.4  SYNC: Synchronize Command
        5. 7.5.3.5  RESET: Reset Command
        6. 7.5.3.6  Read Data Direct
        7. 7.5.3.7  RDATA: Read Conversion Data Command
        8. 7.5.3.8  RREG: Read Register Command
        9. 7.5.3.9  WREG: Write Register Command
        10. 7.5.3.10 OFSCAL: Offset Calibration Command
        11. 7.5.3.11 GANCAL: Gain Calibration Command
  9. 8 Register Map
    1. 8.1 Register Descriptions
      1. 8.1.1 ID/SYNC: Device ID, SYNC Register (Address = 00h) [Reset = xxxx0010b]
      2. 8.1.2 CONFIG0: Configuration Register 0 (Address = 01h) [Reset = 92h]
      3. 8.1.3 CONFIG1: Configuration Register 1 (Address = 02h) [Reset = 10h]
      4. 8.1.4 HPF0, HPF1: High-Pass Filter Registers (Address = 03h, 04h) [Reset = 32h, 03h]
      5. 8.1.5 OFFSET0, OFFSET1, OFFSET2: Offset Calibration Registers (Address = 05h, 06h, 07h) [Reset = 00h, 00h, 00h]
      6. 8.1.6 GAIN0, GAIN1, GAIN2: Gain Calibration Registers (Address = 08h, 09h, 0Ah) [Reset = 00h, 00h, 40h]
      7. 8.1.7 GPIO: Digital Input/Output Register (Address = 0Bh) [Reset = 000xx000b]
      8. 8.1.8 SRC0, SRC1: Sample Rate Converter Registers (Address = 0Ch, 0Dh) [Reset = 00h, 80h]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Analog Power Supplies
      2. 9.3.2 Digital Power Supply
      3. 9.3.3 Grounds
      4. 9.3.4 Thermal Pad
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 静电放电警告
    5. 10.5 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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9.4.1 Layout Guidelines

Figure 9-3 shows the layout of the geophone input application example of Figure 9-1. In most cases, a single unbroken ground plane connecting the grounds of the analog and digital components is preferred. A four-layer PCB is used, with the inner layers dedicated for ground and power-supply planes. Low resistance power-supply planes are necessary to maintain THD performance.

Connect the REFN pin of the ADC directly to the ground terminal of the voltage reference to avoid ground noise coupling. Similarly, avoid ground noise between the tie-points of termination resistors R1 and R2 by connecting the resistors together first, then connect to ground (dual-supply operation).

Place the smaller of the parallel power-supply bypass capacitors closest to the device supply pins. The thermal pad of the package connects to the most negative power-supply voltage (AVSS). Figure 9-3 shows single-supply operation, with AVSS tied to AGND. In this case, the thermal pad connects to AGND. For dual-supply operation, connect the thermal pad to AVSS.