ZHCSN14H June   2005  – June 2025 ADS1232 , ADS1234

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Noise Performance
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Inputs (AINPX, AINNX)
      2. 7.3.2  Temperature Sensor (ADS1232 Only)
      3. 7.3.3  Low-Noise PGA
        1. 7.3.3.1 PGA Bypass Capacitor
      4. 7.3.4  Voltage Reference Inputs (REFP, REFN)
      5. 7.3.5  Clock Sources
      6. 7.3.6  Digital Filter Frequency Response
      7. 7.3.7  Settling Time
      8. 7.3.8  Data Rate
      9. 7.3.9  Data Format
      10. 7.3.10 Data Ready and Data Output (DRDY/DOUT)
      11. 7.3.11 Serial Clock Input (SCLK)
      12. 7.3.12 Data Retrieval
    4. 7.4 Device Functional Modes
      1. 7.4.1 Offset Calibration Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Standby Mode With Offset-Calibration
      4. 7.4.4 Power-Down Mode
      5. 7.4.5 Power-Up Sequence
      6. 7.4.6 Summary of Serial Interface Waveforms
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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9.4 静电放电警告

ADS1232 ADS1234 静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。