TIDUCL3 February   2017

 

  1. 1 Overview
  2. 2 Resources
  3. 3 Features
  4. 4 Applications
  5. 5 Design Images
  6. 6 System Overview
    1. 6.1 System Description
    2. 6.2 Key System Specifications
    3. 6.3 Block Diagram
    4. 6.4 Highlighted Products
      1. 6.4.1 LMT87-Q1
      2. 6.4.2 TLC555-Q1
      3. 6.4.3 OPA2377-Q1
      4. 6.4.4 TL431-Q1
      5. 6.4.5 TPS92691-Q1
  7. 7 System Design Theory
    1. 7.1  PCB and Form Factor
    2. 7.2  Optimizing Board Performance Based on LED String Voltage and Current
    3. 7.3  Switching Frequency
    4. 7.4  Output Overvoltage Protection (OVP)
    5. 7.5  Current Monitoring (IMON)
    6. 7.6  Thermal Foldback
      1. 7.6.1 Changing Thermal Foldback Response
        1. 7.6.1.1 Changing Starting Point for Thermal Foldback
        2. 7.6.1.2 Changing Slope of Thermal Foldback
        3. 7.6.1.3 Constant Current at High Temperatures
      2. 7.6.2 Thermal Foldback Without PWM Dimming
    7. 7.7  Clock Generation (PWM)
    8. 7.8  Onboard Supply and Setting Duty Cycle
    9. 7.9  Buffering, Averaging, and Filtering
    10. 7.10 Boost Converter
  8. 8 Getting Started Hardware
    1. 8.1 Hardware
    2. 8.2 LED Selection
    3. 8.3 J3, LED+, LED– (Boost)
    4. 8.4 J1, POS(+), NEG(–)
    5. 8.5 J4, Temperature Sensor Connection
    6. 8.6 Duty Cycle Adjust
  9. 9 Testing and Results
    1. 9.1 Duty Cycle Accuracy
    2. 9.2 Thermal Foldback Testing
    3. 9.3 EMI Testing
    4. 9.4 Accuracy Calculation
  10. 10Design Files
    1. 10.1 Schematics
    2. 10.2 Bill of Materials
    3. 10.3 PCB Layout Recommendations
      1. 10.3.1 Layout Prints
    4. 10.4 Altium Project
    5. 10.5 Gerber Files
    6. 10.6 Assembly Drawings
  11. 11Related Documentation
    1. 11.1 Trademarks
  12. 12About the Author

7.1 PCB and Form Factor

This TI Design is not intended to fit any particular form factor. The specific and primary objective of the design with regards to the PCB is to make a solution that is compact, while still providing a way to test the performance of the board. Figure 7 shows a 3D rendering of the board.

TIDA-01382 tida-01382_board_picture3d.gifFigure 7. 3D Render of TIDA-01382 Board

In a final-production version of this TI Design, several techniques may be used to reduce the size of the solution:

  • Test points, headers, sockets, standoffs, and banana plugs can be removed because they do not service a direct function for the board.
  • The number, size, and value of capacitors in the system can be optimized.
  • The application may not require an input-conducted emissions EMI (PI) filter.