ZHCS015G october   2011  – august 2023 BQ25504

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. 说明(续)
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Maximum Power Point Tracking
      2. 8.3.2 Battery Undervoltage Protection
      3. 8.3.3 Battery Overvoltage Protection
      4. 8.3.4 Battery Voltage in Operating Range (VBAT_OK Output)
      5. 8.3.5 Nano-Power Management and Efficiency
    4. 8.4 Device Functional Modes
      1. 8.4.1 Cold-Start Operation (VSTOR < VSTOR_CHGEN, VIN_DC > VIN(CS) and PIN > PIN(CS))
      2. 8.4.2 Main Boost Charger Enabled (VSTOR > VSTOR_CHGEN, VIN_DC > VIN(DC) and EN = LOW )
      3. 8.4.3 Thermal Shutdown
  10. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Storage Element Selection
      2. 9.1.2 Inductor Selection
      3. 9.1.3 Capacitor Selection
        1. 9.1.3.1 VREF_SAMP Capacitance
        2. 9.1.3.2 VIN_DC Capacitance
        3. 9.1.3.3 VSTOR Capacitance
        4. 9.1.3.4 Additional Capacitance on VSTOR or VBAT
    2. 9.2 Typical Applications
      1. 9.2.1 Solar Application Circuit
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 TEG Application Circuit
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 MPPT Disabled, Low Impedance Source Application Circuit
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方产品免责声明
      2. 12.1.2 Zip Files
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Storage Element Selection

In order for the charge management circuitry to protect the storage element from over-charging or discharging, the storage element must be connected to VBAT pin and the system load tied to the VSTOR pin. Many types of elements can be used, such as capacitors, super capacitors or various battery chemistries. A storage element with 100 uF equivalent capacitance is required to filter the pulse currents of the PFM switching charger. The equivalent capacitance of a battery can be computed as computed as:

Equation 6. CEQ = 2 x mAHrBAT(CHRGD) x 3600 s/Hr / VBAT(CHRGD)

In order for the storage element to be able to charge VSTOR capacitor (CSTOR) within the tVB_HOT_PLUG (50 ms typical) window at hot-plug; therefore preventing the IC from entering cold start, the time constant created by the storage element's series resistance (plus the resistance of the internal PFET switch) and equivalent capacitance must be less than tVB_HOT_PLUG . For example, a battery's resistance can be computed as:

Equation 7. RBAT = VBAT / IBAT(CONTINUOUS) from the battery specifications.

The storage element must be sized large enough to provide all of the system load during periods when the harvester is no longer providing power. The harvester is expected to provide at least enough power to fully charge the storage element while the system is in low power or sleep mode. Assuming no load on VSTOR (i.e., the system is in low power or sleep mode), the following equation estimates charge time from voltage VBAT1 to VBAT2 for given input power is:

Refer to SLUC462 for a design example that sizes the storage element.

Equation 8. PIN × ηEST × tCHRG = 1/2 × CEQ X (VBAT22 - VBAT12)

Note that if there are large load transients or the storage element has significant impedance then it may be necessary to increase the CSTOR capacitor from the 4.7uF minimum or add additional capacitance to VBAT in order to prevent a droop in the VSTOR voltage. See below for guidance on sizing capacitors.