TPS82084
- Low Profile MicroSiP™ Power Module
- DCS-control topology
- Up to 95% efficiency
- 17-µA operating quiescent current
- -40°C to 125°C operating temperature range
- Hiccup short circuit protection
- 2.5-V to 6-V input voltage range
- 0.8-V to VIN adjustable output voltage
- Power save mode for light load efficiency
- 100% duty cycle for lowest dropout
- Output discharge function
- Power good output
- Integrated soft startup, and support pre-biased startup
- Over temperature protection
- CISPR11 class B compliant
- 2.8-mm x 3.0-mm x 1.3-mm 8-Pin µSiL package
The TPS82084/5 are 2-A/3-A step-down converter MicroSiP™ modules optimized for small solution size and high efficiency. The power module integrates a synchronous step-down converter and an inductor to simplify design, reduce external components and save PCB area. The low profile and compact solution is suitable for automated assembly by standard surface mount equipment.
To maximize efficiency, the converter operates in PWM mode with a nominal switching frequency of 2.4MHz and automatically enters Power Save Mode operation at light load currents. In Power Save Mode, the device operates with typically 17-µA quiescent current. Using the DCS-Control topology, the device achieves excellent load transient performance and accurate output voltage regulation. The EN and PG pins, which support sequencing configurations, bring a flexible system design. An integrated soft startup reduces the inrush current required from the input supply. Over temperature protection and Hiccup short circuit protection deliver a robust and reliable solution.
技術文件
設計與開發
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TPS82084EVM-672 — 具有整合式電感器的 2-A 降壓轉換器評估模組
TPS82084EVM-672 旨在協助使用者輕鬆評估和測試 TPS82084 的運作和功能。EVM 可在高達 2A 的輸出電流下,將高達 6V 的輸入電壓轉換成 1.2V 的穩壓輸出電壓。TPS82084 包含 IC 與電感器,可實現 35 mm² 的整體解決方案尺寸。
TIDA-010011 — 用於保護繼電器處理器模組的高效電源供應架構參考設計
TIDA-01051 — 針對自動測試設備最佳化 FPGA 利用率和數據處理能力的參考設計
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| USIP (SIL) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。