ZHCSIK3A July   2018  – January 2025 TPS650861

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Total Current Consumption
    6. 5.6  Electrical Characteristics: Reference and Monitoring System
    7. 5.7  Electrical Characteristics: Buck Controllers
    8. 5.8  Electrical Characteristics: Synchronous Buck Converters
    9. 5.9  Electrical Characteristics: LDOs
    10. 5.10 Electrical Characteristics: Load Switches
    11. 5.11 Digital Signals: I2C Interface
    12. 5.12 Digital Input Signals (CTLx)
    13. 5.13 Digital Output Signals (IRQB, GPOx)
    14. 5.14 Timing Requirements
    15. 5.15 Switching Characteristics
    16. 5.16 Typical Characteristics
  7. Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Programming the TPS650861
    4. 6.4  SMPS Voltage Regulators
      1. 6.4.1 Controller Overview
      2. 6.4.2 Converter Overview
      3. 6.4.3 DVS
      4. 6.4.4 Decay
      5. 6.4.5 Current Limit
    5. 6.5  LDOs and Load Switches
      1. 6.5.1 VTT LDO
      2. 6.5.2 LDOA1–LDOA3
      3. 6.5.3 Load Switches
    6. 6.6  Power Goods (PGOOD or PG) and GPOs
    7. 6.7  One-Time Programmable Memory
    8. 6.8  Power Sequencing and VR Control
      1. 6.8.1 CTLx Sequencing
      2. 6.8.2 PG Sequencing
      3. 6.8.3 Enable Delay
      4. 6.8.4 Power-Up Sequence
      5. 6.8.5 Power-Down Sequence
      6. 6.8.6 Sleep State Entry and Exit
      7. 6.8.7 Emergency Shutdown
    9. 6.9  Device Functional Modes
      1. 6.9.1 Off Mode
      2. 6.9.2 Standby Mode
      3. 6.9.3 Active Mode
    10. 6.10 I2C Interface
      1. 6.10.1 F/S-Mode Protocol
    11. 6.11 I2C Address: 0x5E Register Maps
      1. 6.11.1  Register Map Summary
      2. 6.11.2  DEVICEID1: 1st PMIC Device and Revision ID Register (offset = 00h) [reset = X]
      3. 6.11.3  DEVICEID2: 2nd PMIC Device and Revision ID Register (offset = 01h) [reset = X]
      4. 6.11.4  IRQ: PMIC Interrupt Register (offset = 02h) [reset = 0000 0000]
      5. 6.11.5  IRQ_MASK: PMIC Interrupt Mask Register (offset = 03h) [reset = 1111 1111]
      6. 6.11.6  PMICSTAT: PMIC Status Register (offset = 04h) [reset = 0000 0000]
      7. 6.11.7  SHUTDNSRC: PMIC Shut-Down Event Register (offset = 05h) [reset = 0000 0000]
      8. 6.11.8  BUCK1CTRL: BUCK1 Control Register (offset = 20h) [reset = X]
      9. 6.11.9  BUCK2CTRL: BUCK2 Control Register (offset = 21h) [reset = X]
      10. 6.11.10 BUCK3DECAY: BUCK3 Decay Control Register (offset = 22h) [reset = X]
      11. 6.11.11 BUCK3VID: BUCK3 VID Register (offset = 23h) [reset = X]
      12. 6.11.12 BUCK3SLPCTRL: BUCK3 Sleep Control VID Register (offset = 24h) [reset = X]
      13. 6.11.13 BUCK4CTRL: BUCK4 Control Register (offset = 25h) [reset = X]
      14. 6.11.14 BUCK5CTRL: BUCK5 Control Register (offset = 26h) [reset = X]
      15. 6.11.15 BUCK6CTRL: BUCK6 Control Register (offset = 27h) [reset = X]
      16. 6.11.16 LDOA2CTRL: LDOA2 Control Register (offset = 28h) [reset = X]
      17. 6.11.17 LDOA3CTRL: LDOA3 Control Register (offset = 29h) [reset = X]
      18. 6.11.18 DISCHCTRL1: 1st Discharge Control Register (offset = 40h) [reset = X]
      19. 6.11.19 DISCHCTRL2: 2nd Discharge Control Register (offset = 41h) [reset = X]
      20. 6.11.20 DISCHCTRL3: 3rd Discharge Control Register (offset = 42h) [reset = X]
      21. 6.11.21 PG_DELAY1: 1st Power Good Delay Register (offset = 43h) [reset = X]
      22. 6.11.22 FORCESHUTDN: Force Emergency Shutdown Control Register (offset = 91h) [reset = 0000 0000]
      23. 6.11.23 BUCK1SLPCTRL: BUCK1 Sleep Control Register (offset = 92h) [reset = X]
      24. 6.11.24 BUCK2SLPCTRL: BUCK2 Sleep Control Register (offset = 93h) [reset = X]
      25. 6.11.25 BUCK4VID: BUCK4 VID Register (offset = 94h) [reset = X]
      26. 6.11.26 BUCK4SLPVID: BUCK4 Sleep VID Register (offset = 95h) [reset = X]
      27. 6.11.27 BUCK5VID: BUCK5 VID Register (offset = 96h) [reset = X]
      28. 6.11.28 BUCK5SLPVID: BUCK5 Sleep VID Register (offset = 97h) [reset = X]
      29. 6.11.29 BUCK6VID: BUCK6 VID Register (offset = 98h) [reset = X]
      30. 6.11.30 BUCK6SLPVID: BUCK6 Sleep VID Register (offset = 99h) [reset = X]
      31. 6.11.31 LDOA2VID: LDOA2 VID Register (offset = 9Ah) [reset = X]
      32. 6.11.32 LDOA3VID: LDOA3 VID Register (offset = 9Bh) [reset = X]
      33. 6.11.33 BUCK123CTRL: BUCK1-3 Control Register (offset = 9Ch) [reset = X]
      34. 6.11.34 PG_DELAY2: 2nd Power Good Delay Register (offset = 9Dh) [reset = X]
      35. 6.11.35 SWVTT_DIS: SWVTT Disable Register (offset = 9Fh) [reset = X]
      36. 6.11.36 I2C_RAIL_EN1: 1st VR Pin Enable Override Register (offset = A0h) [reset = X]
      37. 6.11.37 I2C_RAIL_EN2/GPOCTRL: 2nd VR Pin Enable Override and GPO Control Register (offset = A1h) [reset = X]
      38. 6.11.38 PWR_FAULT_MASK1: 1st VR Power Fault Mask Register (offset = A2h) [reset = X]
      39. 6.11.39 PWR_FAULT_MASK2: 2nd VR Power Fault Mask Register (offset = A3h) [reset = X]
      40. 6.11.40 GPO1PG_CTRL1: 1st GPO1 PG Control Register (offset = A4h) [reset = X]
      41. 6.11.41 GPO1PG_CTRL2: 2nd GPO1 PG Control Register (offset = A5h) [reset = X]
      42. 6.11.42 GPO4PG_CTRL1: 1st GPO4 PG Control Register (offset = A6h) [reset = X]
      43. 6.11.43 GPO4PG_CTRL2: 2nd GPO4 PG Control Register (offset = A7h) [reset = X]
      44. 6.11.44 GPO2PG_CTRL1: 1st GPO2 PG Control Register (offset = A8h) [reset = X]
      45. 6.11.45 GPO2PG_CTRL2: 2nd GPO2 PG Control Register (offset = A9h) [reset = X]
      46. 6.11.46 GPO3PG_CTRL1: 1st GPO3 PG Control Register (offset = AAh) [reset = X]
      47. 6.11.47 GPO3PG_CTRL2: 2nd GPO3 PG Control Register (offset = ABh) [reset = X]
      48. 6.11.48 MISCSYSPG Register (offset = ACh) [reset = X]
        1. 6.11.48.1 VTT_DISCH_CTRL Register (offset = ADh) [reset = X]
      49. 6.11.49 LDOA1_SWB2_CTRL: LDOA1 and SWB2 Control Register (offset = AEh) [reset = X]
      50. 6.11.50 PG_STATUS1: 1st Power Good Status Register (offset = B0h) [reset = 0000 0000]
      51. 6.11.51 PG_STATUS2: 2nd Power Good Status Register (offset = B1h) [reset = 0000 0000]
      52. 6.11.52 PWR_FAULT_STATUS1: 1st Power Fault Status Register (offset = B2h) [reset = 0000 0000]
      53. 6.11.53 PWR_FAULT_STATUS2: 2nd Power Fault Status Register (offset = B3h) [reset = 0000 0000]
      54. 6.11.54 TEMPCRIT: Temperature Fault Status Register (offset = B4h) [reset = 0000 0000]
      55. 6.11.55 TEMPHOT: Temperature Hot Status Register (offset = B5h) [reset = 0000 0000]
      56. 6.11.56 OC_STATUS: Overcurrent Fault Status Register (offset = B6h) [reset = 0000 0000]
    12. 6.12 I2C Address: 0x38 Register Maps
      1. 6.12.1  Register Map Summary
      2. 6.12.2  OTP_CTRL1 (offset = 02h) [reset = 0010 0000]
      3. 6.12.3  OTP_CTRL2 (offset = 03h) [reset = X]
      4. 6.12.4  BUCK1_CTRL_EN1 (offset = 07h) [reset = X]
      5. 6.12.5  BUCK1_CTRL_EN2 (offset = 08h) [reset = X]
      6. 6.12.6  BUCK1_CTRL_EN3 (offset = 09h) [reset = X]
      7. 6.12.7  BUCK2_CTRL_EN1 (offset = 0Ah) [reset = X]
      8. 6.12.8  BUCK2_CTRL_EN2 (offset = 0Bh) [reset = X]
      9. 6.12.9  BUCK2_CTRL_EN3 (offset = 0Ch) [reset = X]
      10. 6.12.10 BUCK3_CTRL_EN1 (offset = 0Ah) [reset = X]
      11. 6.12.11 BUCK3_CTRL_EN2 (offset = 0Eh) [reset = X]
      12. 6.12.12 BUCK3_CTRL_EN3 (offset = 0Fh) [reset = X]
      13. 6.12.13 BUCK4_CTRL_EN1 (offset = 10h) [reset = X]
      14. 6.12.14 BUCK4_CTRL_EN2 (offset = 11h) [reset = X]
      15. 6.12.15 BUCK4_CTRL_EN3 (offset = 12h) [reset = X]
      16. 6.12.16 BUCK5_CTRL_EN1 (offset = 13h) [reset = X]
      17. 6.12.17 BUCK5_CTRL_EN2 (offset = 14h) [reset = X]
      18. 6.12.18 BUCK5_CTRL_EN3 (offset = 15h) [reset = X]
      19. 6.12.19 BUCK6_CTRL_EN1 (offset = 16h) [reset = X]
      20. 6.12.20 BUCK6_CTRL_EN2 (offset = 17h) [reset = X]
      21. 6.12.21 BUCK6_CTRL_EN3 (offset = 18h) [reset = X]
      22. 6.12.22 SWA1_CTRL_EN1 (offset = 19h) [reset = X]
      23. 6.12.23 SWA1_CTRL_EN2 (offset = 1Ah) [reset = X]
      24. 6.12.24 SWA1_CTRL_EN3 (offset = 1Bh) [reset = X]
      25. 6.12.25 LDOA2_CTRL_EN1 (offset = 1Ch) [reset = X]
      26. 6.12.26 LDOA2_CTRL_EN2 (offset = 1Dh) [reset = X]
      27. 6.12.27 LDOA2_CTRL_EN3 (offset = 1Eh) [reset = X]
      28. 6.12.28 LDOA3_CTRL_EN1 (offset = 1Fh) [reset = X]
      29. 6.12.29 LDOA3_CTRL_EN2 (offset = 20h) [reset = X]
      30. 6.12.30 LDOA3_CTRL_EN3 (offset = 21h) [reset = X]
      31. 6.12.31 SWB1_CTRL_EN1 (offset = 22h) [reset = X]
      32. 6.12.32 SWB1_CTRL_EN2 (offset = 23h) [reset = X]
      33. 6.12.33 SWB1_CTRL_EN3 (offset = 24h) [reset = X]
      34. 6.12.34 SWB2_LDOA1_CTRL_EN1 (offset = 25h) [reset = X]
      35. 6.12.35 SWB2_LDOA1_CTRL_EN2 (offset = 26h) [reset = X]
      36. 6.12.36 SWB2_LDOA1_CTRL_EN3 (offset = 27h) [reset = X]
      37. 6.12.37 SLP_PIN (offset = 29h) [reset = X]
      38. 6.12.38 OUTPUT_MODE (offset = 2Ah) [reset = X]
      39. 6.12.39 I2C_SLAVE_ADDR (offset = 5Fh) [reset = X]
  8. Applications, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Controller Design Procedure
          1. 7.2.2.1.1 Selecting the Inductor
          2. 7.2.2.1.2 Selecting the Output Capacitors
          3. 7.2.2.1.3 Selecting the FETs
          4. 7.2.2.1.4 Bootstrap Capacitor
          5. 7.2.2.1.5 Setting the Current Limit
          6. 7.2.2.1.6 Selecting the Input Capacitors
        2. 7.2.2.2 Converter Design Procedure
          1. 7.2.2.2.1 Selecting the Inductor
          2. 7.2.2.2.2 Selecting the Output Capacitors
          3. 7.2.2.2.3 Selecting the Input Capacitors
        3. 7.2.2.3 LDO Design Procedure
      3. 7.2.3 Application Curves
      4. 7.2.4 Layout
        1. 7.2.4.1 Layout Guidelines
        2. 7.2.4.2 Layout Example
      5. 7.2.5 VIN 5-V Application
        1. 7.2.5.1 Design Requirements
        2. 7.2.5.2 Design Procedure
        3. 7.2.5.3 Application Curves
    3. 7.3 Power Supply Coupling and Bulk Capacitors
    4. 7.4 Dos and Don'ts
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 第三方产品免责声明
      2. 8.1.2 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

One-Time Programmable Memory

The PMIC has two banks of non-volatile one-time programmable (OTP) memory which stores the default settings for the device. The OTP memory is mapped to corresponding volatile registers which are cleared when VSYS goes below UVLO. When VSYS goes above UVLO, the contents of the OTP memory is loaded into the corresponding volatile registers which are then used to control the PMIC. The OTP is also reloaded in case of any emergency shutdown condition. When programming the PMIC, the values in the volatile registers which have OTP memory equivalents are burned into the OTP.

Some registers do not have OTP equivalent memory. For example, the IRQ register, which indicates which interrupts have been triggered, does not need OTP memory equivalent because its values are always determined after power up. Similarly, the IRQ_MASK register does not have OTP backing because in order to be useful, the processor needs to communicate with the PMIC to set the masks correctly. There is no need to have a default value other than 1b for these bits. OTP programmable bits are indicated with an 'X' in the register map. Some registers are accessed using I2C address 0x5E, which can be changed if necessary using the I2C_SLAVE_ADDR register (see Section 6.12.39). Other registers, which can only be accessed while in programming mode, are accessed using I2C address 0x38, which cannot be changed.

The OTP memory settings are set to 1b with a 7V supply, in a process called "burning". Lower voltages may result in values not being stored or the bit flipping (from 1b to 0b) after some time has passed. To avoid this occurring, the IRQB pin should be probed with an oscilloscope during the prototyping phase of development to ensure it does not drop below 6.7V during OTP memory burn in. Any bit can be burned from a 0b to a 1b, but once a bit is a 1b, it cannot go back to being a 0b. As a result, it is possible to burn an OTP program and then make minor changes and re-burn the OTP as long as all of the changes are 0b to 1b. For example, if the original OTP program had BUCK3_VID = 1V (0011000b) then it can be changed to BUCK3_VID = 1.15V (0011110b) without issue since it is just bits 1 and 2 being changed from 0b to 1b. However, if the new desired BUCK3_VID = 0.9V (0010100b), then the second bank of OTP would need to be used since bit 3 cannot change from 1b to 0b. The switch from OTP Bank 0 to OTP Bank 1 is permanent as the pointer bit is also OTP.

Detailed information regarding the programming of the non-volatile one-time programmable (OTP) memory is available in the TPS65086100 OTP Memory Programming Guide.

All OTP programmed settings should be validated during prototyping phase to ensure desired functionality because parts cannot be returned in case of incorrect programming. Any issues should be reported to http://e2e.ti.com/support/power_management/pmu/.