2 修订历史记录
Changes from October 27, 2016 to July 13, 2018 (from C Revision () to D Revision)
- Added Code Composer Studio UniFlashGo
- Changed 描述部分Go
- Changed Table 3-1Go
- Changed Figure 4-1Go
- Changed Figure 4-2Go
- Added support for split supply rail to Section 5.3Go
- Changed Operating supply voltageGo
- Added test conditions at 433.92 MHz to Section 5.4Go
- Moved footnote to specific values in Section 5.5Go
- Changed footnote in Section 5.5Go
- Changed test conditions for Receiver sensitivity, 50 kbps in Section 5.6Go
- Added parameters to Section 5.6Go
- Added Receiver sensitivity parameters to Section 5.7Go
- Changed Go
- Changed footnote in Go
- Added “软件”部分Go
Changes from October 28, 2015 to October 27, 2016 (from B Revision () to C Revision)
- Added 32KB 和 64KB 至系统内可编程闪存的特性要点Go
- Changed 至正确引脚数(位于特性要点 与 RoHS 兼容的封装Go
- Changed CC1310 框图Go
- Changed Figure 4-2, corrected typo in pin nameGo
- Changed the table note in Section 5.1 from: VDDS to: groundGo
- Changed ESD ratings for all pins in Section 5.2Go
- Added OOK modulation power consumption to Section 5.4Go
- Added OOK modulation sensitivity to Section 5.6Go
- Added receive parameters for 431-MHz to 527-MHz band in Section 5.7Go
- Added transmit parameters for 431-MHz to 527-MHz band in Section 5.9Go
- Changed ADC reference voltage to correct value in Section 5.11Go
- Added thermal characteristics for RHB and RSM packages in Section 5.18Go
- Changed Standby MCU Current Consumption, 32-kHz Clock, RAM and MCU Retention by extending the temperatureGo
- Changed BOD restriction footnote in Table 6-2—restriction does not apply to die revision B and laterGo
- Added Section 6.10Go
- Changed Figure 8-1Go
Changes from September 30, 2015 to October 28, 2015 (from A Revision () to B Revision)
- Added the RSM and RHB packagesGo
Changes from August 31, 2015 to September 30, 2015 (from * Revision () to A Revision)
- Changed 器件状态,从“产品预览”更改为“量产数据”Go
- Removed the RSM and RHB packagesGo