ZHCSEB0D
September 2015 – July 2018
CC1310
PRODUCTION DATA.
1
器件概述
1.1
特性
1.2
应用
1.3
说明
1.4
功能框图
2
修订历史记录
3
Device Comparison
3.1
Related Products
4
Terminal Configuration and Functions
4.1
Pin Diagram – RSM Package
4.2
Signal Descriptions – RSM Package
4.3
Pin Diagram – RHB Package
4.4
Signal Descriptions – RHB Package
4.5
Pin Diagram – RGZ Package
4.6
Signal Descriptions – RGZ Package
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Power Consumption Summary
5.5
RF Characteristics
5.6
Receive (RX) Parameters, 861 MHz to 1054 MHz
5.7
Receive (RX) Parameters, 431 MHz to 527 MHz
5.8
Transmit (TX) Parameters, 861 MHz to 1054 MHz
5.9
Transmit (TX) Parameters, 431 MHz to 527 MHz
5.10
PLL Parameters
5.11
ADC Characteristics
5.12
Temperature Sensor
5.13
Battery Monitor
5.14
Continuous Time Comparator
5.15
Low-Power Clocked Comparator
5.16
Programmable Current Source
5.17
DC Characteristics
5.18
Thermal Characteristics
5.19
Timing and Switching Characteristics
5.19.1
Reset Timing
Table 5-1
Reset Timing
5.19.2
Wakeup Timing
Table 5-2
Wakeup Timing
5.19.3
Clock Specifications
Table 5-3
24-MHz Crystal Oscillator (XOSC_HF)
Table 5-4
32.768-kHz Crystal Oscillator (XOSC_LF)
Table 5-5
48-MHz RC Oscillator (RCOSC_HF)
Table 5-6
32-kHz RC Oscillator (RCOSC_LF)
5.19.4
Flash Memory Characteristics
Table 5-7
Flash Memory Characteristics
5.19.5
Synchronous Serial Interface (SSI) Characteristics
Table 5-8
Synchronous Serial Interface (SSI) Characteristics
5.20
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Main CPU
6.3
RF Core
6.4
Sensor Controller
6.5
Memory
6.6
Debug
6.7
Power Management
6.8
Clock Systems
6.9
General Peripherals and Modules
6.10
Voltage Supply Domains
6.11
System Architecture
7
Application, Implementation, and Layout
7.1
Application Information
7.2
TI Design or Reference Design
8
器件和文档支持
8.1
器件命名规则
8.2
工具和软件
8.3
文档支持
8.4
德州仪器 (TI) 低功耗射频网站
8.5
其他信息
8.6
社区资源
8.7
商标
8.8
静电放电警告
8.9
出口管制提示
8.10
术语表
9
机械、封装和可订购信息
9.1
封装信息
5.20
Typical Characteristics
Figure 5-4
Active Mode (MCU) Current Consumption vs
Supply Voltage (VDDS)
Figure 5-6
SoC ADC, Integral Nonlinearity vs
Digital Output Code
Figure 5-8
SoC ADC Output vs Supply Voltage
(Fixed Input, Internal Reference, No Scaling)
Figure 5-10
RX, (50-kbps) Packet Error Rate (PER) vs
Input RF Level vs Frequency Offset, 868 MHz
Figure 5-12
RX (50-kbps) Selectivity 868 MHz
Figure 5-14
RX (50-kbps) Current Consumption vs
Temperature 868 MHz
Figure 5-16
RX (50-kbps) Sensitivity vs Temperature 915 MHz
Figure 5-18
RX (50-kbps) Sensitivity vs Supply Voltage 868 MHz
Figure 5-20
TX Maximum Output vs Temperature 868 MHz
Figure 5-22
TX Current Consumption Maximum Output Power vs
Supply Voltage 868 MHz
Figure 5-24
TX 10-dBm Output Power
vs
Supply Voltage 868 MHz
Figure 5-5
Standby MCU Current Consumption, 32-kHz Clock, RAM and MCU Retention
Figure 5-7
SoC ADC, Differential Nonlinearity vs
Digital Output Code
Figure 5-9
SoC ADC Output vs Temperature
(Fixed Input, Internal Reference, No Scaling)
Figure 5-11
RX (50-kbps) Sensitivity vs Frequency
Figure 5-13
RX (50-kbps) Selectivity 915 MHz
Figure 5-15
RX (50-kbps) Sensitivity vs Temperature 868 MHz
Figure 5-17
RX (50-kbps) Current Consumption vs
Supply Voltage 915 MHz
DCDC On, 3.6 V
Figure 5-19
TX Current Consumption With Maximum
Output Power vs Temperature 868 MHz
Figure 5-21
TX 10-dBm Output Power vs Temperature 868 MHz
Figure 5-23
TX Maximum Output Power
vs
Supply Voltage 915 MHz
SPACER