SWRU372C June   2014  – March 2020 CC3200

 

  1.   CC3200 SimpleLink™ Wi-Fi® and Internet of Things Solution With MCU LaunchPad™ Hardware
    1. 1 Introduction
      1. 1.1 CC3200 LaunchPad Development Kit
      2. 1.2 Key Features
      3. 1.3 What's Included
        1. 1.3.1 Kit Contents
      4. 1.4 FCC/IC Regulatory Compliance
      5.      Trademarks
    2. 2 Hardware Description
      1. 2.1 Block Diagram
      2. 2.2 Hardware Features
      3. 2.3 Connecting a BoosterPack Plug-in Module
      4. 2.4 Jumpers, Switches, and LEDs
        1. 2.4.1 JTAG Headers
        2. 2.4.2 I2C Connections
          1. 2.4.2.1 Jumper Settings
          2. 2.4.2.2 Default I2C Address
        3. 2.4.3 Power Connections
        4. 2.4.4 UART Signals
        5. 2.4.5 Sense on Power
        6. 2.4.6 Other Miscellaneous
        7. 2.4.7 Push Buttons and LEDs
        8. 2.4.8 2x20 Pin Connector Assignment
      5. 2.5 Power
        1. 2.5.1 USB Power
        2. 2.5.2 Battery Power (2 × 1.5 V)
        3. 2.5.3 BoosterPack Module Power Supply
      6. 2.6 Measure CC3200 Current Draw
        1. 2.6.1 Measuring Low Power (<1 mA)
        2. 2.6.2 Measuring Active Power
      7. 2.7 RF Connections
        1. 2.7.1 Radiated Testing (AP connection)
      8. 2.8 Design Files
        1. 2.8.1 Hardware
        2. 2.8.2 Revision History
        3. 2.8.3 Software
    3. 3 Software Examples
      1. 3.1 Development Environment Requirements
        1. 3.1.1 CCS
        2. 3.1.2 IAR
    4. 4 Additional Resources
      1. 4.1 LaunchPad Kit Wiki
      2. 4.2 Information on the CC3200
      3. 4.3 Download a Development Environment
      4. 4.4 The CC3200 Code Examples
      5. 4.5 CC3200 Application Notes
      6. 4.6 Support Resources
    5. 5 Known Limitations
      1. 5.1 Hardware Limitations
        1. 5.1.1 Floating IO (All Revisions)
        2. 5.1.2 Board Modification for LPDS Mode
        3. 5.1.3 Floating S-Flash Lines (Rev 3.2 and Earlier)
  2.   Revision History

2.8.2 Revision History

Table 10. Change Log

PCB Revision Description
Rev 3.0B
  • First baseline revision
Rev 3.1 The main changes pertain to the bill of materials (BOM) and the layout:
  • Replaced the caps C23, C24 with ceramic ones to minimize leakage current
  • R62 is made to DNP by default so that the jumper is used to measure the hibernate current
  • Miscellaneous silk screen changes to clearly annotate components on the board.
Rev 3.2
  • Layout changes for the DC-DC section to improve the mask margin
  • Updated the silk screen to reflect the final markings.
Rev 4.1
  • Added pullup and pulldowns for the serial flash. (Reduces hibernate current to around 17 uA)
  • Moved the nRESET pull from VCC_BRD to VBAT_CC (ensures always pulled high).
  • Added pullup on UART_TX going to the FTDI to prevent false start bits.
  • Added pullup resistor for acccelerometer address to avoid conflict with audio booster pack
  • Added 100K pullup on RESET_OUT net for any BP without RESET pulls.
  • Changed R61 to 2.7K, R57-> 270 Ω (To solve false entering to bootloader mode)
  • Miscellaneous silk changes