SLUUCC3 february   2021 BQ79631-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4.   General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
  5. 1General Description
    1. 1.1 Key Features
      1. 1.1.1 Key Electrical Parameters
  6. 2Theory of Operation
    1. 2.1 Single Board
    2. 2.2 Stacked Systems
  7. 3Connectors
    1. 3.1 Powering the BQ79631EVM
    2. 3.2 Primary Input and Output Connectors
      1. 3.2.1 Jumper Placements
      2. 3.2.2 Host Interface
      3. 3.2.3 High-Side and Low-Side Communications
    3. 3.3 High Voltage Networks
      1. 3.3.1 High Voltage Safety Considerations
      2. 3.3.2 High Voltage Connections
      3. 3.3.3 High Voltage Alternatives
      4. 3.3.4 Switches
      5. 3.3.5 Buffers
      6. 3.3.6 Insulation Detection Network
    4. 3.4 Current Sense
      1. 3.4.1 SRP/SRN
      2. 3.4.2 VCSamp_Out
    5. 3.5 GPIO Connections
  8. 4Quick Start Guide
    1. 4.1 Launch Pad Connection and Example Code
      1. 4.1.1 Required Devices for Using the Example Code
      2. 4.1.2 Power Connections
      3. 4.1.3 Connecting the EVM to the TMS570 LaunchPad
      4. 4.1.4 Software
    2. 4.2 USB2ANY Connection with GUI
      1. 4.2.1 GUI
      2. 4.2.2 GUI UART Connection
  9. 5Physical Dimensions
    1. 5.1 Board Dimensions
  10. 6BQ79631-Q1 EVM Schematic, Assembly, Layout, and BOM
    1. 6.1 Schematics
    2. 6.2 Layout
    3. 6.3 Bill of Materials

3.2.3 High-Side and Low-Side Communications

There are two sets of 4-position molex connectors available on each BQ79631EVM board. These provide high-side (J27) and low-side (J26) communications between stacked EVM devices.

Table 3-4 Pin Description - J26
Pin Name Comments
1 COML_N COM low-side negative
2 COML_P COM low-side positive
3 N/A Unused
4 N/A Unused
Table 3-5 Pin Description - J27
PinNameComments
1N/AUnused
2N/AUnused
3COMH_PCOM high-side positive
4COMH_NCOM high-side negative

Isolation Options

Capacitor Only

If the user wishes to utilize the cap only method, no extra modifications need to be made to the EVM since this is the default configuration.

Capacitor and Choke

For the cap and choke method to be implemented, the user must de-solder the R144, R145, R155 and R154 resistors so that the L4 and L3 chokes are not bypassed.

Transformer

If the user wanted the daisy chain communications to be handled by the transformer, then de-solder the following resistors: R148, R149, R150, R151, R146, R147, R152, R153. On the underside of the EVM, populate the R122, R123, R127, R129, R120, R121, R124, and R126 slots with 0-Ω resistors and T2 and T3 with transformers. This allows the signal to flow through the underside of the EVM where the transformers (T2 and T3) are located.

GUID-20200717-CA0I-Z8NS-MS84-JV4TJ77T9LCN-low.png Figure 3-1 Resistors to De-solder Topside
GUID-20200717-CA0I-SSQK-6X2W-J7S18T3B3BSC-low.png Figure 3-2 Resistors to De-solder Underside