SLLA683 July 2026 ISO6021 , ISO6041 , ISO6420 , ISO6420-Q1 , ISO6421 , ISO6421-Q1 , ISO6431 , ISO6431-Q1 , ISO6440 , ISO6440-Q1 , ISO6441 , ISO6441-Q1 , ISO6442 , ISO6442-Q1 , ISO6462 , ISO6463
Table 3-4 summarizes the advantages of the 16-DFB, used for 3 and 4 channel devices, and the 20-DFB, used for 6 channel devices, with respect to the traditional 16-DBQ package for 3, 4, and 6 channel devices. The DFB packages provide 4mm of creepage and clearance versus the 3.7mm provided by the 16-DBQ.
| Package | Channel Count | Device ISO Rating | Creepage and Clearance (mm) | % area savings vs Traditional Package (16-DBQ) | Area (mm2) | X (mm) | Y (mm) | Pin Pitch (mm | Z (mm) |
|---|---|---|---|---|---|---|---|---|---|
| (PCB land pattern lead to lead maximum) | (package body size maximum) | (height of package above PCB maximum) | |||||||
| 20-DFB (SSOP) | 6 | Reinforced, Basic | > 4 | -1.5% (1) | 35.5 | 6.9 | 5.15 | 0.5 | 1.75 |
| 16-DBQ (SSOP) (Traditional Package) | 3, 4, 6 | Reinforced, Basic, Galvanic | >3.7 | Traditional (Reference) | 35.0 | 7 | 5 | 0.635 | 1.75 |
| 16-DFB (SSOP) | 3, 4 | Reinforced, Basic | > 4 | 29.7 | 6.9 | 4.3 | 0.5 | 1.75 |